Distributed full liquid cooling device and control method thereof

Abstract

The invention relates to the technical field of liquid cooling, in particular to a distributed full liquid cooling device which comprises a liquid cooling distribution module, a liquid supply main pipe, a liquid return main pipe and a plurality of liquid cooling modules, and the liquid cooling distribution module adjusts the flow speed of low-temperature cooling liquid in the liquid supply main pipe according to the total heating value, so that the overall heat dissipation balance of a system is guaranteed; the cooling liquid inlet flow of each liquid cooling unit is accurately regulated and controlled based on the inlet and outlet liquid temperature difference and the real-time liquid supply mass flow of the liquid cooling units in the liquid cooling module and the real-time reference power of the electronic equipment, so that the heat dissipation requirement of the single liquid cooling module can be met; meanwhile, the liquid cooling distribution module can control the opening state of the jet flow unit according to the surface temperature of the heating element in the electronic equipment, and local enhanced cooling can be conducted on the heating element. According to the distributed full liquid cooling device, accurate control from a global system to a local system is realized through distributed management, and heat dissipation requirements of different levels can be met.

Description

Technical Field

[0001] The present application relates to the field of liquid cooling technology, and in particular to a distributed full liquid cooling device and a control method thereof. Background Art

[0002] As AI computing needs continue to grow, high-power chips are increasingly in need of efficient cooling solutions, especially liquid cooling technology. The use of high-density cabinets in AI clusters has made their cooling requirements reach the limit of traditional air cooling technology. Liquid cooling technology, with its excellent heat dissipation efficiency and compact space occupancy, has become an ideal choice to make up for the lack of air cooling and achieve high cost-effectiveness and efficient temperature control.

[0003] In the field of liquid cooling, immersion liquid cooling technology has attracted much attention due to its superior heat dissipation efficiency, silent operation and high energy efficiency ratio. However, immersion liquid cooling systems often adopt customized designs, which leads to poor compatibility with existing computer rooms and insufficient space utilization. To solve the above problems, the existing patent No. 202222438652.6 discloses an immersion liquid cooling device that can be used in modular combination. The device has the advantages of small size, high space utilization, low maintenance cost and easy disassembly and assembly. However, the immersion heat exchange flow of the device only supports unified adjustment and lacks the ability of multi-stage flow control. When the power of the equipment fluctuates unstably, the heat dissipation demand of the liquid cooling system cannot be fully responded to. Summary of the invention

[0004] Based on this, it is necessary to provide a distributed full liquid cooling device and a control method thereof to address the problem that the existing immersion liquid cooling system lacks multi-stage flow control.

[0005] In the first aspect, the present application provides a distributed full liquid cooling device. The device includes a liquid cooling distribution module, a liquid supply main pipe, a liquid return main pipe and multiple liquid cooling modules, each of which includes a liquid cooling unit, a jet unit, a liquid storage unit, a unit flow regulating valve, a liquid inlet temperature detection unit, a liquid outlet temperature detection unit and a first liquid supply mass flow detection unit; the liquid cooling unit is used to place electronic equipment, the liquid outlet of the liquid cooling distribution module is connected to the liquid supply main pipe, the liquid supply main pipe is connected to the liquid inlet of each liquid cooling unit through the unit flow regulating valve, the liquid outlet of each liquid cooling unit is connected to the liquid inlet of the liquid cooling distribution module through the liquid return main pipe, and the liquid inlet of the liquid supply main pipe is provided with a second liquid supply mass flow detection unit; the jet unit is fixed to the liquid outlet of the liquid storage unit, and the liquid outlet of the jet unit is arranged opposite to the heating element in the electronic equipment;

[0006] The liquid cooling distribution module is used to adjust the flow rate of the low-temperature coolant in the liquid supply main pipe according to the total heat generation of the liquid cooling unit;

[0007] The liquid cooling distribution module is also used to generate a first control signal according to the inlet and outlet temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate and the real-time reference power of the electronic device; the first control signal is used to control the opening of the unit flow regulating valve;

[0008] The liquid cooling distribution module is also used to generate a second control signal according to the surface temperature of the heating element, and the second control signal is used to control the opening of the jet unit.

[0009] In one embodiment, the liquid cooling distribution module includes a cooling tower, a plate heat exchanger, a pre-pump liquid storage tank, a circulating main pump and an AI intelligent control unit; the plate heat exchanger is used to convert the high-temperature coolant in the return liquid main pipe into a low-temperature coolant, and transmit the low-temperature coolant to the pre-pump liquid storage tank, and the cooling tower provides cooling circulating water for the plate heat exchanger; the pre-pump liquid storage tank is used to temporarily store the low-temperature coolant output from the plate heat exchanger; the circulating main pump is used to transmit the low-temperature coolant temporarily stored in the pre-pump liquid storage tank to the liquid supply main pipe;

[0010] The AI ​​intelligent control unit is used to adjust the speed of the circulating main pump according to the total heat generation of the liquid cooling unit; the AI ​​intelligent control unit is also used to generate a first control signal according to the inlet and outlet liquid temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate and the real-time reference power of the electronic equipment; the AI ​​intelligent control unit is also used to generate a second control signal according to the surface temperature of the heating element.

