96results about How to "Good bridging" patented technology

The invention relates to the technical field of resin composition preparation and particularly relates to a 3D printing polymer material with special beautifying effects and a preparing method thereof. The polymer material comprises following raw materials by weight: 60-90 parts of matrix resin, 4.0-10 parts of a compatilizer, 0-30 parts of an inorganic filler, 0.3-2.0 parts of white oil, 0.4-0.6 part of an antioxidant, 0.5-1.0 part of a processing auxiliary agent and 1.0-5 parts of a toner. The polymer material is good in dimension stability, good in bridging effect and excellent in draping performance. The appearance of the polymer material is strong in metallic tactile sensation and pearl effects. The polymer material has one or a plurality of effects selected from heat discoloration, photochromic effects, effects of color changing when sensing water, and the like, and is of great significance for promoting material diversification and functionalization of 3D printing. The preparing method is simple, improves shearing and dispersion for the inorganic filler and the toner to the utmost, and improves properties of the polymer material.

The invention provides a preparation method of a high-heat-conduction flexible graphene film. Oxidized graphene powder is frozen, dried and dispersed in a solvent, and an oxidized graphene dispersion liquid with the concentration being 0.1-10 mg/ml is obtained; the oxidized graphene dispersion liquid is added to a spraying device and sprayed on a substrate, the substrate is heated at the temperature of 50-150 DEG C for 0.5-5 h, and the oxidized graphene film is formed on the substrate after the dispersion liquid is evaporated; the oxidized graphene film is peeled off and rolled; hot-pressing carbonization and high-temperature graphitization are performed under the protection of a protective atmosphere, and the heat-conduction graphene film is obtained. With the adoption of the method, the high-heat-conduction flexible graphene film with the size and the thickness being controllable can be effectively prepared to meet requirements of different heat dissipation devices and can be applied to various wearable equipment, smart phones, smart televisions and LEDs on a large scale to improve the heat dissipation effect.

The invention relates to polyving alcohol composite hydrogel and a preparation method thereof. The polyving alcohol composite hydrogel is prepared from the following raw materials in parts by weight through cross-linking solidifying compounding of boric acid solution containing solidifier: 30 to 90 parts of polyving alcohol, 0.1 to 50 parts of sodium alginate, 0.1 to 20 parts of inorganic nanoparticles, 1 to 20 parts of elastomer material, 0.5 to 5 parts of coupling agent and 200 to 2000 parts of water, wherein the degree of polymerization of polyving alcohol is 400 to 3000, and the alcoholysis degree is 75 to 99 percent. The polarity elastomer material and the inorganic nanoparitcles which are processed through the coupling agent are compounded with the polyving alcohol, the mechanical strength and flexibility of the polyving alcohol hydrogel can be improved through the toughening effect of the elastomer material and the synergistic effect of the inorganic nanoparticles, so that the service life is prolonged, and the requirement of the real application on the mechanical performance can be met; the preparation method of the polyving alcohol composite hydrogel is simple in process, easy to operate and applicable to the mass production.

The invention discloses a thick plate ultra-narrow gap laser wire-filling welding method. Main light beams are divided into a cleaning light beam, a deep penetration light beam and a wire-filling light beam. A laser cleaning technology is applied to cleaning of a thick plate ultra-narrow gap groove and compounded with a laser deep penetration wire-filling welding technology, and the problem that it is difficult to effectively clean the deep and narrow groove by means of an existing method is solved. The laser deep penetration welding and the laser wire-filling welding are effectively combined,and the thick plate ultra-narrow gap laser wire-filling welding method has the advantages of a large penetration depth, good bridging ability and expandable thickness and the like. Welding stabilityis improved, laser cleaning and laser welding are performed simultaneously, welding quality can be greatly improved, and the connector quality is guaranteed. The invention further provides a welding device adopting the method, the laser cleaning and the laser welding are performed simultaneously, and welding efficiency is improved.

A micromechanical structure includes: a substrate; a seismic mass movable relative to the substrate along a first direction parallel to a main plane of extension of the substrate; a first electrode structure is connected to the substrate; and a second electrode structure connected to the substrate. The seismic mass includes a counterelectrode structure having finger electrodes situated between first finger electrodes of the first electrode structure and second finger electrodes of the second electrode structure, along the first direction. The first electrode structure is fastened to the substrate by a first anchoring element in a central region of the micromechanical structure, and the second electrode structure is anchored to the substrate by a second anchoring element situated in the central region.

A data transmission bridge device for transmitting data that adheres to USB specification for transmitting data and includes: a first connecting interface, a second connecting interface, and a control chip. The first connecting interface is used for connecting a first host device, and the second connecting interface is used for connecting a second host device or a slave device. The control chip connects the first connecting interface and the second connecting interface, and further includes two transmission paths. The control chip detects which device is connecting to the second connecting interface, and switch to select one of the two transmission paths for transmitting data between the first connecting interface and the second connecting interface. Therefore, the present invention can achieve the purpose that the host device can bridge and transmit data with any other device conveniently.

