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Organic solderability preservative (OSP) is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering.
Method for reworking organic solderability preservative film of circuit board
This invention discloses a method for reworking organic solder resist film on circuit boards, belonging to the field of circuit board technology. The method involves using a stripping solution to remove defective organic solder resist film from defective areas of the circuit board, cleaning the residual liquid in the defective area and drying it, then reapplying organic solder resist film solution to the defective area and waiting for a preset time to allow the solution to adhere and form an uncured film. Afterwards, the residual solution is cleaned and the area is dried, and the defective area is heated to cure the solution into a good organic solder resist film. This method enables the rework of the organic solder resist film on the circuit board, reducing waste.
Owner:HESHAN SHIYUN CIRCUIT TECH CO LTD