18results about How to "Avoid thermal failure" patented technology

The invention discloses a nickel-metal hydride battery constant-temperature charging control method, which comprises the following steps of S1, initializing hardware and parameters, and acquiring a current environment temperature, a battery temperature and a battery state; s2, setting an initial charging current and a temperature wall temperature by adopting a multi-stage setting strategy; s3, acquiring the battery temperature and the battery state in real time, and realizing constant-current charging and variable-current charging control of the battery by adopting a multi-stage control method; and S4, finishing charging. According to the invention, the battery is charged at a constant temperature, and the temperature of the battery is controlled within the set temperature range of the temperature wall, so that the thermal failure of the battery is avoided, the charging efficiency of the battery in closed equipment and equipment with poor heat dissipation is ensured, and the service life of the battery is prolonged at the same time.

This invention discloses a compact prefabricated metal enclosed ring main unit, relating to the field of ring main unit technology. It solves the problems of existing technologies, such as difficulty in balancing heat dissipation and protection, inconvenient disassembly and maintenance, and high maintenance costs. The invention includes an outer protective cover; a ring main unit housed within the outer protective cover; an electric lifting cylinder fixedly mounted on the top surface of the outer protective cover, with its piston rod connected to the top surface of the ring main unit for driving the ring main unit to extend or retract into the outer protective cover; and a heat dissipation device comprising a curved heat dissipation pipe fixed within the outer protective cover and movably embedded in the bottom surface of the outer protective cover. Through the coordinated design of the lifting structure and the heat dissipation device, this invention achieves automatic heat dissipation during operation and protection during non-operational states. It features a compact structure, high heat dissipation efficiency, and good protective performance, making it suitable for compact outdoor power distribution scenarios.

This invention relates to a current transformer with temperature measurement function in the field of current transformer technology. It includes a current transformer body, with the cable being measured passing through a central hole in the body. A temperature sensor for temperature measurement is mounted on the current transformer body. An auxiliary temperature measurement assembly is located at the bottom front side of the current transformer body. This assembly includes a housing fixed to the front side of the current transformer body and communicating with its interior. A fan is located on the side of the housing away from the current transformer body. The temperature sensor's probe is inserted into the housing. The fan drives airflow within the current transformer body through the probe to measure the internal temperature. A front support plate located at the bottom of the cable is fixed to the front end of the current transformer body. The temperature probe is inserted into the front support plate and contacts the cable to measure its temperature. This invention solves the problem of low detection accuracy in current transformers with temperature measurement function.

The utility model relates to the technical field of display screens, in particular to a shockproof liquid crystal display screen for a motorcycle, which comprises a shell and a screen mounted on the shell, protective sleeves are sleeved on two sides of the shell, a heat dissipation mechanism for leading out hot air is further arranged, an air inlet and an air outlet are respectively connected with an air inlet pipe and an air outlet pipe, and the screen is mounted on the shell. Openings, communicated with the outside, of the air inlet pipe and the air outlet pipe face the opposite directions, the opening of the air inlet pipe faces the advancing direction, and a plurality of first flow slowing pieces and second flow slowing pieces are obliquely installed in the air inlet pipe and distributed in a staggered mode. According to the utility model, by utilizing the airflow characteristic when the motorcycle runs, external air naturally enters the air inlet pipe in the running process to form a natural air cooling effect, and efficient heat dissipation can be realized without an additional power device, so that compared with the traditional heat dissipation design, the energy consumption and the cost are reduced, and the heat dissipation efficiency is improved. And the problem of heat dissipation failure caused by faults of the power device is also avoided.

