83 results about "Organic solderability preservative" patented technology

A method of manufacturing a printed circuit board (PCB) includes of disposing thermal transfer vias and electrical vias through the PCB. The method further includes filling holes of the vias with a solder mask. The thermal transfer vias are filled to about 70% of capacity while the electrical vias are completely filled. Once filled, surfaces of the PCB are coated with an organic solderability preservative.

The invention belongs to the circuit board production technical field and relates to a method for producing an organic solderability preservative on the surface of a circuit board. According to the method of the invention, sand blasting and board grinding procedures are omitted in a pretreatment process, and technological parameters of pickling and micro-etching are adjusted, and therefore, the problem of the smash of fine sands onto a board surface and the problem of high roughness and unevenness of a copper surface when a grinding brush is adopted to perform board grinding can be solved, and the roughness of the copper surface of the circuit board can be moderate and uniform, and the thickness of a formed organic film can be basically consistent with the thickness of etched copper; the circuit board is arranged in an antioxidant cylinder before the production of the organic film, a cylinder dragging plate is adopted to perform cylinder dragging processing at first, so that impurities in an antioxidant solution can be removed, and production parameters can be stabilized, and the concentration of Cu<2+> in the solution is controlled below 15ppm, and therefore, the organic film can be effectively prevented from blackening or color difference of the organic film can be effectively prevented, and yield can be improved; technological methods and parameters in various links are modified, and optimal parameter combinations can be explored, and therefore, the color of the organic film formed on the copper surface can be uniform.

A circuit board, in one embodiment a printed wiring board (PWB); in a second embodiment a substrate for an ASIC (Application Specific Integrated Circuit) or Chip Carrier; and a method of manufacturing the same. In one embodiment, the PWB, ASIC or Chip Carrier includes: (1) a substrate having a conductive trace located thereon and (2) a combined, multi-purpose surface finish utilizing an electroless or electrolytically deposited nickel under-plate finished with a coating of an organic solderability preservative (OSP) and is located on at least a portion of the conductive areas (trace, pad, fingers, etc), which forms both a non-contact finish and a contact finish for the PWB, ASIC or Chip Carrier.

In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.

A method of cleaning a board includes dipping a board having a surface on which an organic solderability preservative (OSP) is provided into a cleaning solution having glycolic acid, a surfactant and water.

The invention discloses an organic solderability preservative (OSP) on the surface of a printed circuit board and a presoaking stoste and a presoaking method for manufacturing the OSP. The presoaking stoste for manufacturing the OSP on the surface of the printed circuit board comprises the following components of: 1 to 30 g / L of benzotriazole, 1 to 10 g / L of N-(2-ethoxy)quadrol-N,N',N'-nitrilotriacetic-acid, 5 to 30 g / L of alkaline stabilizer, 1 to 10 g / L of pH buffering agent and 200 to 300 g / L organic solvent. The presoaking method for manufacturing the OSP on the surface of the printed circuit board comprises the following steps of: preparing a presoaking bath solution, adjusting the pH value and forming a nano thin film. The OSP on the surface of the printed circuit board is prepared by presoaking by the presoaking method for manufacturing the OSP on the surface of the printed circuit board, and then forming an OSP film. The presoaking stoste for manufacturing the OSP on the surface of the printed circuit board is high in stability and long in service life; the presoaking method for manufacturing the OSP on the surface of the printed circuit board is simple in process, and the conditions are easy to control; the obtained OSP has high adhesive force and high temperature resistance, and is uniform and compact, so that the solderability of the finished printed circuit board is improved.

An assembly of substrate packages interconnected with flex cables. The assembly allows input / output (I / O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing detachable inter-package flex cable connection. The flex cable comprises a transmission region that includes a plurality of signal traces and a ground plane. A plurality of solder mask strips are disposed on the plurality of signals traces to provide anchoring for the signal traces. The solder mask strips intersect the signals traces. The exposed signal traces and the ground plane are coated with organic solderability preservative material. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I / O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I / O contact pads.

An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.

A process is described for treating metal surfaces printed wiring boards and similar substrates to provide improved creep corrosion resistance on such surfaces. A modified organic solderability preservative composition is used in combination with an emulsion polymer to provide a modified polymer coating on the metal surface finish via a chemical reaction to provide enhanced corrosion protection of the surface.

An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.

The invention discloses low-temperature solubilizer of organic solderability preservative (OSP), which is mainly used for the technologies of anti-oxidation and soldering in manufacturing industry of printed-circuit boards. A layer of organic film is chemically grown on the surface of cleaning bare copper, wherein the film has oxidation resistance, thermal shock resistance and wet fastness for protecting the surface of copper. With the volatility of dissolvent of the organic solderability preservative and the dissolubility of main agent, low-temperature precipitated crystalloid is generated in the process of production to influence the practical use of the OSP technology. The patent improves the problems that the OSP has worse stability under low temperature and is easily crystallized, and the like. By adding the low-temperature solubilizer, the invention increases the low-temperature dissolubility of the main agent of the OSP, so that the OSP still has good stability when the temperature is reduced below 5 DEG C.

The present invention provides an improved method of enhancing the solderability of a copper surface comprising the steps of contacting one or more copper surfaces with a pretreatment composition comprising a dilute solution of an aliphatic carboxylic acid and an additive selected from the group consisting of amines and ammonia and thereafter contacting the one or more surfaces with an organic solderability preservative composition. The improved organic solderability preservative process of the invention forms a more uniform coating that has a better appearance and color.

The invention relates to organic solderability preservative technology, in particular to imidazole derivative solution capable of being used as an organic solderability preservative, which is used for the organic solderability preservative process of copper or copper alloy on a printed circuit board. The solution comprises the following components in percentage by weight: 0.05 to 10 percent of imidazole derivatives, 0.01 to 30 percent of acidic materials and 0.0001 to 10 percent of water-soluble metal salt. Compared with the prior art, the solution has the advantages that: a layer of organic solderability preservative film with the thickness of 0.1 to 1.0 micrometer is uniformly formed on the surface of the copper or the copper alloy of the printed circuit board, so that the printed circuit board has excellent solderability and has excellent high temperature resistance and oxidation resistance in a high-temperature high-humidity environment.