Sealing-in method for packaging outer shell with aluminum silicon carbide

Abstract

The invention pertains to the field of metallic material and provides a method for sealing a sealed cover when SiCp / Al composite material is used as an encapsulation encloser and a cover plate. The method is applicable to the encapsulation enclosers of micro-electronics appliances such as a hybrid integrated circuit, a millimeter wave / micron wave integrated circuit and a multichip module in micro-electronics encapsulation. Double-layer plating is carried out on the surface of the SiCp / Al composite material; the SiCp / Al composite material encloser with a surface coating and the cover plate arewelded together by Sn based solder. The method not only reduces production cost greatly, but also solves the problem of difficulty in sealing and connection of the SiCp / Al composite material, thus paving the way for widely using the SiCp / Al composite material as the material of enclosers and cover plates by related metal encloser factories.

Description

technical field The invention belongs to the field of metal materials and provides an aluminum silicon carbide composite material (SiC p / Al) is used as a hermetic capping method when encapsulating the casing and cover. It is suitable for packaging shells of microelectronic devices such as hybrid integrated circuits, millimeter wave / micron wave integrated circuits, and multi-chip components in microelectronic packaging. Background technique Metal packaging is a form of electronic packaging that uses metal as the shell or base, the chip is directly or through the substrate mounted on the shell or base, and the lead wire passes through the metal shell or base, mostly using glass-metal sealing technology. It is widely used in the packaging of hybrid circuits, mainly military and customized special hermetic packaging, and has been widely used in many fields, especially in military and aerospace fields. Although the traditional packaging shell material Kovar has a suitable CTE,...

AI Technical Summary

Problems solved by technology

The purpose of the invention is to replace the traditional Au-Sn alloy with Sn-Ag-Ni solder, while solving the problem of SiC p / Al composite materials are difficult to seal, and SiC is widely used for metal shell factories p / Al composites pave the way as shell and cover materials

Images