[0011] In one of the embodiments, the liquid outlet of the liquid cooling distribution module is connected to the liquid replenishment and drainage holes of each liquid storage unit through a node liquid storage and supply pipe.

[0012] In one embodiment, the liquid outlet of the liquid cooling distribution module is connected to the liquid supply main via a dynamic balancing valve.

[0013] In one of the embodiments, the jet unit includes a jet liquid pipe, a jet tube, a nozzle assembly and a nozzle control valve.

[0014] In one embodiment, the liquid inlet temperature detection unit and the liquid outlet temperature detection unit are both temperature sensors; the first liquid supply mass flow detection unit and the second liquid supply mass flow detection unit are both mass flow meters.

[0015] In one of the embodiments, a liquid level monitoring component is provided inside the liquid storage unit; when the liquid level of the liquid storage unit is lower than a preset liquid level threshold, the liquid level monitoring component sends a liquid level reminder signal to the liquid cooling distribution module.

[0016] In a second aspect, the present application also provides a control method for a distributed full liquid cooling device. The method comprises:

[0017] Step S1, obtaining the real-time heat load of each liquid cooling unit according to the real-time reference power of the electronic equipment in each liquid cooling unit, and calculating the total heat generation of the liquid cooling unit according to the real-time heat load of each liquid cooling unit;

[0018] Step S2, adjusting the flow rate of the low-temperature coolant in the liquid supply main pipe according to the total heat generation of the liquid cooling unit;

[0019] Step S3, obtaining the node inlet and outlet liquid temperature difference and the real-time liquid supply mass flow rate of the liquid cooling unit;

[0020] Step S4, obtaining the real-time heat exchange capacity of the liquid cooling unit according to the node inlet and outlet liquid temperature difference and the real-time liquid supply mass flow rate;

[0021] Step S5, when the real-time heat exchange amount of the liquid cooling unit is less than the real-time heat load of the liquid cooling unit, generating a first control signal, the first control signal being used to control the opening of the unit flow regulating valve in the liquid cooling unit;

[0022] Step S6, calculating the node cooling capacity of the liquid cooling unit according to the real-time heat exchange of the liquid cooling unit; obtaining the total power of the electronic equipment in the liquid cooling unit according to the real-time reference power of the electronic equipment in the liquid cooling unit and the fluctuating power of the heating element;

[0023] Step S7, when the total power of the electronic equipment in the liquid cooling unit is greater than the node cooling capacity of the liquid cooling unit, obtaining the surface temperature of the heating element in the electronic equipment;

[0024] Step S8, when the surface temperature of the heating element exceeds a preset temperature threshold, a second control signal is generated, and the second control signal is used to turn on the jet unit in the liquid cooling unit.

[0025] In one embodiment, the calculation formula of the real-time heat load is:

[0026] Q i =ηP si

[0027] In the formula, Q i is the real-time heat load of the electronic equipment in the i-th liquid cooling unit, P si is the real-time reference power of the electronic equipment in the i-th liquid cooling unit, and η is the power heating coefficient;

[0028] The total heat output is calculated as:

[0029] Q 总 =ηP s总 =η(P s1 +P s2 +…+P si +…+P sn )

[0030] In the formula, Q 总 is the total heat output, P s总 is the total power consumption of all electronic devices in the liquid cooling unit, P siis the benchmark power consumption of the electronic equipment in the i-th liquid cooling unit, and n is the number of liquid cooling units;

[0031] Step S2 includes:

[0032] Step S21, obtaining a target coolant mass flow rate according to the total heat output of the liquid cooling unit; wherein the target coolant mass flow rate is calculated as follows:

[0033]

[0034] In the formula, q m is the target coolant mass flow rate, C q is the specific heat capacity of the coolant, ΔT is the coolant supply and return difference;

[0035] Step S22, adjusting the rotation speed of the circulating main pump in the liquid cooling distribution module according to the target coolant mass flow rate.

[0036] In one embodiment, the preset temperature threshold is a chip junction temperature value.

[0037] The above-mentioned distributed full liquid cooling device includes a liquid cooling distribution module and multiple liquid cooling modules, and each liquid cooling module includes a liquid cooling unit, a jet unit, a liquid storage unit, a unit flow regulating valve, a liquid inlet temperature detection unit, a liquid outlet temperature detection unit and a first liquid supply mass flow detection unit; the liquid cooling distribution module ensures the overall heat dissipation balance of the system by adjusting the low-temperature coolant flow rate in the liquid supply main pipe according to the total heat generation, and accurately controls the coolant inlet flow of each liquid cooling unit based on the inlet and outlet temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate and the real-time reference power of the electronic device, so as to meet the heat dissipation requirements of a single liquid cooling unit; at the same time, the liquid cooling distribution module can also control the opening state of the jet unit according to the surface temperature of the heating element in the electronic device, so as to locally enhance the cooling of the heating element and avoid the occurrence of local hot spots. The distributed full liquid cooling device realizes precise control from the overall to the local system through distributed management, can cope with the heat dissipation requirements of different levels, and the distributed modular management facilitates the single-point maintenance of the system, and the system scalability is also improved, and the installed capacity can be flexibly increased or decreased. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic diagram of the structure of a distributed full liquid cooling device in one embodiment;

[0039] Figure 2 is a schematic structural diagram of a liquid cooling module in one embodiment;

[0040] Figure 3 A schematic diagram of the positional relationship between the jet unit and the heating element in one embodiment;

[0041] Figure 4Schematic diagram of a control method flow of a distributed full liquid cooling device in one embodiment.