The invention discloses a data transmission bridging device as well as a control chip and a method thereof. The device transmits data by adopting a standard of a universal serial bus and comprises a first connecting interface, a second connecting interface and a control chip, wherein the first connecting interface is used for being connected with a first host machine terminal device, and the second connecting interface is used for being connected with a second host machine terminal device or a subordinate terminal device; and moreover, the control chip is connected with the first connecting interface and the second connecting interface, further comprises two transmission paths for detecting the device connected with the second connecting interface and transmits the data between the first connecting interface and the second connecting interface by switching and selecting one of the two transmission paths so as to achieve the aim of being convenient for the host machine terminal devices and other devices to bridge and transmits the data.

The invention discloses modified steel slag cement, and belongs to the technical field of building materials. A preparation method of the modified steel slag cement comprises the following steps: pulverizing and sieving steel slag to obtain steel slag powder; stirring the steel slag powder and sulfuric acid for reacting, performing cyclic freezing and unfreezing, and performing filtering and drying to obtain pretreated steel slag powder; performing ball milling, stirring and mixing on potassium permanganate and the pretreated steel slag powder, and performing high-temperature calcination to obtain calcined steel slag powder; performing ball milling, stirring and mixing on calcium carbonate, aluminum powder and the calcined steel slag powder, and performing combustion reaction to obtain modified steel slag powder; and adding cement, the modified steel slag powder, modified bagasse, a silane coupling agent and water to a mixer, and performing stirring and mixing to obtain the modified steel slag cement. The modified steel slag cement provided by the invention has excellent early strength, mechanical strength and stability.

The invention discloses a conductive super high ductility cement-based composite material and a preparation method thereof. The cement-based composite material is prepared from, by weight, 40-45 partsof cement, 15-20 parts of a fly ash, 10-15 parts of quartz sand, 3-5 parts of nano-conductive carbon powder, polyethylene fiber with a volume fraction of1.5%-2% and a carbon fiber with a volume fraction of 0.5%-1%. The preparation method comprises the steps of 1) weighing each raw material according to a ratio; 2) dry-mixing the cement, the fly ash, the quartz sand and the nano-conductive carbonpowder, and adding water for wet-stirring to form cement matrix; 3) adding the carbon fiber and the polyethylene fiber to the cement matrix, uniformly stirring, and obtaining the conductive super highductility cement-based composite material after injection molding and mold release curing. The cement-based composite material has both high electrical conductivity and crack control capability, andis suitable for snowmelt de-icing on road surfaces.

The invention discloses laser double-consumable-electrode single-arc bypass-coupling hybrid welding system and method. A main wire is used to initiate an arc, a slave wire is not arced, laser is utilized to provide a heat source, and hybrid welding is conducted. The method provided by the invention not only can overcome the defects of respective independent welding of two welding methods, namely laser welding and arc welding, but also can fully exert the respective advantages of two heat sources. The deposition efficiency of welding wires is greatly increased, high-efficiency welding is realized, a very stable welding process is realized, the heat input quantity of parent metal is controlled, the possibility of welding defects is reduced, and good welding quality can be favorably obtained.

The invention provides a carbon fiber sizing agent which is a copolymer emulsion of maleic anhydride and long-chain olefins and/or long-chain alkynes. The carbon fiber sizing agent has good adhesion properties, greatly shortens the impregnation time and plays a good bridging role between a carbon fiber and a polypropylene matrix, so as to further improve the mechanical properties of a composite material. The carbon fiber is pretreated by the carbon fiber sizing agent, and the prepared carbon fiber reinforced polypropylene composite material has excellent mechanical properties.

A mobile crusher (2) is provided that can be displaced on four caterpillars and that includes a supporting frame (20), a large hopper (31), an apron conveyor (32), a sizer (34) and an intermediate conveyor (36) for use in strip-mining. The material is received by the shovel (1) of a shovel excavator or a wheel loader, is fed to the crusher (2), crushed and is then transferred onto a conveyor plant via a discharge conveyor system. The crusher (2) has to follow at the same cycle in which the shovel excavator moves forward during an advance in mining. In order to obtain a good maneuverability of the crusher (2), the two front caterpillars (22) are driven and can be steered like a two-caterpillar chassis. As the crusher (2) is subject to high loads, all components have to have a robust design. For this purpose, the individual functional groups are accommodated in a stable supporting frame (20). The crushed material is transferred onto a subsequent bench conveyor via an evolving conveyor directly connected to the mobile crusher (2), a transfer conveyor or a mobile bridge. The plant can be displaced while under full useful load.

