A method for preparing diamond/copper composite material combined with injection molding technology

A composite material, injection molding technology, used in metal processing equipment, transportation and packaging, coating and other directions, can solve the problems of diamond/Cu composite material machining difficulties, to overcome machining difficulties, simple production equipment, reduce production cost effect

Active Publication Date: 2019-10-29
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the machining of Diamond / Cu composites with a high volume fraction in the matrix is ​​extremely difficult, which has become a bottleneck for the practical application of this material

Method used

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  • A method for preparing diamond/copper composite material combined with injection molding technology

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1: the Diamond / Cu composite material part that preparation diamond volume fraction is 70%

[0015] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 12g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 30g, use a powder mixer to mix evenly. The mixed powders were heated to 1000 °C for 3 h in a rapid heating tube electric furnace, during which an Ar atmosphere was introduced for protection. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0016] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 0.056L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4 ·5H 2 ...

Embodiment 2

[0019] Embodiment 2: the Diamond / Cu composite material part that preparation diamond volume fraction is 60%

[0020] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 24g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 40g, use a powder mixer to mix evenly. The mixed powder was heated to 1050 °C for 2 h in a rapid heating tube electric furnace, during which an Ar atmosphere was introduced for protection. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0021] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 0.280 L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4 ·5H 2 O...

Embodiment 3

[0024] Embodiment 3: the Diamond / Cu composite material part that preparation diamond volume fraction is 50%

[0025] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 36g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 50g, use a powder mixer to mix evenly. The mixed powder was heated to 1100 °C for 1 h in a rapid heating tube electric furnace, and an Ar atmosphere was introduced for protection during this period. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0026] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 0.592L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4...

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Abstract

A method for preparing diamond / copper composite materials combined with injection molding technology, using salt bath plating technology to coat a layer of uniform Mo on the diamond surface 2 C is used to improve the wettability of diamond and copper, and then the electroless plating method is used to continue on the Mo 2 Copper plating on the surface of layer C, by controlling Cu in the plating solution 2+ content to control the thickness of the copper plating layer, thereby preparing a double-coated Cu-Mo with a copper volume fraction of 1% to 10%. 2 C‑Diamond Powder. Quantitative Cu‑Mo 2 C‑Diamond powder is mixed with a multi-polymer component paraffin-based binder to form a uniform feed. After granulation, it is injection-molded on an injection molding machine. The resulting preform is pre-sintered at a high temperature after solvent and thermal degreasing to obtain The blank is infiltrated into the diamond skeleton through the capillary action of the copper liquid through the vacuum pressureless infiltration technology, so as to obtain a diamond / copper composite material part with a high volume fraction. The invention can directly prepare Diamond / Cu composite parts with complex shapes, has high diamond volume fraction, uniform and compact structure, can be produced in batches, and has low production cost.

Description

technical field [0001] The invention belongs to the forming technology of metal-matrix composite material components, and in particular provides a method for preparing Diamond / Cu (diamond / copper) composite materials combined with injection molding technology. The preparation of low-cost, high-performance metal matrix composite parts is realized. Background technique [0002] Due to its high thermal conductivity, thermal management materials can quickly transfer heat from high-temperature areas to low-temperature areas, achieving the purpose of coordinating the temperature difference between high-power devices and the system environment. At the same time, the thermal expansion coefficient mismatch between the thermal management material and the chip material can be improved through the efficient heat conduction of the thermal management material. Among them, particle-reinforced copper-based composites are the most studied and widely used composite materials in the field of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/22B22F1/02B22F3/10C22C9/00C22C26/00C22C32/00
CPCC22C9/00C22C26/00B22F3/1035B22F3/225C22C2026/006B22F2998/10B22F1/103B22F1/17B22F1/10
Inventor 何新波潘彦鹏任淑彬吴茂曲选辉
Owner UNIV OF SCI & TECH BEIJING
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