[0042] Explanation of the numbers in the figure: 10 liquid cooling distribution module; 20 liquid supply main pipe; 30 liquid return main pipe; 40 liquid cooling module; 50 second liquid supply mass flow detection unit; 60 node liquid storage and supply pipe; 70 dynamic balancing valve; 80 liquid level monitoring component; 110 high and low temperature coolant conversion unit; 120 low temperature coolant supply unit; 401 liquid cooling module includes liquid cooling unit; 402 jet unit; 403 liquid storage unit; 404 unit flow regulating valve; 405 liquid inlet temperature detection unit; 406 liquid outlet temperature detection unit; 407 first liquid supply mass flow detection unit; 412 jet liquid pipe; 422 jet tube; 432 nozzle assembly; 442 nozzle control valve. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0044] The distributed full liquid cooling device proposed in the present application can adopt a vertical structure design and support use in conjunction with existing air-cooled cabinets.

[0045] In one embodiment, Figure 1 and Figure 2 As shown, the distributed full liquid cooling device includes a liquid cooling distribution module, a liquid supply main pipe, a liquid return main pipe and multiple liquid cooling modules, each of which includes a liquid cooling unit, a jet unit, a liquid storage unit, a unit flow regulating valve, a liquid inlet temperature detection unit, a liquid outlet temperature detection unit and a first liquid supply mass flow detection unit. The liquid outlet of the liquid cooling distribution module is connected to the liquid supply main pipe, the liquid supply main pipe is connected to the liquid inlet of each liquid cooling unit through the unit flow regulating valve, and the liquid outlet of each liquid cooling unit is connected to the liquid inlet of the liquid cooling distribution module through the liquid return main pipe. The liquid inlet of the liquid supply main pipe is provided with a second liquid supply mass flow detection unit for detecting the real-time mass flow of the liquid supply main pipe.

[0046] The liquid cooling distribution module may specifically include a high-low temperature coolant conversion unit and a low-temperature coolant supply unit. The high-low temperature coolant conversion unit is used to convert the high-temperature coolant in the return liquid main pipe into a low-temperature coolant, and transmit the low-temperature coolant to the low-temperature coolant supply unit; the low-temperature coolant supply unit is used to transport the low-temperature coolant to the liquid supply main pipe. The liquid cooling unit is used to immerse electronic equipment (such as computer components, communication equipment, servers, etc.) and store coolant. The liquid cooling unit is equipped with a liquid inlet, a liquid outlet, and a replenishment and drainage hole ( Figure 1(not shown) to ensure efficient circulation and replenishment of the cooling liquid. In addition, the liquid cooling unit can be a modular plug-in frame liquid cooling unit. By installing a horizontal slide rail in the cabinet, the plug-in and unplug operation of the liquid cooling unit is facilitated. The liquid cooling distribution module supplies liquid to each liquid cooling unit through the liquid supply pipe. After the cooling liquid absorbs heat in the liquid cooling unit, it returns to the liquid cooling distribution module through the liquid return pipe, forming a closed loop, ensuring the continuous circulation and stable operation of the cooling liquid inside the device.

[0047] The liquid storage unit is used to store low-temperature coolant. Further, in order to facilitate timely replenishment of the liquid storage unit, the liquid inlet of each liquid storage unit can be connected to the liquid outlet of the liquid cooling distribution module through a node liquid storage supply pipe.

[0048] The jet unit is fixed to the liquid outlet of the liquid storage unit, and the liquid outlet of the jet unit is arranged relative to the heat-generating element in the electronic device (such as high-power chips such as CPU and GPU) to perform local enhanced cooling. The number and fixed position of the jet units can be flexibly configured according to the number and position of the heat-generating elements. For example, when there are three heat-generating elements in the electronic device, three jet units can be set, and the fixed position of the jet unit can be made to face the center of the heat-generating element to ensure a dynamic cooling effect. Specifically, Figure 3 As shown in the figure, the xy plane represents the plane where the heating element is located. The plane represents the fixed position of the jet unit in the liquid storage unit, and the xy plane is parallel to plane. By determining the center point coordinates of each heating element: (x t ,y t )、(x i ,y i ) and (x n ,y n ), the fixed position coordinates of each jet unit can be determined accordingly: and This enables precise cooling.

[0049] In addition, the unit flow control valve can be a flow valve with an equal percentage ideal flow characteristic. The percentage of flow change caused by the unit stroke change of the flow valve is equal. It has the advantages of stable operation and good sensitivity. Its flow equation is shown in formula (1):

[0050]

[0051] In the formula, Q is the flow rate of the unit flow control valve at a certain opening, Q max is the flow rate when the unit flow control valve is fully opened, L is the stroke opening size of the unit flow control valve at a certain opening, L maxIt is the stroke opening size when the unit flow regulating valve is fully opened. The liquid cooling distribution module can control the low-temperature coolant flow of the liquid inlet of the liquid cooling unit by adjusting the stroke opening size of the unit flow regulating valve.

