Electronic device

Abstract

This application discloses an electronic device, relating to electronic products and heat dissipation. The electronic device includes: a housing, a first electrical module, a second electrical module, and a flexible circuit board; the housing has a first and a second mutually isolated receiving space, the first receiving space being filled with a heat dissipation medium, the first electrical module being disposed in the first receiving space and immersed in the heat dissipation medium, and the second electrical module being disposed in the second receiving space; the flexible circuit board is disposed in the housing, extending into the first receiving space and connected to the first electrical module, and extending into the second receiving space and connected to the second electrical module. This application can solve the problem that current heat dissipation methods cannot meet heat dissipation requirements.

Description

Technical Field

[0001] This application belongs to the technical field of electronic products and heat dissipation, and specifically relates to an electronic device. Background Technology

[0002] Electronic devices (such as mobile phones and tablets) are generally cooled passively due to their small size and limited battery capacity. However, with the continuous improvement of chip performance and network transmission speeds, heat generation is becoming increasingly severe. Cooling methods such as thermal venting (VC) and thermal films are no longer sufficient to meet the cooling requirements, affecting the maximum performance of electronic devices and leading to excessively high local surface temperatures. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device that can at least solve the problem that current heat dissipation methods cannot meet heat dissipation requirements.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: This application provides an electronic device, including: a housing, a first electrical module, a second electrical module, and a flexible circuit board; The housing has a first accommodating space and a second accommodating space that are isolated from each other. The first accommodating space is filled with a heat dissipation medium. The first electrical module is disposed in the first accommodating space and immersed in the heat dissipation medium. The second electrical module is disposed in the second accommodating space. The flexible circuit board is disposed on the housing, and the flexible circuit board extends to the first receiving space and is connected to the first electrical module, and the flexible circuit board extends to the second receiving space and is connected to the second electrical module.

[0005] In this embodiment, the housing is provided with a first and a second accommodating space that are isolated from each other. The first accommodating space is filled with a heat dissipation medium, thereby dividing the internal space of the housing into a wet zone and a dry zone. The first electrical module is disposed in the wet zone, so that the heat dissipation medium can dissipate heat and cool the first electrical module, thereby improving the heat dissipation effect of the first electrical module and preventing the temperature from becoming too high during the operation of the first electrical module. The second electrical module can dissipate heat in the dry zone, so that the temperature from becoming too high during the operation of the second electrical module can be prevented. Based on the above configuration, compared with heat dissipation methods such as VC and heat dissipation film in related technologies, this application adopts different heat dissipation methods for different electrical modules, especially by using a heat dissipation medium to further improve the heat dissipation effect of the first electrical module, so as to meet the heat dissipation requirements of the first electrical module. It can also adapt to the situation where the second electrical module cannot be cooled by a heat dissipation medium. In addition, a flexible circuit board is used to connect the first electrical module located in the wet zone and the second electrical module located in the dry zone to facilitate signal transmission. Attached Figure Description

[0006] Figure 1 This is a disassembly diagram of the electronic device disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of the internal structure of the electronic device disclosed in the embodiments of this application; Figure 3 This is a schematic diagram of an electronic device with the cover removed, as disclosed in an embodiment of this application.

[0007] Explanation of reference numerals in the attached figures: 10-Shell; 11-Middle frame; 111-First receiving groove; 112-Second receiving groove; 113-Third receiving groove; 12-Cover plate; 121-Injection hole; 21-First electrical module; 22-Second electrical module; 23-Third electrical module; 24-Fourth electrical module; 30 - Flexible circuit board; 31 - Frame; 32 - Separator strip; 40 - Liquid pump; 41 - First liquid inlet; 42 - First liquid outlet; 43 - Second liquid inlet; 44 - Second liquid outlet; 50 - Sealing strip; 60 - Deformed part; 70 - Display module; 80-Motherboard; 90-subboard; 100 - Decorative cover; 110-Fasteners. Detailed Implementation

[0008] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0009] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0010] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0011] refer to Figures 1 to 3 This application discloses an electronic device, which can be a mobile phone, tablet computer, e-reader, or other devices, without specific limitations. The disclosed electronic device includes a housing 10, a first electrical module 21, a second electrical module 22, and a flexible circuit board 30.

