9 results about "Organic solderability preservative" patented technology

The invention discloses a preparation method of an organic solderable protective film, which comprises the following steps: carrying out controllable micro-etching treatment on the surface of a metal substrate, so that the arithmetic mean roughness of the surface of the metal substrate is less than or equal to 0.20 mu m, and microscopic bulges on the surface of the metal substrate are of smooth hill-shaped structures; and performing preimpregnation treatment and OSP film forming treatment on the surface of the metal substrate in sequence to form the organic weldability protective film. According to the method disclosed by the invention, the uniformity of the organic weldability protective agent film layer and the reliability of high temperature resistance and chemical corrosion resistance are improved by accurately regulating and controlling the microstructure of the copper surface.

The invention provides an organic solderability preservative and a preparation method for forming a protective film on the surface of copper, the organic solderability preservative comprises the following components in parts by weight: 3.0-4.5 parts of 2-(3, 4-dichlorobenzyl) benzimidazole, 52.5 parts of acetic acid, 0.75 part of n-heptanoic acid, 0.25-0.5 part of zinc acetate, 0.25-0.5 part of copper sulfate, 0.2 part of citric acid modified nano cerium oxide, and the balance of deionized water and a pH regulator; the preparation method for forming the protective film on the copper surface comprises the following steps: oil removal treatment: treating a circuit board in a sodium hydroxide solution; pickling treatment: treating in a sulfuric acid solution; micro-etching treatment: treating in a solution of sodium persulfate and sulfuric acid; pickling treatment: treating in a sulfuric acid solution; film forming treatment: dipping in an organic solderability preservative at 45 DEG C;

The invention relates to the field of film adhesive force measurement, in particular to an adhesive force measurement method and system for an OSP organic solderability preservative film, and the method comprises the steps: detecting the surface of the OSP organic solderability preservative film to be measured by using an electron microscope SEM for preliminary evaluation; independently sampling the to-be-measured OSP organic solderability preservative which passes the preliminary evaluation to obtain an OSP organic solderability preservative sample group; respectively selecting one sample from the OSP organic solderability preservative sample group, and carrying out scratch test, thermal cycle test and tensile test; the critical load obtained by the scratch test, the film layer change condition obtained by the thermal cycle test and the adhesive force strength data obtained by the tensile test are systematically and comprehensively analyzed, and by constructing a mathematical model, various data are weighted and calculated to obtain an adhesive force measured value. According to the invention, the adhesive force of the OSP organic solderability preservative is evaluated through comprehensive dimensions, and the accuracy and reliability of the measurement of the adhesive force of the OSP organic solderability preservative are improved.

A surface acoustic wave wafer level package includes a substrate, an interdigital transducer (IDT) formed on the substrate, a sidewall formed on the substrate along a periphery of the IDT, a cover formed above the sidewall and the IDT to form a hollow above the IDT with the sidewall, a connection electrode formed on the substrate and extending outward from a periphery of the sidewall, a connection terminal electrically connected to a part of the connection electrode which extends outward from the periphery of the sidewall, and an organic solderability preservative coating layer formed on at least a top surface of the connection terminal.

The anti-oxidation capacitor core comprises a main body, a conductive part and a protection part, the conductive part comprises an upper electrode layer and a lower electrode layer, and the protection part comprises an upper protection layer and a lower protection layer; the upper protective layer is fixed at the upper end of the main body through the upper electrode layer; the lower protective layer is fixed at the lower end of the main body through the lower electrode layer; the upper electrode layer and the lower electrode layer are both made of metal powder, and the upper protective layer and the lower protective layer are both made of organic solderability preservative films. Through arranging the conductive part and the protection part, the upper protection layer effectively protects the upper electrode layer and the upper end of the main body, and the lower protection layer effectively protects the lower electrode layer and the lower end of the main body, thereby preventing the surface of the conductive part and the metal in the main body from being oxidized or vulcanized, improving the protection performance of the main body, and guaranteeing the performance of the capacitor core. And the service life of the capacitor core is prolonged.

Provided is a printed circuit board including a substrate structure having a first surface including a chip mounting region on which a semiconductor chip is mounted and a second surface opposite to the first surface, the second surface having a rectangular shape having a first edge, a second edge, a third edge, and a fourth edge and a first corner, a second corner, a third corner, and a fourth corner formed by the first to fourth edges, and pad patterns disposed on the second surface of the substrate structure, wherein the second surface includes a first region including a region corresponding to the chip mounting region and in contact with the first to fourth edges of the second surface, respectively, and second regions adjacent to the first to fourth corners of the second surface, respectively and spaced apart from each other by the first region, wherein the pad patterns include first pad patterns disposed in the first region and surface-treated with a nickel / gold (Ni / Au) layer, and second pad patterns disposed in the second regions and surface-treated with an organic solderability preservative.

This invention discloses a method for reworking organic solder resist film on circuit boards, belonging to the field of circuit board technology. The method involves using a stripping solution to remove defective organic solder resist film from defective areas of the circuit board, cleaning the residual liquid in the defective area and drying it, then reapplying organic solder resist film solution to the defective area and waiting for a preset time to allow the solution to adhere and form an uncured film. Afterwards, the residual solution is cleaned and the area is dried, and the defective area is heated to cure the solution into a good organic solder resist film. This method enables the rework of the organic solder resist film on the circuit board, reducing waste.

The invention discloses a circuit board routing finger surface glue injection port surface treatment device and process, and belongs to the technical field of circuit board manufacturing. According to the invention, an OSP organic solderability preservative process is adopted to replace nickel-gold plating. In order to realize automatic and efficient execution of the process, the matched device comprises an annular treatment assembly provided with a plurality of treatment grooves, a rotating assembly driven by a driving motor to rotate, a plurality of clamping assemblies distributed on the rotating assembly in an annular array, and a fixed guide assembly. During revolution, the clamping assembly is matched with a track of the guide assembly to achieve lifting, and is matched with a convex ring of the guide assembly to achieve clamping and releasing, so that continuous cycle operation of feeding, micro-etching, cleaning, OSP film forming, final cleaning and drying and discharging is automatically completed. According to the invention, the production cost is reduced by more than 75%, the wastewater is nearly zero-pollution discharged, and the high efficiency, stability and flexibility of the treatment process are ensured through pure mechanical linkage and adjustable track design.

Provided is a printed circuit board including a substrate structure having a first surface including a chip mounting region on which a semiconductor chip is mounted and a second surface opposite to the first surface, the second surface having a rectangular shape having a first edge, a second edge, a third edge, and a fourth edge and a first corner, a second corner, a third corner, and a fourth corner formed by the first to fourth edges, and pad patterns disposed on the second surface of the substrate structure, wherein the second surface includes a first region including a region corresponding to the chip mounting region and in contact with the first to fourth edges of the second surface, respectively, and second regions adjacent to the first to fourth corners of the second surface, respectively and spaced apart from each other by the first region, wherein the pad patterns include first pad patterns disposed in the first region and surface-treated with a nickel / gold (Ni / Au) layer, and second pad patterns disposed in the second regions and surface-treated with an organic solderability preservative.