3 results about "Organic solderability preservative" patented technology

The invention discloses a preparation method of an organic solderable protective film, which comprises the following steps: carrying out controllable micro-etching treatment on the surface of a metal substrate, so that the arithmetic mean roughness of the surface of the metal substrate is less than or equal to 0.20 mu m, and microscopic bulges on the surface of the metal substrate are of smooth hill-shaped structures; and performing preimpregnation treatment and OSP film forming treatment on the surface of the metal substrate in sequence to form the organic weldability protective film. According to the method disclosed by the invention, the uniformity of the organic weldability protective agent film layer and the reliability of high temperature resistance and chemical corrosion resistance are improved by accurately regulating and controlling the microstructure of the copper surface.

This invention discloses a method for reworking organic solder resist film on circuit boards, belonging to the field of circuit board technology. The method involves using a stripping solution to remove defective organic solder resist film from defective areas of the circuit board, cleaning the residual liquid in the defective area and drying it, then reapplying organic solder resist film solution to the defective area and waiting for a preset time to allow the solution to adhere and form an uncured film. Afterwards, the residual solution is cleaned and the area is dried, and the defective area is heated to cure the solution into a good organic solder resist film. This method enables the rework of the organic solder resist film on the circuit board, reducing waste.

The invention discloses a circuit board routing finger surface glue injection port surface treatment device and process, and belongs to the technical field of circuit board manufacturing. According to the invention, an OSP organic solderability preservative process is adopted to replace nickel-gold plating. In order to realize automatic and efficient execution of the process, the matched device comprises an annular treatment assembly provided with a plurality of treatment grooves, a rotating assembly driven by a driving motor to rotate, a plurality of clamping assemblies distributed on the rotating assembly in an annular array, and a fixed guide assembly. During revolution, the clamping assembly is matched with a track of the guide assembly to achieve lifting, and is matched with a convex ring of the guide assembly to achieve clamping and releasing, so that continuous cycle operation of feeding, micro-etching, cleaning, OSP film forming, final cleaning and drying and discharging is automatically completed. According to the invention, the production cost is reduced by more than 75%, the wastewater is nearly zero-pollution discharged, and the high efficiency, stability and flexibility of the treatment process are ensured through pure mechanical linkage and adjustable track design.