[0012] The housing 10 is a basic component that provides a support and mounting base for the first electrical module 21, the second electrical module 22, the flexible circuit board 30, etc., and also provides a certain degree of protection for these devices. In some embodiments, the housing 10 may have a first accommodating space and a second accommodating space that are isolated from each other. The first electrical module 21 is located in the first accommodating space, and the second electrical module 22 is located in the second accommodating space, so that the first electrical module 21 and the second electrical module 22 can be accommodated respectively.

[0013] Optionally, the first electrical module 21 is a submersible device, which may be a main chip, flash memory chip, antenna chip, high-power charging chip, etc.; the second electrical module 22 is a non-submersible device, which may be a camera, electroacoustic device, sensor, etc. In addition, the first electrical module 21 and the second electrical module 22 may also be other components, as shown in Table 1.

[0014] Table 1

[0015] In this embodiment, the electronic device may further include a display module 70, which is a non-immersion component. The flexible circuit board 30 can be connected to the sub-board 90 in the dry area via openings in the middle frame 11, thus preventing the heat dissipation medium from affecting the normal operation of the display module 70. Furthermore, the middle frame 11 can be manufactured using a sealable nano-injection molding process, and the sealing method between the middle frame 11 and the display module 70 can meet IP68 requirements.

[0016] Of course, the electronic device may also include a motherboard 80, and both the first electrical module 21 and the second electrical module 22 can be electrically connected to the motherboard 80 to facilitate signal transmission. In some embodiments, both the first electrical module 21 and the second electrical module 22 can be fixedly connected to the motherboard 80. Optionally, the motherboard 80 can be divided into multiple separate motherboard units, including a first motherboard unit and a second motherboard unit. The first motherboard unit is disposed in a first accommodating space, the first electrical module 21 is fixedly connected to the first motherboard unit, the second motherboard unit is disposed in a second accommodating space, and the second electrical module 22 is fixedly connected to the second motherboard unit.

[0017] Considering that the first electrical module 21 generates a significant amount of heat during operation, requiring higher heat dissipation efficiency, and that the first electrical module 21 possesses a certain degree of sealing performance, in this embodiment, the first accommodating space can be filled with a heat dissipation medium, immersing the first electrical module 21 in the medium. This allows the heat dissipation medium to absorb the heat emitted by the first electrical module 21 through contact with it, thereby cooling the first electrical module 21. For example, the heat generated by the first electrical module 21 can be greater than that generated by the second electrical module 22.

[0018] Optionally, the heat dissipation medium can be a refrigerant, such as fluorinated liquid, mineral oil, etc. Of course, other refrigerants can also be used, but no specific limitation is made here.

[0019] It should be noted that in this embodiment, a heat dissipation medium is used to replace the air inside the housing 10. Because the density and heat capacity of the heat dissipation medium are greater than those of air, it can absorb and carry away more heat, thus exhibiting superior heat dissipation performance. Furthermore, the heat dissipation method of the heat dissipation medium can be combined with heat pipe cooling, graphite sheet cooling, or other methods used in electronic devices to achieve even better heat dissipation.

[0020] Table 2 shows the relationship between the density, specific heat of mass, and specific heat of volume of fluorinated liquid, mineral oil, and air.

[0021] Table 2

[0022] To prevent the heat dissipation medium from affecting the second electrical module 22, the first and second accommodating spaces can be sealed to prevent the heat dissipation medium in the first accommodating space from leaking into the second accommodating space and affecting the normal operation of the second electrical module 22.

[0023] To enable signal transmission between the first electrical module 21 and the second electrical module 22, a flexible circuit board 30 is disposed on the housing 10. The flexible circuit board 30 extends into the first accommodating space and connects to the first electrical module 21, and extends into the second accommodating space and connects to the second electrical module 22. Based on this configuration, signal transmission between the first electrical module 21 and the second electrical module 22 can be achieved through the flexible circuit board 30, ensuring the normal operation of both modules. Furthermore, it also ensures mutual isolation between the first and second accommodating spaces, preventing the heat dissipation medium in the first accommodating space from leaking into the second accommodating space and affecting the normal operation of the second electrical module 22.