The utility model discloses a refrigerant storage device, belongs to the technical field of refrigerant storage, and solves the problems that an existing refrigerant storage device cannot move and is unstable in output. The storage device comprises a storage tank, a protection tank wrapping the storage tank is arranged on the outer side of the storage tank, an isolation interlayer is arranged between the protection tank and the storage tank, inert gas is arranged in the isolation interlayer, a moving trolley used for moving the protection tank is arranged below the protection tank, a liquid level meter is arranged in the storage tank, and the liquid level meter is arranged in the storage tank. An output pipe is arranged on one side of the upper portion of the saving box, a voltage stabilizer is arranged on the output pipe, an input pipe communicated with the saving box is arranged on the other side of the upper portion of the saving box, and a first electromagnetic stop valve is arranged on the input pipe. The refrigerant storage device disclosed by the utility model is convenient to move and use under the condition that the output pressure of the refrigerant is stable, the convenience is effectively increased, and the refrigerant storage device has the characteristics of convenience in use and strong practicability.

The invention discloses a heat dissipation assembly, a chip and a manufacturing method thereof, and the heat dissipation assembly comprises a heat conduction layer which is provided with a first surface and a second surface, and the first surface is attached to a target device; the heat dissipation structure is attached to the second surface of the heat conduction layer; the heat conduction layer transmits heat of the target device to the heat dissipation structure for radiation heat dissipation, the heat conduction layer comprises a plurality of first metal layers, a middle layer and a second metal layer, and the first metal layers, the middle layer and the second metal layer are sequentially arranged in the thickness direction of the target device. The first metal layer is attached to the target device, and the second metal layer is attached to the heat dissipation structure. Through the mode, heat generated during operation of the target device can be rapidly radiated into the environment, the temperature of the heat conduction layer and the target device is reduced, and the phenomenon that the electronic equipment normally operates due to thermal failure of the target device is avoided.

The invention discloses a large-current isolating switch contact assembly, and belongs to the technical field of power equipment. The isolating switch contact assembly comprises a static contact and a moving contact. The moving contact comprises a first conductive tube, a water drop arc-shaped convex surface contact and a contact seat; the water drop arc-shaped convex surface contacts are connected with the contact seat, and the torsion springs are fixed on the supporting piece and connected with the tail ends of the water drop arc-shaped convex surface contacts on the two sides respectively; the static contact comprises a second conductive tube and a water drop arc-shaped concave surface contact finger; the water drop arc-shaped concave surface contact finger is connected with the contact finger seat, the contact surfaces of the water drop arc-shaped concave surface contact finger and the water drop arc-shaped convex surface contact are water drop arcs with the same size, the pressure sensors are respectively fixed at the tail ends of the two sides of the rain cover, and the pressure sensors are connected with the contact finger tail ends of the two sides of the water drop arc-shaped concave surface contact finger through compression springs; the conductive capacity of the disconnecting switch can be improved, through-flow heating of the spring is avoided, and the switching-on and switching-off states of the disconnecting switch can be judged more effectively.

The utility model discloses a gateway equipment of end pressure edge calculation for water supply relates to control technical field. Gateway equipment of end pressure edge calculation for water supply, including edge calculation gateway main part and plug joint interface, be provided with spacing unit on edge calculation gateway main part, the sliding base, the protective shell and a plurality of heat dissipation fins in spacing unit, when the heat dissipation fin surface accumulates dust through spacing unit, the operator only needs to push the push block to the inboard, can drive the limit block compression reset spring and separate from the limit block card slot, then pull the protective shell can along T type block slide groove whole draw -out sliding base and heat dissipation fin, after cleaning, only need to push back to the original position of sliding base, reset spring can automatically push the limit block and enter the card slot and complete fixed, this design completely solved the inconvenient problem of traditional fixed heat dissipation structure cleaning, ensure that heat dissipation fin always maintains good heat dissipation efficiency, even in the pump house environment of limited ventilation condition.