[0052] The liquid inlet temperature detection unit and the first liquid supply mass flow detection unit are both located at the liquid inlet of the liquid cooling unit, wherein the liquid inlet temperature detection unit is used to detect the real-time liquid inlet temperature of the liquid cooling unit, and the first liquid supply mass flow detection unit is used to detect the real-time liquid supply mass flow of the liquid cooling unit. The liquid outlet temperature detection unit is located at the liquid outlet of the liquid cooling unit, and is used to detect the real-time liquid outlet temperature of the liquid cooling unit. Preferably, in some embodiments, the liquid inlet temperature detection unit and the liquid outlet temperature detection unit are both temperature sensors, and the first liquid supply mass flow detection unit and the second liquid supply mass flow detection unit are both mass flow meters.

[0053] The liquid cooling distribution module is used to adjust the low-temperature coolant in the liquid supply main pipe according to the total heating value of the liquid cooling unit. When the total heating value increases, the liquid cooling distribution module will increase the flow rate of the coolant to improve the heat dissipation efficiency; conversely, when the total heating value decreases, the flow rate will be reduced to save energy. Among them, the total heating value of the liquid cooling unit can be calculated based on the real-time reference power of the electronic equipment in each liquid cooling unit. Specifically, the liquid cooling distribution module first obtains the real-time heat load of each liquid cooling unit based on the real-time reference power of the electronic equipment in each liquid cooling unit, and then calculates the total heating value of the liquid cooling unit based on the real-time heat load of each liquid cooling unit. Preferably, the calculation formula of the real-time heat load is shown in formula (2), and the calculation formula of the total heat is shown in formula (3):

[0054] Q i =ηP si (2)

[0055] In the formula, Q i is the real-time heat load of the electronic equipment in the i-th liquid cooling unit, P si is the real-time reference power of the electronic equipment in the i-th liquid cooling unit, η is the power heat generation coefficient, η>1.

[0056] Q 总 =ηP s总 =η(P s1 +P s2 +…+P si +…+P sn ) (3)

[0057] In the formula, Q 总 is the total heat output, P s总 is the total power consumption of all electronic devices in the liquid cooling unit, P si is the benchmark power consumption of the electronic equipment in the i-th liquid cooling unit, and n is the number of liquid cooling units.

[0058] After the liquid cooling distribution module calculates the total calorific value of the liquid cooling unit, it further calculates the target coolant mass flow rate based on the total calorific value, which is the coolant mass flow rate flowing through the second liquid supply mass flow detection unit; then the flow rate of the low-temperature coolant in the liquid supply main pipe is adjusted according to the target coolant mass flow rate. In particular, when the low-temperature coolant supply unit in the liquid cooling distribution module is a circulating main pump, the liquid cooling distribution module can adjust the speed of the circulating main pump according to the target coolant mass flow rate, thereby adjusting the flow rate of the low-temperature coolant in the liquid supply main pipe. Among them, the calculation formula of the target coolant mass flow rate is shown in formula (4):

[0059]

[0060] In the formula, q m is the target coolant mass flow rate, C q is the specific heat capacity of the coolant, ΔT is the coolant supply-return liquid difference, and the coolant supply-return liquid difference may be the difference between the real-time liquid inlet temperature and the real-time liquid outlet temperature of the liquid cooling unit.

[0061] The liquid cooling distribution module is also used to generate a first control signal based on the inlet and outlet liquid temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate and the real-time reference power of the electronic device. The first control signal is used to control the opening of the unit flow control valve. Specifically, the liquid cooling distribution module first obtains the node inlet and outlet liquid temperature difference of the liquid cooling unit and the real-time liquid supply mass flow rate detected by the first liquid supply mass flow rate detection unit, and obtains the real-time heat exchange of the liquid cooling unit based on the node inlet and outlet liquid temperature difference and the real-time liquid supply mass flow rate; when the real-time heat exchange of the liquid cooling unit is less than the real-time heat load of the liquid cooling unit, a first control signal is generated, and the first control signal is used to control the opening of the unit flow control valve in the liquid cooling module. Among them, the calculation formula of the real-time heat exchange of the liquid cooling unit is shown in formula (5):

[0062] Q 换 =q' m C p ΔT (5)

[0063] In the formula, Q 换 represents the real-time heat exchange of the liquid cooling unit, q' m Indicates the real-time liquid supply mass flow rate of the liquid cooling unit.

[0064] The real-time heat load of the liquid cooling unit is calculated by formula (2). Specifically, when the real-time heat exchange of the liquid cooling unit is less than the real-time heat load of the liquid cooling unit, that is, the real-time heat exchange of the liquid cooling unit cannot meet its current real-time heat load, the liquid cooling distribution module generates a first control signal, and the first control signal specifically sets the opening of the flow valve. After receiving the first control signal, the unit flow regulating valve automatically adjusts its opening to the value specified in the first control signal, thereby adjusting the heat exchange of the liquid cooling unit to ensure that each liquid cooling unit can obtain sufficient heat dissipation effect to meet its heat dissipation requirements.

[0065] The liquid cooling distribution module is also used to generate a second control signal according to the surface temperature of the heating element, and the second control signal is used to control the opening of the jet unit.

