Method for preparing diamond/copper composite material parts with high volume fraction

A technology of high volume fraction and composite materials, which is applied in the field of preparing copper-based composite parts with high volume fraction of diamond particles, can solve the problems of uneven mixing of copper powder and diamond powder, and achieve overcoming machining difficulties and simple production equipment , the effect of reducing production costs

Active Publication Date: 2017-04-26
UNIV OF SCI & TECH BEIJING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The process of the invention is simple, because the double-coated diamond powder with different copper content is prepared, the diamond-copper composite material can be directly prepared without adding copper powder, so it not only solves the problem of copper powder in the proce...

Method used

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  • Method for preparing diamond/copper composite material parts with high volume fraction

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Experimental program
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Effect test

Embodiment 1

[0013] Embodiment 1: the Diamond / Cu composite material part that preparation diamond volume fraction is 70%

[0014] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 12g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 30g, use a powder mixer to mix evenly. The mixed powders were heated to 1000 °C for 3 h in a rapid heating tube electric furnace, during which an Ar atmosphere was introduced for protection. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0015] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 2.288L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4 ·5H 2 ...

Embodiment 2

[0018] Embodiment 2: the Diamond / Cu composite material part that preparation diamond volume fraction is 60%

[0019] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 24g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 40g, use a powder mixer to mix evenly. The mixed powder was heated to 1050 °C for 2 h in a rapid heating tube electric furnace, during which an Ar atmosphere was introduced for protection. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0020]Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 3.560L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4 ·5H 2 O (...

Embodiment 3

[0023] Embodiment 3: the Diamond / Cu composite material part that preparation diamond volume fraction is 50%

[0024] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 36g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 50g, use a powder mixer to mix evenly. The mixed powder was heated to 1100 °C for 1 h in a rapid heating tube electric furnace, and an Ar atmosphere was introduced for protection during this period. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0025] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 5.344L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4...

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Abstract

The invention provides a method for preparing diamond/copper composite material parts with high volume fraction. The method comprises the following steps: plating the surface of diamond with a uniform Mo2C layer by using a salt-bath plating technology to improve wettability of the diamond and copper; and then continuing copperizing the surface of the Mo2C layer by using a chemical plating method, and controlling the thickness of a copperizing layer by controlling the content of Cu2+ in a plating solution so as to prepare copper-containing double-plating-layer Cu-Mo2C-Diamond powder with the volume fraction of 30-50 vol.%. The Cu-Mo2C-Diamond powder is formed by an ultra-high-pressure cold pressing method, and Diamond/Cu composite material parts are prepared by a vacuum pressureless sintering method. The method has the advantages that the Diamond/Cu composite material parts with complicated shapes and high volume fractions of (50-70 vol. %) can be directly prepared, meanwhile, composite materials are uniform in structure and high in compactness, the Diamond/Cu composite material parts can be produced in batches, and the production cost is low.

Description

technical field [0001] The invention belongs to the forming technology of metal-matrix composite material parts, and in particular provides a method for preparing diamond particle-reinforced copper-based (Diamond / Cu) composite material parts with high volume fraction. The preparation of low-cost, high-performance metal matrix composite parts is realized. Background technique [0002] Particle-reinforced copper-based composites are the most studied and widely used composite materials in the field of composite materials. High volume fraction (>50vol%) Diamond / Cu composite material has excellent physical and mechanical properties, excellent dimensional stability, low linear expansion coefficient that can be matched with Si, GaAs and other semiconductor substrates, and is much higher than most The thermal conductivity of most composite materials has become one of the most ideal electronic packaging materials, and has an attractive application background in the fields of avia...

Claims

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Application Information

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IPC IPC(8): B22F5/00B22F3/02B22F3/10C23C18/38
CPCB22F3/02B22F3/1007B22F5/00B22F2999/00C23C18/38B22F2201/20
Inventor 何新波潘彦鹏任淑彬吴茂郑伟曲选辉
Owner UNIV OF SCI & TECH BEIJING
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