Nickel coated copper powder and process for producing the same

A technology of nickel-plated copper and copper particles, applied in liquid chemical plating, conductive materials, conductive materials dispersed in non-conductive inorganic materials, etc. To achieve the effect of improving adhesion and uniformity

Inactive Publication Date: 2007-06-27
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nickel electroless plating has the disadvantages of not being firmly attached to the surface of copper particles and being unevenly covered on the surface of copper particles

Method used

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  • Nickel coated copper powder and process for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Add 1kg of copper powder (D to 5L of pure water at 50°C) 50 = 5.2 μm), stir to prepare copper powder slurry.

[0035] (2) Next, 100 ml of Meltek Activator 352 manufactured by Meltek Corporation was added to the copper powder slurry, and the mixture was stirred for 10 minutes.

[0036] (3) Then, 100 ml of hydrazine hydrate was added to precipitate palladium on the surface of the copper particles.

[0037] (4) After standing, 4 L of the supernatant was removed.

[0038] (5) 4 L of pure water was added to the slurry, and after reaching 50° C., a nickel plating solution (an electroless nickel plating solution obtained by adding 1.2 L of Ni-426B to 1.2 L of Ni-426A manufactured by Meltech Corporation) was added to prepare Nickel-plated copper powder in which palladium is adhered to copper particles.

[0039] (6) Then, the nickel-plated copper powder according to Example 1 was obtained by filtering, washing, and drying in accordance with the usual method.

Embodiment 2

[0041] Since the production method of the nickel-plated copper powder is the same as that of the above-mentioned Example 1, the description thereof is omitted. However, after the above (6), heat treatment was performed at 300° C. for 1 hour in a 1% hydrogen-99% nitrogen atmosphere without deteriorating the powder dispersibility. The purpose of the heat treatment is to align the crystallinity of the nickel by heat-treating the nickel part. Thus, the nickel-plated copper powder according to Example 2 was obtained.

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Abstract

An antioxidant nickel coated copper powder for conductive paste capable of forming conductive wiring parts for electronic circuits; and a process for producing the same. In particular, use is made of a nickel coated copper powder characterized by comprising a nickel coated copper powder produced by providing a copper powder as a core material, fixing a plating catalyst on the surface of copper powder through reduction reaction and applying electroless nickel plating to the outermost surface thereof. The reduction reaction is characterized in that hydrazine is used as a reducing agent.

Description

technical field [0001] The present invention relates to nickel-plated copper powder (hereinafter, referred to as "nickel-plated copper powder" in the present application) in which nickel is coated on the surface of copper particles, and a method for producing the same. More specifically, it relates to nickel-plated copper powder excellent in oxidation resistance and suitable for use as a material of a conductive paste for electronic circuit board wiring, and a method for producing the same. Background technique [0002] In recent years, with the miniaturization and integration of electronic equipment, resin multilayer substrates as substrates for electronic circuits have become popular. Copper powder with reduced material cost and excellent electrical conductivity. [0003] However, as mentioned above, copper has advantages in terms of cost and conductivity, but on the other hand, has the disadvantage of being easily oxidized. This susceptibility to oxidation is further pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F1/00C23C18/18C23C18/34H01B5/00H01B1/22B22F1/17
CPCH01B1/026B22F1/025C23C18/34B22F2998/10C23C18/1841H05K1/092C23C18/1635Y10T428/12181B22F1/17B22F1/00H01B1/22
Inventor 坂上贵彦古本启太吉丸克彦
Owner MITSUI MINING & SMELTING CO LTD
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