A method for preparing diamond/copper composite materials combined with 3D printing technology

Abstract

A method for preparing a diamond / copper composite material combined with 3D printing technology belongs to the field of diamond composite materials. The present invention adopts the salt bath coating technology to coat a layer of uniform Cr on the diamond surface. 7 C 3 Used to improve the wettability of diamond and copper, and then use the electroless plating method to continue on the Cr 7 C 3 Copper plating on the surface of the layer, by controlling the Cu in the plating solution 2+ content to control the thickness of the copper plating layer, thereby preparing a double-coated Cu-Cr 7 C 3 ‑Diamond powder. 3D printing technology is used to laser clad the double-coated diamond powder, and the copper-coated layer on the surface of the diamond particles is melted and bonded to each other to form a porous preform skeleton with a specific shape, and then put into the open-flap graphite mold to infiltrate copper through pressureless Liquid preparation of diamond / copper composite parts with complex shapes. This process can prepare composite materials with uniform structure and high density, and can also directly prepare diamond / copper composite parts with complex shapes, which solves the difficulty that diamond / copper composite materials are difficult to machine, and can be customized according to demand. .

Description

technical field [0001] The invention belongs to the forming technology of metal matrix composite material parts, and in particular provides a method for preparing Diamond / Cu (diamond / copper) composite material parts with complex shapes in combination with 3D printing technology. The preparation of customized, high-performance metal matrix composite parts has been realized. Background technique [0002] Diamond / Cu composite material is made of copper with good thermal conductivity and diamond with low thermal expansion coefficient and high thermal conductivity. Generally, the density of Diamond / Cu composite material is only 5.9g / cm 3 , while the thermal conductivity can reach 500W·m -1 ·K -1 At the same time, the thermal conductivity and thermal expansion coefficient of the composite material can be adjusted by controlling the volume fraction of the diamond reinforcement, so it is an ideal electronic packaging material. With the continuous deepening of the research on Diam...

AI Technical Summary

Problems solved by technology

Since this method uses powder metallurgy molding technology to prepare diamond preforms, the density of the preforms is not uniform, and the complexity of the shape of the parts is also greatly limited.

At the same time, due to the lack of moisture between the diamond and Cu, it is difficult to achieve complete penetration even with various forms of pressurized infiltration techniques, often leaving a certain amount of pores, and even if the preform is degreased, there will still be a forming agent remaining in the diamond. The surface reduces the performance of the material, which is a fatal weakness for electronic packaging materials

In addition, the machining of Diamond / Cu composites with a high volume fraction in the matrix is ​​extremely difficult, which has also become a bottleneck for the practical application of this material.

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