The present invention relates to the field of LED semiconductor manufacturing technology, solves the problem of insufficient performance and stability of chip packaging in the prior art, and provides a method for setting molding parameters of a micro-light-emitting semiconductor chip and a preparation method. The method comprises determining mold parameters according to chip size parameters, thermal performance parameters, and luminous characteristic parameters; obtaining packaging material parameters according to luminous characteristic parameters, electrical characteristic parameters, and thermal performance parameters; obtaining molding temperature range according to the packaging material parameters and the thermal performance parameters; determining molding pressure range according to chip size parameters and chip material parameters; determining pressure holding time range according to packaging material parameters, thermal performance parameters, and the molding temperature range; and setting molding parameters according to molding temperature range, molding pressure range, and pressure holding time range. The present invention ensures the rationality of various parameters during the molding process, and avoids packaging defects or performance degradation caused by unreasonable parameters.

The utility model discloses a kind of heat pipe lap joint mechanism of 3D uniform temperature plate, including upper cover and heat pipe arranged on upper cover, upper cover is equipped with and is inserted into hole, and step part is equipped on the periphery of and is inserted into hole, heat pipe includes tube body and the butt joint portion corresponding arranged in the bottom of tube body, butt joint portion is sealingly connected with step part.The utility model has low production cost, and welding also cannot destroy internal capillary, contact thermal resistance is low, stability is high, heat transfer loss is low, and adaptability is strong.

The present invention discloses a box transformer for energy storage with coils that can dissipate heat quickly. The present invention relates to the technical field of energy storage box transformer stations, including a bracket, the top of the bracket is fixedly connected to a frame, the inner side of the frame is fixedly connected to a transformer coil, the inner side of the transformer coil is fixedly connected to an iron core, the surface of the transformer coil is fixedly connected to a connecting rod, and the surface of the transformer coil is provided with an air passage that runs from top to bottom. The box transformer for energy storage with coils that can dissipate heat quickly can achieve gas flow in the air passage inside the transformer coil, so that the heat on the surface of the transformer coil is quickly taken away, the screw slide controls the movement of the rotating plate, thereby adjusting the angle between the rotating plate and the support plate, and the direction of the airflow output by the heat dissipation mechanism is changed, so that the gas in the transformer coil flows more evenly, solving the problem that there is a risk of water leakage and electric leakage when directly transferring heat and cooling the interior of the transformer box using a coolant flow.

The invention relates to the technical field of transformer substations, in particular to a transformer substation automatic inspection operation robot which comprises a robot traction base, a partial discharge detection assembly and an electrical parameter detection assembly, and the partial discharge detection assembly and the electrical parameter detection assembly are installed on the robot traction base. The partial discharge detection assembly comprises a middle support and an electric connection seat arranged on the middle support, and a detection machine head is arranged on the electric connection seat; the electrical parameter detection assembly comprises an electrical parameter detection assembly, the electrical parameter detection assembly is installed on the supporting frame, an electromagnetic wave analyzer, an electromagnetic wave receiving base station and an infrared detector are arranged in the electrical parameter detection assembly, and the electromagnetic wave receiving base station is arranged at the detection end of the electromagnetic wave analyzer; the infrared detector is cooperatively arranged on the side edge of the electromagnetic wave receiving base station. Partial discharge detection, electromagnetic wave analysis and infrared temperature measurement technologies are integrated, the state of substation equipment is efficiently and accurately detected, electric leakage and thermal faults are prevented, and the operation and maintenance efficiency and safety are improved.

The invention relates to the technical field of LED (light-emitting diode) semiconductor manufacturing, solves the problems of insufficient performance and stability of chip packaging in the prior art, and provides a mold pressing parameter setting method and a preparation method of a miniature light-emitting semiconductor chip. The method comprises the following steps: determining mold parameters according to chip size parameters, thermal performance parameters and luminescence characteristic parameters; according to the luminescence characteristic parameters, the electrical characteristic parameters and the thermal performance parameters, packaging material parameters are obtained; according to the packaging material parameters and the thermal performance parameters, a mold pressing temperature range is obtained; according to the chip size parameters and the chip material parameters, the mold pressing pressure range is determined; determining a pressure holding time range according to packaging material parameters, thermal performance parameters and the mold pressing temperature range; and setting mold pressing parameters according to the mold pressing temperature range, the mold pressing pressure range and the pressure holding time range. According to the invention, the rationality of each parameter in the mold pressing process is ensured, and the packaging defect or performance reduction caused by unreasonable parameters is avoided.