[0066] Specifically, the liquid cooling allocation module first calculates the node cooling capacity of the liquid cooling unit according to the real-time heat exchange of the liquid cooling unit, and then obtains the total power of the electronic equipment in the liquid cooling unit according to the real-time reference power of the electronic equipment in the liquid cooling unit and the fluctuating power of the heating element. When the total power of the electronic equipment in the liquid cooling unit is greater than the node cooling capacity of the liquid cooling unit, the heat dissipation demand of the electronic equipment cannot be met at this time, and the liquid cooling allocation module further obtains the surface temperature of the heating element in the electronic equipment. Figure 2 As shown, the surface of the heating element is additionally provided with a temperature sensor, and the liquid cooling distribution module can obtain the surface temperature of the heating element from the temperature sensor, thereby ensuring the reliability of the temperature data. Then, when the surface temperature of the heating element exceeds the preset temperature threshold, a second control signal is generated, and the second control signal is used to turn on the jet unit in the liquid cooling module. 冷 The calculation formula is shown in formula (6):

[0067]

[0068] The total power of the electronic equipment P total The calculation formula is shown in formula (7):

[0069] P total =P Flucuation +P Standard (7)

[0070] Where P Flucuation is the real-time reference power of the electronic device, P Standard is the fluctuating power of the heating element.

[0071] The distributed full liquid cooling device of this embodiment includes a liquid cooling distribution module and multiple liquid cooling modules, and each liquid cooling module includes a liquid cooling unit, a jet unit, a liquid storage unit, a unit flow regulating valve, a liquid inlet temperature detection unit, a liquid outlet temperature detection unit and a first liquid supply mass flow detection unit; the liquid cooling distribution module ensures the overall heat dissipation balance of the system by adjusting the low-temperature coolant flow rate in the liquid supply main pipe according to the total heat generation, and accurately controls the coolant inlet flow of each liquid cooling unit based on the inlet and outlet temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate and the real-time reference power of the electronic device, so as to meet the heat dissipation demand of a single liquid cooling unit; at the same time, the liquid cooling distribution module can also control the opening state of the jet unit according to the surface temperature of the heating element in the electronic device, so as to locally enhance the cooling of the heating element and avoid the occurrence of local hot spots. The distributed full liquid cooling device realizes precise control from the overall to the local system through distributed management, can cope with the heat dissipation needs of different levels, and the distributed modular management facilitates the single-point maintenance of the system, and the system scalability is also improved, and the installed capacity can be flexibly increased or decreased.

[0072] In one embodiment, Figure 1 As shown, the liquid cooling distribution module includes a cooling tower, a plate heat exchanger, a pre-pump liquid storage tank, a circulating main pump and an AI intelligent control unit (not shown in the figure). The plate heat exchanger is used to convert the high-temperature coolant in the return liquid main pipe into a low-temperature coolant, and transfer the low-temperature coolant to the pre-pump liquid storage tank. The cooling tower provides cooling circulating water for the plate heat exchanger. Preferably, the cooling tower is a primary side heat exchange device. The pre-pump liquid storage tank is used to temporarily store the low-temperature coolant output from the plate heat exchanger, and then send it to the circulating main pump to prevent the circulating main pump from idling. The circulating main pump transfers the low-temperature coolant temporarily stored in the pre-pump liquid storage tank to the liquid supply main pipe. The AI ​​intelligent control unit monitors the working status of each liquid cooling unit, the liquid supply main pipe and the return liquid main pipe in real time by acquiring the detection data of the liquid inlet temperature detection unit, the liquid outlet temperature detection unit, the first liquid supply mass flow detection unit and the second liquid supply mass flow detection unit, so as to realize intelligent adjustment of the flow, temperature and local cooling measures of the coolant. The AI ​​intelligent control unit is linked with control components such as the circulation main pump, jet unit, and unit flow regulating valve, and issues corresponding control instructions based on the real-time data feedback from each detection unit.

[0073] Specifically, the AI ​​intelligent control unit is used to adjust the speed of the circulating main pump according to the total heat generation of the liquid cooling unit. When the total heat generation increases, the AI ​​intelligent control unit increases the speed of the circulating main pump to increase the flow rate of the low-temperature coolant in the liquid supply main pipe to improve the heat dissipation efficiency, ensure that the operating temperature of the equipment is within a safe range, and meet the preset reference heat exchange capacity of the liquid cooling module. The AI ​​intelligent control unit is also used to generate a first control signal according to the inlet and outlet temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate, and the real-time reference power of the electronic device. The first control signal is used to control the opening of the unit flow control valve to adjust the node heat exchange capacity to meet the heat dissipation requirements of the single liquid cooling module, thereby ensuring that after the main cooling flow is distributed, the liquid cooling unit can maintain a stable heat exchange efficiency and prevent individual liquid cooling units from affecting performance due to insufficient coolant. The AI ​​intelligent control unit is also used to generate a second control signal according to the surface temperature of the heating element. The second control signal is used to control the opening of the jet unit to achieve local enhanced cooling of the heating element and further optimize the heat exchange efficiency. Among them, the specific generation steps of the first control signal and the second control signal can refer to the above embodiment and are not repeated here.

[0074] The liquid cooling distribution module in this embodiment includes a cooling tower, a plate heat exchanger, a pre-pump liquid storage tank, a circulating main pump and an AI intelligent control unit, wherein the AI ​​intelligent control unit integrates multiple layers of AI intelligent control logic to ensure efficient distribution and precise heat dissipation of the coolant, thereby achieving efficient heat dissipation, intelligent regulation and stable operation of each liquid cooling module, reducing energy consumption and operation and maintenance costs, and improving the overall performance of the system.

