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Sealing-in method for packaging outer shell with aluminum silicon carbide

A silicon carbide sealing and shell technology, applied in welding equipment, electrical components, circuits, etc., can solve problems such as difficult sealing

Inactive Publication Date: 2008-10-29
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the invention is to replace the traditional Au-Sn alloy with Sn-Ag-Ni solder, while solving the problem of SiC p / Al composite materials are difficult to seal, and SiC is widely used for metal shell factories p / Al composites pave the way as shell and cover materials

Method used

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  • Sealing-in method for packaging outer shell with aluminum silicon carbide
  • Sealing-in method for packaging outer shell with aluminum silicon carbide
  • Sealing-in method for packaging outer shell with aluminum silicon carbide

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Embodiment Construction

[0024] Below, the present invention will be further described with examples.

[0025] (1) In SiC p The specific process flow of electroless plating Ni(P) / Ni(B) on the surface of / Al composite material can be shown in the following table:

[0026] Mechanical polishing→chemical degreasing→deionized water washing→acid etching→deionized water washing→sensitization→deionized water washing→activation→deionized water washing→electroless Ni(P)→electroless Ni(B).

[0027] Wherein the solution formula of each step and process condition are as shown in table 1 to table 5, after successfully electroless plating Ni (P) alloy, shell is carried out electroless plating Ni (B) alloy immediately, its plating solution formula and process parameter are as table 6. figure 2 It is the surface morphology of the coating after electroless Ni(P) and Ni(B) plating.

[0028] Table 1 Chemical degreasing formula (room temperature, 30s)

[0029]

[0030] Table 2 acid etching formula (room temperatur...

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Abstract

The invention pertains to the field of metallic material and provides a method for sealing a sealed cover when SiCp / Al composite material is used as an encapsulation encloser and a cover plate. The method is applicable to the encapsulation enclosers of micro-electronics appliances such as a hybrid integrated circuit, a millimeter wave / micron wave integrated circuit and a multichip module in micro-electronics encapsulation. Double-layer plating is carried out on the surface of the SiCp / Al composite material; the SiCp / Al composite material encloser with a surface coating and the cover plate are welded together by Sn based solder. The method not only reduces production cost greatly, but also solves the problem of difficulty in sealing and connection of the SiCp / Al composite material, thus paving the way for widely using the SiCp / Al composite material as the material of enclosers and cover plates by related metal encloser factories.

Description

technical field [0001] The invention belongs to the field of metal materials and provides an aluminum silicon carbide composite material (SiC p / Al) is used as a hermetic capping method when encapsulating the casing and cover. It is suitable for packaging shells of microelectronic devices such as hybrid integrated circuits, millimeter wave / micron wave integrated circuits, and multi-chip components in microelectronic packaging. Background technique [0002] Metal packaging is a form of electronic packaging that uses metal as the shell or base, the chip is directly or through the substrate mounted on the shell or base, and the lead wire passes through the metal shell or base, mostly using glass-metal sealing technology. It is widely used in the packaging of hybrid circuits, mainly military and customized special hermetic packaging, and has been widely used in many fields, especially in military and aerospace fields. Although the traditional packaging shell material Kovar has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K1/20H01L21/48
Inventor 吴茂何新波曲选辉孟菲菲任淑彬
Owner UNIV OF SCI & TECH BEIJING
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