The invention relates to the technical field of semiconductor device testing, in particular to a semiconductor device testing device which comprises a box body, a liquid cooling assembly, a testing station assembly and a driving module. The liquid cooling assembly comprises a plurality of liquid cooling modules arranged on the inner wall of the box body in an array; the test station assembly comprises a support frame and a plurality of tested device bearing modules installed on the support frame. The positions of the tested device bearing modules and the liquid cooling modules are in one-to-one correspondence; and the driving module is fixed in the box body, the output end of the driving module is connected with the supporting frame, and the driving module is used for driving the supporting frame to reciprocate along a first direction, so that the tested device bearing module and the liquid cooling module are close to each other until the surfaces of the tested device bearing module and the liquid cooling module are attached or separated from each other. According to the invention, rapid thermal connection between a plurality of tested devices and a plurality of liquid cooling modules can be realized, uniform contact is realized, the test reliability is effectively enhanced, and the test efficiency can be greatly improved.

The application relates to a deviation correction detection device and an oven equipment. The device comprises a detection unit arranged on at least one side of a substrate running path, which is used for detecting the deviation of the substrate edge. The detection unit comprises a photoelectric detection assembly and a reflection assembly, and a detection light path is formed between the photoelectric detection assembly and the reflection assembly. An execution unit comprises a position adjustment mechanism, which is in contact with the substrate and is used for driving the lateral movement of the substrate. A control unit is used for controlling the lateral movement of the position adjustment mechanism to correct the deviation of the substrate according to the deviation signal detected by the detection unit. The reflection assembly and the position adjustment mechanism are arranged in a first temperature region, the photoelectric detection assembly and the control unit are arranged in a second temperature region, and the temperature of the first temperature region is higher than that of the second temperature region. The scheme provided by the application can improve the deviation correction control precision of the substrate in a high-temperature environment, thereby improving the tension uniformity of the substrate in the coating and baking process.

The invention discloses a driving circuit and method of a power module. The power module comprises at least two power devices which are connected in parallel; the driving circuit comprises at least two driving modules and at least two temperature acquisition modules; the temperature acquisition module is arranged at the power device, and the driving module is connected with the control end of the power device; the driving module comprises a control unit and a driving unit, the control unit is connected with the corresponding temperature acquisition module, and different control units are in communication connection; the control unit is used for comparing the temperature information of all the power devices, adjusting the conduction time of at least one power device to be later than the conduction time of the other power devices when the difference value between two pieces of temperature information is larger than a preset threshold value, and / or adjusting the conduction time of the other power devices to be later than the conduction time of the other power devices. The driving speed of at least one driving unit is adjusted to be smaller than the driving speed of the other driving units. According to the technical scheme, the loss of the power device is balanced, the temperature unbalance of the power device is avoided, and thus the thermal failure of the power device is avoided.

The utility model relates to the technical field of energy storage devices, and discloses a grid-load-storage integrated photovoltaic power generation and energy storage device which comprises a base, an energy storage box body is fixedly installed on the top of the base, ventilation openings are formed in the two sides of the energy storage box body, dustproof frames are fixedly installed on the two side walls of the energy storage box body, and the dustproof frames are fixedly installed on the top of the base. Dustproof nets are fixedly mounted on the side walls of the two dustproof frames, mounting blocks are fixedly mounted on the inner walls and the two sides of the side walls of the dustproof frames, first gear rings are slidably connected to the two mounting blocks in the dustproof frames, first scraping plates are fixedly connected to the inner walls of the first gear rings, and the first scraping plates make contact with the dustproof nets; a first gear is arranged on one side of the first gear ring, and the first gear is arranged in one of the mounting blocks; the dustproof net can be actively cleaned, and dust is prevented from being accumulated on the surface of the dustproof net to affect the performance of the device.