[0075] In one embodiment, the liquid outlet of the liquid cooling distribution module is connected to the liquid supply pipe via a dynamic balancing valve. The dynamic balancing valve is used to ensure that the liquid inlet flow of each liquid cooling module in the system is automatically constant at a preset value. The preset value is adjusted once before the dynamic balancing valve is operated so that the system maintains a balanced flow. Specifically, the dynamic balancing valve automatically adjusts the valve core to a certain opening according to the load change requirements of the terminal equipment. Regardless of how the system pressure changes, the dynamic balancing valve can dynamically balance the resistance of the system so that its flow is not affected by the system pressure fluctuations and remains constant. Furthermore, when the liquid outlet of the liquid cooling distribution module is connected to the liquid inlet of each liquid storage unit through a node liquid storage supply pipe, such as Figure 1 As shown, the dynamic balancing valve can be arranged between the node liquid storage and liquid supply pipe and the liquid supply main pipe.

[0076] The dynamic balancing valve of this embodiment can reduce the risk of equipment failure caused by uneven flow or pressure fluctuation, and help improve the working reliability and service life of the distributed full liquid cooling device.

[0077] In one embodiment, Figure 2As shown, the jet unit includes a jet liquid tube, a jet tube, a nozzle assembly and a nozzle control valve. The liquid cooling distribution module controls the opening state of the nozzle control valve according to the surface temperature of the heating element. Specifically, the nozzle control valve remains closed by default. When the surface temperature of the heating element exceeds the preset temperature threshold, the liquid cooling distribution module controls the nozzle control valve to open. After the nozzle control valve is opened, the jet liquid tube guides the coolant stored in the liquid storage unit to the jet tube and the nozzle assembly. The coolant flows in the jet liquid tube, and then is accelerated by the jet tube and finely adjusted by the nozzle assembly. It is sprayed onto the surface of the heating element at a high speed and high pressure, thereby realizing local enhanced cooling of the heating element.

[0078] The jet unit of this embodiment achieves accurate and efficient cooling of the heating element through the coordinated action of the jet liquid tube, the jet tube, the nozzle assembly and the nozzle control valve, thereby meeting the cooling requirements of a single heating element.

[0079] In one embodiment, Figure 1 As shown, a liquid level monitoring component is provided inside the liquid storage unit to realize real-time and accurate monitoring of the liquid level. Preferably, the liquid level monitoring component can be a liquid level sensor.

[0080] Specifically, when the liquid level of the liquid storage unit is lower than the preset liquid level threshold, the liquid level monitoring component can accurately convert the liquid level information into a liquid level reminder signal, and send the liquid level reminder signal to the liquid cooling distribution module, wherein the liquid level reminder signal can be an electrical signal or other identifiable signal form. After the liquid cooling distribution module obtains the liquid level reminder signal, it can replenish the liquid storage unit through the node liquid storage supply pipe to ensure that the liquid storage unit can quickly return to the appropriate liquid level, thereby ensuring the stable operation of the entire liquid cooling device.

[0081] In addition, in order to further improve the reliability and efficiency of the system, an intelligent control algorithm can be integrated into the liquid cooling distribution module. This algorithm can dynamically adjust the liquid replenishment speed and amount according to the real-time monitoring data of the liquid level monitoring component to achieve more refined liquid level management.

[0082] The distributed full liquid cooling device of this embodiment can replenish the liquid storage unit in time by setting a liquid level monitoring component inside the liquid storage unit, which significantly improves the stability and efficiency of the liquid cooling device and can provide strong guarantee for the long-term and high-efficiency operation of the device.

[0083] In one embodiment, Figure 4 As shown, a control method for a distributed full liquid cooling device is also provided, which is described by taking the method applied to a liquid cooling distribution module, especially an AI intelligent control unit in the liquid cooling distribution module as an example, and specifically includes the following steps:

[0084] Step S1, obtaining the real-time heat load of each liquid cooling unit according to the real-time reference power of the electronic equipment in each liquid cooling unit, and calculating the total heat generation of the liquid cooling unit according to the real-time heat load of each liquid cooling unit.

[0085] Step S2, adjusting the flow rate of the low-temperature coolant in the liquid supply main pipe according to the total heating value of the liquid cooling unit.

[0086] Step S3, obtaining the node inlet and outlet liquid temperature difference and the real-time liquid supply mass flow rate of the liquid cooling unit.

[0087] Step S4, obtaining the real-time heat exchange capacity of the liquid cooling unit according to the node inlet and outlet liquid temperature difference and the real-time liquid supply mass flow rate.

[0088] Step S5, when the real-time heat exchange amount of the liquid cooling unit is less than the real-time heat load of the liquid cooling unit, a first control signal is generated, and the first control signal is used to control the opening of the unit flow regulating valve in the liquid cooling unit.

[0089] Step S6, calculating the node cooling capacity of the liquid cooling unit according to the real-time heat exchange of the liquid cooling unit; obtaining the total power of the electronic equipment in the liquid cooling unit according to the real-time reference power of the electronic equipment in the liquid cooling unit and the fluctuating power of the heating element.