[0024] Optionally, the flexible circuit board 30 can be connected to a first motherboard unit located in the first receiving space to connect to the first electrical module 21 through the first motherboard unit, and can also be connected to a second motherboard unit located in the second receiving space to connect to the second electrical module 22 through the second motherboard unit.

[0025] For example, the flexible circuit board 30 can be connected to the first motherboard unit and the second motherboard unit via BTB connectors.

[0026] In this embodiment, the housing 10 is provided with a first accommodating space and a second accommodating space that are isolated from each other. The first accommodating space is filled with a heat dissipation medium. Thus, the internal space of the housing 10 can be divided into a wet area and a dry area. The first electrical module 21 is disposed in the wet area so that the heat dissipation medium can dissipate heat and cool down the first electrical module 21, thereby improving the heat dissipation effect of the first electrical module 21 and preventing the first electrical module 21 from overheating during operation. The second electrical module 22 can dissipate heat in the dry area to prevent the second electrical module 22 from overheating during operation.

[0027] Based on the above configuration, compared with heat dissipation methods such as VC and heat dissipation film in related technologies, this application adopts different heat dissipation methods for different electrical modules, especially by using a heat dissipation medium to further improve the heat dissipation effect of the first electrical module 21 to meet the heat dissipation requirements of the first electrical module 21. In addition, it can also adapt to the situation where the second electrical module 22 cannot use a heat dissipation medium for heat dissipation. Furthermore, the flexible circuit board 30 enables the connection between the first electrical module 21 located in the wet area and the second electrical module 22 located in the dry area to facilitate signal transmission.

[0028] refer to Figure 3 In this embodiment, the electronic device may further include a third electrical module 23, which is connected to the flexible circuit board 30 to facilitate signal transmission. Correspondingly, a third receiving space may also be provided within the housing 10, in which the third electrical module 23 is disposed, so that the third electrical module 23 can be accommodated and protected. Optionally, the third electrical module 23 may be a battery.

[0029] Furthermore, the third receiving space can be connected to the first receiving space, allowing the heat dissipation medium to flow between the first and third receiving spaces. Based on this, heat transfer can be achieved by the flow of the heat dissipation medium between the first and third receiving spaces.

[0030] In this embodiment, the heat generated by the third electrical module 23 can be less than that generated by the first electrical module 21, so that the temperature of the third electrical module 23 is lower than that of the first electrical module 21 during operation. In this way, the heat dissipated by the first electrical module 21 can be transferred to the lower-temperature third electrical module 23 through the heat dissipation medium, thereby improving the heat dissipation efficiency of the first electrical module 21.

[0031] It should be noted that the power for the flow of the heat dissipation medium between the first and third accommodating spaces can come from the shaking of the electronic device, which causes the heat dissipation medium to flow. In addition, a driving component can be provided to apply a driving force to the heat dissipation medium, thereby causing the heat dissipation medium to flow between the first and third accommodating spaces.

[0032] Continue to refer to Figure 3 In some embodiments, the electronic device may further include a liquid pump 40, which drives the heat dissipation medium to flow between the first and third receiving spaces. The liquid pump 40 may include a first inlet 41, a first outlet 42, a second inlet 43, and a second outlet 44, wherein the first inlet 41 and the second outlet 44 are both connected to the first receiving space, and the first outlet 42 and the second inlet 43 are both connected to the second receiving space.

[0033] Based on the above configuration, during operation, the heat dissipation medium in the first receiving space can be drawn in by the first inlet 41 and transported to the third receiving space through the first outlet 42. This allows the heat dissipation medium to transfer heat emitted from the first electrical module 21 to the relatively cooler third electrical module 23, thus cooling the first electrical module 21. Simultaneously, the relatively cool heat dissipation medium in the third receiving space can be drawn in by the second inlet 43 and transported to the first receiving space through the second outlet 44, further cooling the first electrical module 21. This circulating flow of the heat dissipation medium ensures efficient heat dissipation for the first electrical module 21, preventing overheating that could affect normal operation or even cause damage.

