Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Alloy plating liquid for modular printed circuit board surface treatment

A printed circuit board and surface treatment technology, which is applied in the secondary treatment of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of low economic benefit and low productivity

Inactive Publication Date: 2004-02-25
SAMSUNG ELECTRO MECHANICS CO LTD +1
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the conventional surface treatment methods for modular PCBs mentioned above have the disadvantages of low economic benefit and low productivity due to the complicated process of exposing the dry film, developing and delaminating the additional steps in the hard gold plating process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Alloy plating liquid for modular printed circuit board surface treatment
  • Alloy plating liquid for modular printed circuit board surface treatment
  • Alloy plating liquid for modular printed circuit board surface treatment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Prepare an aqueous alloy plating solution having the composition shown in Table 1 below, and then activate the electroless nickel-plated modular PCB with 3% hydrochloric acid solution at 25° C. for 1 minute. While adjusting the temperatures of the three plating solution baths to 60°C, 70°C and 80°C, the PCB was immersed in the plating solution for 10 minutes for plating. As such, the plating solution was not stirred and the pH of the plating solution was 4.5.

[0044] Table 1

[0045] Element

content

Methanesulfonic acid

30g / l

sodium cyanide

10g / l

Thiourea

10g / l

Silver nitrate

0.25g / l

Potassium gold cyanide

5g / l

Nitriloacetic acid

3g / l

[0046] After the plating process, the board was washed with water, dried at 80° C. for 15 minutes, and then solderability and wear resistance were measured by the following conditions and methods.

[004...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Sizeaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

Disclosed is an aqueous alloy plating solution for surface treatment of a modular PCB. The plating solution comprises 1-30 wt % of an organic acid having at least one sulfonic acid group (-SO3H), 0.1-20 wt % of a complexing agent, 0.1-15 wt % of a thio-compound having at least one -S-, 0.05-5 wt % of a water soluble gold compound, 0.001-1 wt % of a water soluble silver compound and 0.1-10 wt % of a sequestering agent, based upon the weight of the plating solution. According to this invention, all plating properties required for the modular PCB are obtained through a single plating process, instead of the conventional double plating process.

Description

technical field [0001] The invention relates to a gold-silver alloy plating solution composition, which can be applied to the surface treatment of modular printed circuit boards (hereinafter referred to as modular PCBs) for component installation. More specifically, the present invention relates to a gold-silver alloy plating solution, by electroless nickel plating at the pad portion (pad portion) and the joint portion (tab portion) of the modular PCB, and then the nickel-plated surface of the modular PCB of nickel plating Immersed in a gold-silver alloy plating solution that forms an alloy coating containing 90-99% gold and 1-10% silver. Background technique [0002] In general, a modular PCB has a circuit pattern on a board, a land portion for electronic parts, and a connector portion electrically connected to an external device by a detachment and bonding method. Circuit patterns, land portions, and joint portions are generally made of copper. For this, figure 1 A top ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/09C23C18/16C23C18/48C23C18/52H05K3/18H05K3/24H05K3/40
CPCH05K3/244C23C18/48C23C18/16
Inventor 李炳虎杨德真安东基李哲敏郭兑圭许成龙全星郁申明彻全尚旭
Owner SAMSUNG ELECTRO MECHANICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com