[0090] Step S7, when the total power of the electronic equipment in the liquid cooling unit is greater than the node cooling capacity of the liquid cooling unit, the surface temperature of the heating element in the electronic equipment is obtained.

[0091] Step S8, when the surface temperature of the heating element exceeds a preset temperature threshold, a second control signal is generated, and the second control signal is used to turn on the jet unit in the liquid cooling unit.

[0092] The AI ​​intelligent control unit integrates three layers of AI intelligent control logic, and performs hierarchical control based on different cooling requirements and monitoring data. The execution order of the control logic varies from system global control to local fine-tuning according to the urgency of the cooling requirements.

[0093] The first layer of control logic focuses on the overall heat dissipation balance of the system, including first obtaining the real-time reference power of the electronic equipment in each liquid cooling module through the power sensor, and calculating the total heat generation of the system according to equations (2) and (3). Then, the flow rate of the circulating main pump is intelligently adjusted according to the total heat generation to ensure that the coolant flow can be distributed on demand, thereby maintaining the overall heat dissipation balance of the system. If the heat exchange is insufficient, the system will automatically adjust the speed of the circulating main pump and increase the coolant supply flow rate to meet the preset reference heat exchange of each liquid cooling module, ensuring that the electronic equipment operates within a safe temperature range.

[0094] The second layer of control logic focuses on the heat dissipation requirements of a single liquid cooling module, including setting the opening of the unit flow control valve according to the real-time benchmark power of the electronic equipment in each liquid cooling module, the temperature difference between the inlet and outlet liquids of the liquid cooling module, and the real-time liquid supply mass flow, so as to adjust the heat exchange capacity of the liquid cooling module node to meet the heat dissipation requirements of a single liquid cooling module. This layer of control logic ensures that after the main cooling flow is distributed, the liquid cooling module can maintain a stable heat exchange efficiency to prevent the performance of individual units from being affected by insufficient coolant.

[0095] The third layer of control logic is to perform refined enhanced cooling of local hot spots, including judging the heat dissipation requirements of the heating elements by monitoring the surface temperature data of the heating elements in the electronic device. Once the surface temperature of the heating element is detected to exceed the set maximum threshold, the nozzle control valve of the jet unit is controlled to open, and forced convection heat exchange is started to perform local enhanced cooling of the local high heat load heating element. In some embodiments, the heating element is a high power consumption chip, and the preset temperature threshold can be the chip junction temperature value. The relationship between the chip thermal resistance R and the chip junction temperature of the high power consumption chip is shown in formula (8):

[0096]

[0097] Where, T j Indicates the chip junction temperature, that is, the actual maximum temperature of the chip in the electronic device, T s is the surface temperature of the device package, and P is the heat generation power of the chip. When the surface temperature value T measured by the temperature sensor on the chip surface s Reach or approach the chip junction temperature T j When the chip is approaching its thermal limit, there is a risk of overheating. In order to prevent the chip from overheating, the AI ​​intelligent control unit will control the nozzle control valve of the corresponding jet unit to open to perform local enhanced cooling of the chip. The specific steps of the above three layers of control logic can refer to the above embodiments. The three layers of control logic work together to ensure that the distributed full liquid cooling device can operate efficiently and safely.

[0098] The control method of the distributed full liquid cooling device of the present embodiment ensures the overall heat dissipation balance of the system by adjusting the flow rate of the low-temperature coolant in the liquid supply main pipe according to the total heat generation, and accurately controls the low-temperature coolant flow of each liquid cooling module based on the inlet and outlet temperature difference of the liquid cooling module, the real-time liquid supply mass flow rate and the real-time reference power of the electronic equipment, thereby meeting the heat dissipation demand of a single liquid cooling module; at the same time, by controlling the opening state of the jet unit according to the surface temperature of the heating element in the electronic equipment, the heating element can be locally enhanced cooled, thereby avoiding the occurrence of local hot spots.

[0099] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A distributed full liquid cooling device, characterized in that: The device comprises a liquid cooling distribution module, a liquid supply main pipe, a liquid return main pipe and a plurality of liquid cooling modules, each of the liquid cooling modules comprises a liquid cooling unit, a jet unit, a liquid storage unit, a unit flow regulating valve, a liquid inlet temperature detection unit, a liquid outlet temperature detection unit and a first liquid supply mass flow detection unit; the liquid cooling unit is used to place electronic equipment, the liquid outlet of the liquid cooling distribution module is connected to the liquid supply main pipe, the liquid supply main pipe is connected to the liquid inlet of each of the liquid cooling units through the unit flow regulating valve, the liquid outlet of each of the liquid cooling units is connected to the liquid inlet of the liquid cooling distribution module through the liquid return main pipe, and the liquid inlet of the liquid supply main pipe is provided with a second liquid supply mass flow detection unit; the jet unit is fixed to the liquid outlet of the liquid storage unit, and the liquid outlet of the jet unit is arranged opposite to the heating element in the electronic equipment; The liquid cooling distribution module is used to adjust the flow rate of the low-temperature cooling liquid in the liquid supply main pipe according to the total heat generation of the liquid cooling unit; The liquid cooling distribution module is also used to generate a first control signal according to the inlet and outlet temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate and the real-time reference power of the electronic device; the first control signal is used to control the opening of the unit flow regulating valve; The liquid cooling distribution module is also used to generate a second control signal according to the surface temperature of the heating element, and the second control signal is used to control the opening of the jet unit.