[0034] In some embodiments, the second accommodating space may include a plurality of discontinuous spatial units. Optionally, the plurality of discontinuous spatial units may include a first spatial unit and a second spatial unit, the second electrical module 22 may be disposed in the first spatial unit, and the fourth electrical module 24 may be disposed in the second spatial unit.

[0035] Additionally, the second spatial unit may also include a sub-board 90, which is connected to the flexible circuit board 30, and the fourth electrical module 24 is fixedly connected to the sub-board 90. For example, the fourth electrical module 24 may be a receiver, a speaker, etc. Furthermore, the sub-board 90 may also be connected to the display module 70.

[0036] refer to Figure 1 and Figure 2 In some embodiments, the housing 10 may include a middle frame 11 and a cover plate 12. The middle frame 11 is a basic component that can support and install some electrical components of the electronic device. The inner cavity of the middle frame 11 can be divided into multiple receiving slots. The cover plate 12 is disposed on the middle frame 11 and covers the openings of the multiple receiving slots, thereby forming multiple receiving spaces. Optionally, the cover plate 12 and the middle frame 11 can be connected by fasteners 110, which ensures reliable installation and facilitates disassembly.

[0037] Optionally, the fastener 110 can be a fastening screw with a silicone sealing ring. After the fastening screw fastens the cover plate 12 and the middle frame 11, the silicone sealing ring can ensure the sealing between the fastening screw and the cover plate 12.

[0038] The flexible circuit board 30 is located between the end face of the slot opening of the multiple receiving slots and the cover plate 12. In this way, the flexible circuit board 30 can be stably installed and can be spread across the multiple receiving slots to facilitate connection with the electrical modules in the corresponding receiving slots. In addition, the cooperation of the end face of the slot opening of the cover plate 12, the middle frame 11 and the flexible circuit board 30 can achieve a good seal to ensure that the receiving space filled with heat dissipation medium (e.g., the first receiving space) is isolated from the receiving space not filled with heat dissipation medium (e.g., the second receiving space), and prevents the heat dissipation medium from leaking.

[0039] Optionally, such as Figure 3 As shown, the multiple receiving slots may include a first receiving slot 111, a second receiving slot 112, a third receiving slot 113, etc., and correspondingly, after being covered by the cover plate 12, they can form a first receiving space, a second receiving space, a third receiving space, etc.

[0040] To accommodate multiple receiving slots in the middle frame 11, the flexible circuit board 30 may include a border 31 and at least one separator 32, such as Figure 1 As shown. At least one dividing strip 32 is disposed on the inner side of the frame 31, dividing the internal space enclosed by the frame 31 into multiple regions, each region corresponding to a multiple receiving slot within the middle frame 11. Based on this arrangement, the flexible circuit board 30 can avoid the openings of each receiving slot, preventing the flexible circuit board 30 from occupying space within the receiving slot and affecting the installation of electrical modules within the receiving slot.

[0041] In some embodiments, a dividing strip 32 may be provided inside the frame 31. The dividing strip 32 and a local area of ​​the frame 31 may jointly surround the opening of the second receiving groove 112. Of course, it may also surround other positions, such as the opening of the first receiving groove 111, the opening of the third receiving groove 113, etc., which can be set according to the actual working conditions.

[0042] Optionally, the border 31 and at least one divider 32 can be fixedly connected, or they can be set as a single unit.

[0043] To further improve sealing, a sealing strip 50 can be provided between the surfaces of the cover plate 12 facing the middle frame 11, such as... Figure 1 As shown, the sealing strip 50 abuts against one of the surfaces of the flexible circuit board 30. Thus, by setting the sealing strip 50, the sealing between the cover plate 12 and one of the surfaces of the flexible circuit board 30 can be guaranteed, so as to prevent the heat dissipation medium from leaking from there.

[0044] In addition, a sealing strip 50 can also be provided between the end face where the slots of the multiple receiving slots are located and the other side of the flexible circuit board 30. In this way, by setting the sealing strip 50, the sealing between the end face where the slots of the multiple receiving slots are located and the flexible circuit board 30 can be guaranteed, so as to prevent the heat dissipation medium from leaking from there.