The invention provides a high-voltage flip-chip LED chip structure and a manufacturing method thereof, comprising: a growth substrate deposited with a GaN epitaxial layer; ion implantation to form a plurality of isolation regions, so that the GaN epitaxial layer forms a plurality of mutually independent chips unit, then perform mesa step etching to form a metal reflective layer; form a barrier layer; form a first insulating layer; form an interconnect metal layer; form a second insulating layer; The high-voltage flip-chip LED chip of the present invention forms a plurality of isolation regions by ion implantation in the GaN epitaxial layer, which can greatly reduce the loss of the light-emitting diode light-emitting area caused by etching, and the isolation regions formed by ion implantation can make the chip The bridge between chips can be more gentle and easier to bridge between chips; in addition, the height difference between the chip isolation area and other areas is small, the N and P electrode pads are not easy to conduct, the insulation effect is good, and the chip packaging yield is high. It reduces the difficulty of the packaging process and is more compatible with the packaging bracket.

The invention discloses an emulsified asphalt cold paving material and belongs to the technical field of road engineering. The emulsified asphalt cold paving material is made by stirring and mixing linseed oil with a gelatin liquid according to a volume ratio of (1:20)-(1:30); further stirring and mixing with a sodium sulfate solution which is 5-8 times the volume of the gelatin liquid; cooling; further adding a formaldehyde solution which is 1-2 times the volume of the linseed oil; adjusting the pH value; leaving to stand to cure, filtering, and drying so as to obtain modified microcapsules;crushing steel slag, and screening so as to obtain steel slag powder; performing a stirring reaction on the steel slag powder with hydrochloric acid in a mass ratio of (1:30)-(1:50), filtering, and drying so as to obtain modified steel slag powder; by stirring and mixing asphalt, an emulsifier, aggregate, coated sodium peroxide, carbomer, the modified capsules, the modified steel slag powder and water, thereby obtaining the emulsified asphalt cold paving material. The emulsified asphalt cold paving material disclosed by the technical scheme of the invention has the characteristics of excellentmechanical properties, water resistance and flowability.

The invention relates to a semiconductor structure and a formation method thereof. The method comprises steps that a substrate and separate fins on the substrate are provided; an isolation structure partially covering side walls of the fin portions is formed on the substrate; after forming the isolation structure, the pseudo gate structure crossing the fin portions and covering a part of top portions of the fin portions and side wall surfaces is formed; sidewalls are formed on the side walls of the pseudo gate structure; after forming the sidewalls, grooves are formed in the fins on both sidesof the pseudo gate structure; a doped epitaxial layer is formed in the grooves; after forming the doped epitaxial layer, an interlayer dielectric layer is formed on the isolation structure not covered by the pseudo gate structure, and the top portion of the pseudo gate structure is not covered by the interlayer dielectric layer; the pseudo gate structure is removed, and an opening is formed in the interlayer dielectric layer; a barrier layer is formed at the bottom of the opening; the barrier layer in the opening is removed; after removing the barrier layer, a metal layer is used for fillingthe opening to form the metal gate structure. The method is advantaged in that through the barrier layer, the doped epitaxial layer and the meal layer are isolated, and thereby the probability of bridging the metal gate structure and the doped epitaxial layer is reduced.

The invention discloses modified waste clay brick powder cement mortar, and belongs to the technical field of building materials. The modified waste clay brick powder cement mortar is prepared by thefollowing steps: mixing waste brick powder with a sodium silicate solution by stirring to obtain a mixed solution; dropwise adding hydrochloric acid into the obtained mixed solution to adjustthe pH inorder to obtain primary acidizing fluid; continually dropwise adding hydrochloric acid into the obtained acidizing fluid to adjust the pH in order to obtain secondary acidizing fluid; refrigerating the obtained secondary acidizing fluid, smashing and sieving to obtain a smashed material; unfreezing the obtained smashed material by heating, and carrying out a refrigerating cycle to obtain mixed slurry; heating and stirring the obtained mixed slurry for reacting, and filtering to obtain modified refined waste brick powder; mixing cement, fine aggregate, the modified refined waste brick powder,fly ash, silica fume, slag, water, a silane coupling agent and a water-reducing agent by stirring to obtain the modified waste clay brick powder cement mortar. The modified waste clay brick powder cement mortar provided by the invention has high compressive and flexural strength.