2. The distributed full liquid cooling device according to claim 1, characterized in that: The liquid cooling distribution module includes a cooling tower, a plate heat exchanger, a pre-pump liquid storage tank, a circulating main pump and an AI intelligent control unit; the plate heat exchanger is used to convert the high-temperature coolant in the liquid return main pipe into a low-temperature coolant, and transmit the low-temperature coolant to the pre-pump liquid storage tank, and the cooling tower provides cooling circulating water for the plate heat exchanger; The pre-pump liquid storage tank is used to temporarily store the low-temperature coolant output from the plate heat exchanger; the circulating main pump is used to transfer the low-temperature coolant temporarily stored in the pre-pump liquid storage tank to the liquid supply main pipe; The AI ​​intelligent control unit is used to adjust the speed of the circulating main pump according to the total heat generation of the liquid cooling unit; the AI ​​intelligent control unit is also used to generate the first control signal according to the inlet and outlet liquid temperature difference of the liquid cooling unit, the real-time liquid supply mass flow rate and the real-time reference power of the electronic device; the AI ​​intelligent control unit is also used to generate the second control signal according to the surface temperature of the heating element.

3. The distributed full liquid cooling device according to claim 1, characterized in that: The liquid outlet of the liquid cooling distribution module is connected to the liquid replenishment and discharge holes of each of the liquid storage units through a node liquid storage and supply pipe.

4. The distributed full liquid cooling device according to any one of claims 1 to 3, characterized in that: The liquid outlet of the liquid cooling distribution module is connected to the liquid supply main pipe via a dynamic balancing valve.

5. The distributed full liquid cooling device according to claim 1, characterized in that: The jet unit comprises a jet liquid pipe, a jet tube, a nozzle assembly and a nozzle control valve.

6. The distributed full liquid cooling device according to claim 1, characterized in that: The liquid inlet temperature detection unit and the liquid outlet temperature detection unit are both temperature sensors; the first liquid supply mass flow detection unit and the second liquid supply mass flow detection unit are both mass flow meters.

7. The distributed full liquid cooling device according to claim 1, characterized in that: A liquid level monitoring component is provided inside the liquid storage unit; when the liquid level of the liquid storage unit is lower than a preset liquid level threshold, the liquid level monitoring component sends a liquid level reminder signal to the liquid cooling distribution module.

8. A control method for a distributed full liquid cooling device as claimed in any one of claims 1 to 7, characterized in that: The method comprises: Step S1, obtaining the real-time heat load of each liquid cooling unit according to the real-time reference power of the electronic equipment in each liquid cooling unit, and calculating the total heat generation of the liquid cooling unit according to the real-time heat load of each liquid cooling unit; Step S2, adjusting the flow rate of the low-temperature coolant in the liquid supply main pipe according to the total heat generated by the liquid cooling unit; Step S3, obtaining the node inlet and outlet liquid temperature difference and the real-time liquid supply mass flow rate of the liquid cooling unit; Step S4, obtaining the real-time heat exchange capacity of the liquid cooling unit according to the node inlet and outlet liquid temperature difference and the real-time liquid supply mass flow rate; Step S5, when the real-time heat exchange amount of the liquid cooling unit is less than the real-time heat load of the liquid cooling unit, generating a first control signal, wherein the first control signal is used to control the opening of the unit flow regulating valve in the liquid cooling unit; Step S6, calculating the node cooling capacity of the liquid cooling unit according to the real-time heat exchange of the liquid cooling unit; obtaining the total power of the electronic equipment in the liquid cooling unit according to the real-time reference power of the electronic equipment in the liquid cooling unit and the fluctuating power of the heating element; Step S7, when the total power of the electronic equipment in the liquid cooling unit is greater than the node cooling capacity of the liquid cooling unit, obtaining the surface temperature of the heating element in the electronic equipment; Step S8, when the surface temperature of the heating element exceeds a preset temperature threshold, a second control signal is generated, and the second control signal is used to turn on the jet unit in the liquid cooling unit.

9. The control method of the distributed full liquid cooling device according to claim 8, characterized in that: The calculation formula of the real-time heat load is: Q i =ηP si In the formula, Q i is the real-time heat load of the electronic equipment in the i-th liquid cooling unit, P si is the real-time reference power of the electronic equipment in the i-th liquid cooling unit, and η is the power heating coefficient; The calculation formula of the total calorific value is: Q 总 =ηP s总 =η(P s1 +P s2 +…+P si +…+P sn ) In the formula, Q 总 is the total calorific value, P s总 is the total power consumption of all electronic devices in the liquid cooling unit, P si is the benchmark power consumption of the electronic equipment in the i-th liquid cooling unit, and n is the number of liquid cooling units; The step S2 comprises: Step S21, obtaining a target coolant mass flow rate according to the total calorific value of the liquid cooling unit; wherein the calculation formula of the target coolant mass flow rate is: In the formula, q m is the target coolant mass flow rate, C q is the specific heat capacity of the coolant, ΔT is the coolant supply and return difference; Step S22, adjusting the rotation speed of the circulating main pump in the liquid cooling distribution module according to the target coolant mass flow rate.

10. The control method of the distributed full liquid cooling device according to claim 8, characterized in that: The preset temperature threshold is the chip junction temperature value.

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