[0045] In some more specific embodiments, the shape of the sealing strip 50 can be adapted to the shape of the flexible circuit board 30 so as to provide all-round sealing at the location of the flexible circuit board 30 and improve the sealing effect.

[0046] In some embodiments, the outer surface of the flexible circuit board 30 can be roughened to increase the roughness of the flexible circuit board 30. Optionally, the surface of the flexible circuit board 30 can be subjected to processes such as sandblasting, plasma treatment, and chemical cleaning to increase the surface roughness of the flexible circuit board 30.

[0047] Furthermore, a protective layer can be wrapped around the outside of the flexible circuit board 30 to form a barrier on the outer layer of the flexible circuit board 30. This protective layer protects the flexible circuit board 30 from contact with the heat dissipation medium. It should be noted that before applying the protective layer to the outside of the flexible circuit board 30, the outer surface of the flexible circuit board 30 can be treated to increase its surface roughness. This improves the mechanical interlocking characteristics between the protective layer and the flexible circuit board 30, thus enhancing the bonding force between them.

[0048] Optionally, the protective layer can be a polyurethane layer, or it can be a layer structure of other materials, without specific limitations here.

[0049] The thickness of the protective layer can range from 10μm to 30μm, including, for example, 10μm, 15μm, 20μm, 25μm, 30μm, etc. Of course, other thicknesses are also possible, which are not specifically limited here.

[0050] Considering that the first containment space can be a sealed space, as the temperature of the first electrical module 21 rises, the heat dissipation medium in the first containment space will increase in volume due to the temperature rise, thereby increasing the pressure in the first containment space, which may eventually lead to problems such as deformation of the shell 10 and leakage of heat dissipation medium.

[0051] Based on the above, the housing 10 in this embodiment may be provided with a deformable member 60, such as... Figure 1As shown, the deformable member 60 is correspondingly disposed to the first accommodating space, and the deformable member 60 is used to generate flexible deformation when the pressure in the first accommodating space increases or decreases. Based on this, when the heat dissipation medium in the first accommodating space expands due to the absorption of heat dissipated by the first electrical module 21, the deformable member 60 can be flexibly deformed by the heat dissipation medium squeezing it, thereby adapting to the increase in volume caused by the increase in the temperature of the heat dissipation medium, effectively alleviating the problem of deformation of the shell 10 and leakage of the heat dissipation medium caused by excessive pressure in the first accommodating space.

[0052] Optionally, the deformable part 60 can be made of silicone, or of course, other materials, without specific limitations.

[0053] In some embodiments, the deformable part 60 and the housing 10 can be injection molded with liquid silicone to ensure a tight bond between the deformable part 60 and the housing 10 and to prevent leakage.

[0054] In some more specific embodiments, the silicone component can be bonded to the cover plate 12 included in the housing 10 by liquid silicone injection molding to achieve a tight bond and ensure that no leakage problem occurs.

[0055] In other embodiments, the deformable member 60 may also be provided corresponding to the third accommodating space, or respectively corresponding to the first accommodating space and the third accommodating space, to accommodate the thermal expansion of the heat dissipation medium.

[0056] Continue to refer to Figure 1 In some embodiments, the side wall of the housing 10 may also be provided with a liquid injection hole 121, which is connected to the first accommodating space, so that heat dissipation medium can be injected into the first accommodating space through the liquid injection hole 121.

[0057] In other embodiments, the injection hole 121 may also communicate with a third receiving space to facilitate the injection of a heat dissipation medium into the third receiving space.

[0058] To achieve a seal, the electronic device may also include a plug that is detachably connected to the injection port 121 to ensure a tight seal at the injection port 121 and prevent leakage of the heat dissipation medium.

[0059] Optionally, the sealing component can be a screw with a silicone sealing ring. After the screw is screwed into the injection hole 121, the silicone sealing ring can ensure the sealing between the screw and the injection hole 121.

[0060] It should be noted that before injecting the heat dissipation medium, the airtightness of the first and third containment spaces can be tested using an airtightness tester. The heat dissipation medium can only be injected after the test is passed.

