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A kind of method for preparing high-performance diamond/copper composite material

A composite material and diamond technology, which is applied in the field of preparing high-performance diamond/copper composite materials, can solve the problems of weak interface bonding, poor wettability, and easy graphitization, so as to promote metallurgical bonding, increase density, and avoid graphitization Effect

Active Publication Date: 2021-10-22
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of poor wettability between copper and diamond, weak interfacial bonding, and graphitization of diamond at high temperature, the present invention provides a method for preparing a high-performance diamond / copper composite material, which uses magnetron sputtering technology to uniformly coat the diamond surface A layer of B or strong carbide elements Ti, Zr, Nb, Cr to improve its interfacial bonding strength, and then sputter a layer of metallic copper with a thickness of 1-3μm. The double coating effectively avoids the graphitization of subsequent high-energy laser irradiation of diamond ; Then heat-treat the surface-modified diamond particles at 500-700°C for 5-30 minutes to make the coatings diffuse and react with each other to achieve metallurgical bonding; use SLM technology to form copper alloy powder and surface-modified diamond particles , the extremely fast cooling rate significantly refines the matrix alloy structure, which greatly improves the bonding strength between the copper matrix and the diamond reinforcement; SPS treatment is performed on the selected laser melting forming parts to further increase the density of the parts; combined with aging heat treatment, the solid solution Atoms are uniformly precipitated in the copper matrix to achieve a comprehensive improvement in the thermal conductivity and mechanical properties of the composite material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment one: (substrate is Cu-Cr-Nb, plated Cr and Cu)

[0033] (1) Diamond surface modification

[0034] Use alcohol to ultrasonically clean the diamond for 10 minutes, then use an ion beam magnetron sputtering multifunctional vacuum coating machine to coat Cr on the surface of diamond powder with a particle size of 20 μm-53 μm, and then perform magnetron sputtering Cu plating. The background vacuum of the equipment is 5 ×10 -4 Pa, the working pressure is 1Pa, the working gas is high-purity argon, and the sputtered powder is reduced in an atmosphere tube furnace with a mixed gas with a hydrogen content of 3% and the balance of argon at 150°C for 2 hours;

[0035] (2) The diamond particles obtained after surface modification were heat treated in a vacuum environment for 25 minutes, and the heat treatment temperature was 500 °C;

[0036] (3) Additive manufacturing by SLM

[0037] Fully mix the surface-modified diamond powder with Cu-Cr-Nb alloy powder, the diamond ...

Embodiment 2

[0046] (1) Diamond surface modification (substrate is Cu-Cr, plated with Zr and Cu)

[0047] Use alcohol to ultrasonically clean the diamond for 10 minutes, and use an ion beam magnetron sputtering multifunctional vacuum coating machine to coat Zr on the surface of diamond powder with a particle size of 20 μm-53 μm, and then perform magnetron sputtering Cu plating. The background vacuum of the equipment is 5 ×10 -4 Pa, the working pressure is 0.8Pa, the working gas is high-purity argon, and the sputtered powder is reduced in an atmosphere tube furnace with a hydrogen content of 3% and the balance of argon at 100°C for 2.5 hours;

[0048] (2) The diamond particles obtained after surface modification were heat treated in a vacuum environment for 20 minutes, and the heat treatment temperature was 550 ° C;

[0049] (3) Additive manufacturing by SLM

[0050] Fully mix the surface-modified diamond powder with Cu-Cr alloy powder, the diamond volume fraction accounts for 50%, use th...

Embodiment 3

[0059] (1) Diamond surface modification (substrate is Cu-Ti, plated with Ti and Cu)

[0060] Use alcohol to ultrasonically clean the diamond for 10 minutes, and then use an ion beam magnetron sputtering multifunctional vacuum coating machine to coat Ti on the surface of diamond powder with a particle size of 20 μm-53 μm, and then perform magnetron sputtering Cu plating. The background vacuum of the equipment is 5 ×10 -4 Pa, the working pressure is 0.8Pa, the working gas is high-purity argon, and the sputtered powder is reduced in an atmosphere tube furnace at 200°C for 2 hours with a mixture of 3% hydrogen and argon as the balance;

[0061] (2) The diamond particles obtained after surface modification were heat treated in a vacuum environment for 20 minutes, and the heat treatment temperature was 550 ° C;

[0062] (3) Additive manufacturing by SLM

[0063] Fully mix the surface-modified diamond powder and Cu-Ti alloy powder, the diamond volume fraction accounts for 45%, use ...

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Abstract

The invention discloses a method for preparing a high-performance diamond / copper-based composite material. Aiming at the problems of poor wettability of copper and diamond, weak interface bonding, and easy occurrence of graphitization of diamond at high temperature, the invention adopts magnetron sputtering technology to prepare diamond The surface is uniformly plated with a layer of B or strong carbide elements Ti, Zr, Nb, Cr to improve its interface bonding strength, and then a layer of metal copper is sputtered with a thickness of 1-3 μm; Heat treatment at 500-700°C for 5-30min to make the coatings diffuse and react with each other to achieve metallurgical bonding; using selective laser melting (SLM) technology to sinter the copper alloy powder and the surface-modified diamond particles, extremely fast The cooling rate significantly refines the matrix alloy structure and improves the strength of the composite material. The surface modification of the double coating effectively avoids the graphitization of diamond under the high-energy laser beam; Spark plasma sintering (SPS) is used to further improve the density of the workpiece. ; Combined with aging heat treatment, the solid solution atoms are uniformly precipitated in the copper matrix, and the thermal conductivity and mechanical properties of the composite material are comprehensively improved.

Description

technical field [0001] The invention provides a method for preparing a high-performance diamond / copper composite material, which belongs to the fields of additive manufacturing and metal matrix composite materials. Background technique [0002] The rapid development of electronic information technology makes it difficult for traditional electronic packaging heat dissipation materials to ensure the safety and reliability of high-power devices such as large-scale integrated circuits and semiconductor lasers. Diamond particle reinforced copper matrix composites have the characteristics of high thermal conductivity and matching thermal expansion coefficient of electronic components, and have received extensive attention in recent years. Due to the non-wetting of copper and diamond, there will be a large interfacial thermal resistance in the direct composite, which reduces the thermophysical and mechanical properties of the composite material. In order to reduce the adverse effe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02B22F3/105B22F3/24B33Y10/00B33Y70/10B33Y40/20C22C26/00C22C9/00C22C1/05C23C14/18C23C14/16C23C14/35C23C14/46C23C14/58
CPCB22F3/105B22F3/24B33Y70/10B33Y10/00B33Y40/20C22C26/00C22C9/00C22C1/05C23C14/185C23C14/165C23C14/35C23C14/46C23C14/5806C23C14/5846B22F2003/1051B22F2003/248B22F1/17Y02P10/25
Inventor 刘祖铭任亚科吕学谦魏冰周旭农必重卢思哲
Owner CENT SOUTH UNIV
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