The invention relates to a magnetic polyacrylamide cationic flocculant with a super-high molecular weight and a method for preparing the magnetic polyacrylamide cationic flocculant with the super-high molecular weight. The magnetic cationic flocculant with viscosity-average molecular weight being more than 1*10<7> is prepared by initiating copolymerization of a collagen combined with a magnetic fluid Fe3O4 and acrylamide and cationic monomer under the initiation of a composite initiator. The magnetic polyacrylamide cationic flocculant with the super-high molecular weight and the method for preparing the magnetic polyacrylamide cationic flocculant with the super high molecular weight have the advantages that the magnetic polyacrylamide cationic flocculant with the super-high molecular weight is prepared by initiating monomer copolymerization through the composite redox initiator; the flocculant is given with magnetism, and the solid-liquid separation effect of flocculation treatment is enhanced by using the magnetic action; and the magnetic polyacrylamide cationic flocculant with the super-high molecular weight has good properties of charge neutralization, bridging, sweeping and the like.

The invention discloses a wafer-level chip structure, a multi-chip stacking interconnection structure and a preparation method. The wafer-level chip structure comprises a through silicon vias which are located at a preset distance from a first surface to a second surface of a wafer. The first surface of the wafer comprises an active region, a plurality of redistribution line layers and bumps; andthe second surface of the wafer comprises under-bump metallization layers and a concave insulating medium layer, wherein the number of concave structures of the concave insulating medium layer is samewith the number of the through silicon vias, the bottom of the concave insulating medium layer is separated by the bottoms of the through silicon vias, and the under-bump metallization layers fill the concave insulating medium layer and are electrically connected with the through silicon vias. The wafer-level chip structure provided by the embodiment of the invention is not sensitive to the uniformity of the depth in the TSV blind hole etching chip, and the impact on the active region from the ultrahigh selection ratio Si/SiOx dry etching and copper atom diffusion in the prior art is avoided.

The invention discloses a method for preparing a special refractory castable for kilns, and belongs to the technical field of refractory materials. The method comprises the following steps: placing analuminum nitrate solution in a three-necked flask, placing the three-necked flask in a digital display speed measuring constant-temperature magnetic stirrer, dropwise adding a urea solution into thethree-necked flask by using a dropping funnel, heating and stirring the obtained solution after the dropwise addition of the urea solution is finished, adding a Carbomer solution into the three-neckedflask, and heating and stirring the obtained solution to obtain a mixed slurry; placing activated steel slag, cement, a polyvinyl alcohol solution, a chitosan solution, phospholipids, a water reducer, a silane coupling agent and water in mixer, and performing stirring and mixing to obtain a mixed paste; and adding the mixed slurry into the mixer, and performing stirring and mixing to obtain the special refractory castable for kilns. The special refractory castable for kilns has excellent thermal shock resistance.

The invention provides sizing carbon fiber cloth reinforced flame-retardant epoxy resin and a preparation method thereof. The preparation method comprises the following steps: reacting lignin, melamine and amino trimethylene phosphonic acid to obtain a lignin-based intumescent flame retardant; reacting the flame retardant with epoxy resin to prepare flame-retardant epoxy resin; reacting epoxy resin with ozonized lignin to obtain lignin-based epoxy resin, adding alcohol amine, carboxylic acid and a silane coupling agent to obtain a sizing agent, soaking carbon fiber cloth in a sizing agent aqueous solution, pulling out the carbon fiber cloth, and drying the carbon fiber cloth to obtain sized carbon fiber cloth; and obtaining the sizing carbon fiber cloth reinforced flame-retardant epoxy resin composite material by using a vacuum auxiliary forming device. According to the flame retardant and the sizing agent, the sizing carbon fiber cloth reinforced flame-retardant epoxy resin composite material has good flame retardance, bonding property and mechanical property. The flame retardant and the sizing agent synthesized from lignin are low in cost and environmentally friendly, and the prepared sizing carbon fiber cloth reinforced flame-retardant epoxy resin composite material is excellent in comprehensive performance.

The invention discloses a wafer-level chip structure, a multi-chip stacking interconnection structure and a preparation method. The wafer-level chip structure comprises through silicon vias penetrating through a wafer; a first surface of the wafer comprises an active region, a plurality of redistribution line layers and bumps; and a second surface of the wafer comprises an insulating dielectric layer and frustum transition structures connected with the through silicon vias. According to the embodiment of the invention, the frustum-shaped impedance transition structures are introduced between TSV exposed areas on the back surface of the wafer and the UBM to make impedance matching between the TSV and the UBM realized, so that the problem of signal distortion caused by sudden change of impedance is solved; and compared with a traditional scheme, in order to achieve the frustum-shaped transition structures of the scheme, the number of photomasks is not increased, only one photoetching process and one reactive ion etching process are added on the basis of the original process, so that the process flow is not complex.

The present invention provides for a simultaneous graphical representation, a risk of bleeding and a risk of thrombosis providing a visualized bridge therapy process. Furthermore, the present invention provides for a computer-based prediction of the haemostatic situation of the examined blood circulation by using a combination of a biochemical model and a pharmacokinetic model for calculation or another mathematical representation of the blood circulation.