A kind of method for preparing high-performance diamond/copper composite material

Abstract

The invention discloses a method for preparing a high-performance diamond / copper-based composite material. Aiming at the problems of poor wettability of copper and diamond, weak interface bonding, and easy occurrence of graphitization of diamond at high temperature, the invention adopts magnetron sputtering technology to prepare diamond The surface is uniformly plated with a layer of B or strong carbide elements Ti, Zr, Nb, Cr to improve its interface bonding strength, and then a layer of metal copper is sputtered with a thickness of 1-3 μm; Heat treatment at 500-700°C for 5-30min to make the coatings diffuse and react with each other to achieve metallurgical bonding; using selective laser melting (SLM) technology to sinter the copper alloy powder and the surface-modified diamond particles, extremely fast The cooling rate significantly refines the matrix alloy structure and improves the strength of the composite material. The surface modification of the double coating effectively avoids the graphitization of diamond under the high-energy laser beam; Spark plasma sintering (SPS) is used to further improve the density of the workpiece. ; Combined with aging heat treatment, the solid solution atoms are uniformly precipitated in the copper matrix, and the thermal conductivity and mechanical properties of the composite material are comprehensively improved.

Description

technical field

[0001] The invention provides a method for preparing a high-performance diamond / copper composite material, which belongs to the fields of additive manufacturing and metal matrix composite materials. Background technique

[0002] The rapid development of electronic information technology makes it difficult for traditional electronic packaging heat dissipation materials to ensure the safety and reliability of high-power devices such as large-scale integrated circuits and semiconductor lasers. Diamond particle reinforced copper matrix composites have the characteristics of high thermal conductivity and matching thermal expansion coefficient of electronic components, and have received extensive attention in recent years. Due to the non-wetting of copper and diamond, there will be a large interfacial thermal resistance in the direct composite, which reduces the thermophysical and mechanical properties of the composite material. In order to reduce the adverse effe...