[0061] refer toFigure 1 and Figure 2 In some embodiments, the electronic device may also include a decorative cover 100, which can be attached to the cover plate 12 of the housing 10 with double-sided adhesive to improve the appearance of the housing 10. Furthermore, since there is no leakage of the heat dissipation medium, a sealing structure is not required between the decorative cover 100 and the cover plate 12.

[0062] The heat dissipation method in this application embodiment can be applied to electronic devices that generate a lot of heat, such as CPUs, GPUs, 5G, and fast charging devices. It can reduce the temperature of the electrical module through efficient heat dissipation, thereby ensuring the operating performance of the electrical module. In addition, the heat dissipation area can be dispersed by the flow of heat dissipation medium, which is beneficial to improving the user experience.

[0063] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: Housing (10), first electrical module (21), second electrical module (22) and flexible circuit board (30); The housing (10) has a first accommodating space and a second accommodating space that are isolated from each other. The first accommodating space is filled with a heat dissipation medium. The first electrical module (21) is located in the first accommodating space and is immersed in the heat dissipation medium. The second electrical module (22) is located in the second accommodating space. The flexible circuit board (30) is disposed on the housing (10), and the flexible circuit board (30) extends to the first accommodating space and is connected to the first electrical module (21), and the flexible circuit board (30) extends to the second accommodating space and is connected to the second electrical module (22).

2. The electronic device according to claim 1, characterized in that, The electronic device further includes a third electrical module (23) connected to the flexible circuit board (30), wherein the heat generation of the third electrical module (23) is less than that of the first electrical module (21); The housing (10) is further provided with a third accommodating space, and the third electrical module (23) is disposed in the third accommodating space. The third accommodating space is connected to the first accommodating space so that the heat dissipation medium can flow between the first accommodating space and the third accommodating space.

3. The electronic device according to claim 2, characterized in that, The electronic device also includes a liquid pump (40), which includes a first liquid inlet (41), a first liquid outlet (42), a second liquid inlet (43), and a second liquid outlet (44). Both the first liquid inlet (41) and the second liquid outlet (44) are connected to the first accommodating space; Both the first liquid outlet (42) and the second liquid inlet (43) are connected to the third accommodating space.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The housing (10) includes a middle frame (11) and a cover plate (12), the inner cavity of the middle frame (11) being divided into multiple receiving slots; The cover plate (12) is provided on the middle frame (11) and covers the openings of the plurality of receiving slots to form a plurality of receiving spaces; The flexible circuit board (30) is located between the end face of the slots of the plurality of receiving slots and the cover plate (12).

5. The electronic device according to claim 4, characterized in that, The flexible circuit board (30) includes a frame (31) and at least one separator (32); The at least one dividing strip (32) is located on the inner side of the frame (31) and divides the internal space enclosed by the frame (31) into multiple regions, and the multiple regions are respectively provided with multiple receiving slots in the middle frame (11).

6. The electronic device according to claim 4, characterized in that, The cover plate (12) facing the middle frame (11) and the end face where the slots of the plurality of receiving grooves are located are respectively provided with sealing strips (50), and the sealing strips (50) abut against the two plate surfaces opposite to the flexible circuit board (30).

7. The electronic device according to claim 4, characterized in that, The outer surface of the flexible circuit board (30) is a rough surface; And / or, the flexible circuit board (30) is wrapped with a protective layer on the outside, the protective layer being a polyurethane layer, the thickness of the protective layer being in the range of 10μm to 30μm.

8. The electronic device according to any one of claims 1 to 3, characterized in that, The housing (10) is provided with a deformable member (60), which is correspondingly provided with the first accommodating space. The deformable member (60) is used to deform when the pressure in the first accommodating space increases or decreases.

9. The electronic device according to claim 8, characterized in that, The deformable part (60) is a silicone part, and the silicone part and the shell (10) are injection molded with liquid silicone.

10. The electronic device according to any one of claims 1 to 3, characterized in that, The side wall of the housing (10) is provided with a liquid injection hole (121), which is connected to the first accommodating space; The electronic device also includes a plugging component that is detachably connected to the injection port (121).

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