Iron-plated and platinum-plated double-plating-layer bonding copper wire

Abstract

The invention discloses an iron-plated and platinum-plated double-plating-layer bonding copper wire, and relates to the technical field of bonding wires. The iron-plated and platinum-plated double-plating-layer bonding copper wire comprises a copper core material, and the iron plating layer is plated on the surface of the copper core material; and the platinum plating layer is plated on the surface of the iron plating layer. The surface of the copper core material is plated with an iron plating layer after being smelted and roughly stretched; a platinum plating layer is plated on the surface of the iron plating layer after medium stretching; and superfine stretching is performed to obtain the iron-plated and platinum-plated double-plating-layer bonding copper wire. Layer-by-layer stretching and layer-by-layer plating are adopted, the good final plastic deformation capacity is achieved, the iron-platinum double plating is consistent in deformation, uniform in surface, compact and complete in the pressure machining process, particularly, sufficient deformation during welding bonding is facilitated, and the breaking force and reliability are improved. Moreover, the ferromagnetic iron-platinum alloy layer at the joint of the double plating layers can play a role in shielding, so that the noise in the bonding wire is reduced. And meanwhile, the iron-plated platinum alloy layer protects the single crystal copper bonding wire and prevents the single crystal copper bonding wire from oxidation.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to an iron-plated and platinum-plated double-coated bonding copper wire. Background technique [0002] With the development of integrated circuit and semiconductor device packaging technology towards multi-lead, high integration and miniaturization, packaging technology requires the use of thinner bonding wires with better electrical properties for bonding. The electrical and thermal conductivity of traditional gold bonding wires and aluminum bonding wires has reached the limit, and the rising price of gold limits its application. Gold wire and aluminum wire have gradually approached the limit in terms of electrical and thermal conductivity. As an inner lead, copper wire has higher electrical and thermal conductivity than gold wire, and can be used to manufacture power devices that require higher current loads, and can make heat dissipation easier in high-density packaging. ...

AI Technical Summary

Problems solved by technology

However, pollution and oxidation on the surface of copper wires lead to reduced soldering performance, and the oxide film reduces the bonding performance of copper wires