34results about How to "Good tinning effect" patented technology

The invention discloses a high heat-resistance organic solder ability preservative. It is characterized by consisting of an aromatic phenol oxygen absorbent, an imidazole compound, an organic acid, a solubilizer, a metallic compound and deionized water. After being coated on the surface of a copper plate, the heat-resistance organic solder ability preservative can inhibit the oxidation of the copper surface of a circuit board, particularly can avoid the color-changing oxidation of copper surface during multiple high-temperature treatments, and can keep the excellent solderability of copper surface of the circuit board, improve weldability and guarantee the successful follow-up welding.

The invention relates to novel lead-free halogen-free hot air leveling scaling powder. By the weight percent, the scaling powder is prepared by components as follows: 10-70% of polyether, 10-70% of polyethylene glycol, 0.1-0.5% of special perfluorinated surfactant, 10-50% of de-ionized water, 0.1-10% of butanedioic acid, 0.1-10% of adipic acid, 0.1-10% of suberic acid, 1-20% of absolute ethyl alcohol, 1-20% of methyl alcohol and 0.1-10% of benzotriazole. The novel lead-free halogen-free hot air leveling scaling powder is used and can obviously strengthen soldering performance of small pads and small holes in the surface of a circuit board. The situation that integrated circuits (ICs) can not be interconnected is guaranteed. Moreover, residuals on the surface of the board are easy to clean. Residuals of a solder machine are high temperature resistant, smoke is very small, odor is light, and in comparison with other products, the working environment is better cleaned.

The invention discloses a neutral tin-plating addition agent. The neutral tin-plating addition agent is characterized by being prepared from the following raw materials in percentage by weight: 20%-30% of a complexing agent, 1%-3% of a wetting agent, 1%-5% of a surfactant, 10%-20% of a pH regulator and the balance of water. According to the neutral tin-plating addition agent, dangerousness and pollution caused by an acidic addition agent in the prior art are avoided, stable performance can be maintained at different temperatures, the storage life of products is prolonged, the stability of tin-plating liquid containing the neutral tin-plating addition agent is good while the uniform plating capability and the penetration capability are ensured, and a good tin-plating effect can be realizedwithin the large electroplating temperature range.

The invention discloses a semi-automatic wicking machine comprising a workbench, a fixing plate and a tin melting furnace. The semi-automatic wicking machine is characterized by further comprising a wicking groove, a soldering flux groove, a wiring plate, a guide rail, a first up-and-down moving device, a horizontal driving device and a second up-and-down moving device. The wicking groove is arranged above an opening of the tin melting furnace, the first up-and-down moving device is connected with the wicking groove, the soldering flux groove is arranged above the workbench, the second up-and-down moving device is connected with the wiring plate, the back end of the second up-and-down moving device is connected with the guide rail arranged on the fixing plate, and the horizontal driving device arranged on the fixing plate is connected with the second up-and-down moving device. The invention solves the problem that woven flare opening and bulging usually generate, the wicking length isinconsistent, and the sizes of finished produces are unstable due to the hard guarantee of the appearance and the quality of products because wire rods are wicked manually in prior art, and provides a semi-automatic wicking machine with unity in wicking, order appearance and good size consistency.

The invention provides an organic metal solder protection film and its preparation method. The new surface treatment method is an innovative process technology between organic solder protection film and metallized surface treatment, that is, to create a layer of physical isolation protection layer , the protective layer is composed of a main plating layer and an organic protective layer, the main plating layer includes silver metal and organic metal, the main plating layer is located on the surface of the circuit board, and the organic protective layer is located on the surface of the main plating layer. This organometallic solder protection film not only has all the properties of OSP film, but also has the surface treatment performance of type chemical silver. Giovanni effect.

The invention discloses a lead-free solder environmental-protection scaling powder used for soldering a capacitor with a film adhered on a surface, which contains 4-17 percent of rosin and derivates thereof, 3-9 percent of organic acid activating agent, 1.5-3.5 percent of diethylamine hydrochloride and / or cyclohexylamine hydrochloride, 0.3-0.7 percent of surface active agent and 70-90 percent of dissolvant. Firstly, the rosin and the derivate thereof, the organic acid activating agent and the diethylamine hydrochloride and / or the cyclohexylamine hydrochloride are added to the dissolvant to bestirred evenly; then the surface active agent is added to be continuously stirred evenly; and finally, the solution is filtered by gauze so as to remove solid impurities, and finally, light yellow clear and transparent liquid is obtained. The solder has the advantages of strong wetting power and superior solderability and can improve the soldering performance of the lead-free solder; the solderedsoldering tin has even spreading, bright and smooth surface, high surface insulation resistance and superior electrical property and meets the environmental protection requirements.

The invention relates to the field of electric machining equipment, and discloses a gear lifting copper bar busbar joint tin enameling device. The device comprises a base, a tin melting mechanism, a gear copper bar lifting mechanism, a copper bar fixing mechanism and a copper bar wiping mechanism; the gear copper bar lifting mechanism includes a main bearing column, a lifting main support frame and a gear lifting adjusting mechanism; the main bearing column is vertically arranged on the base; the gear lifting adjusting mechanism is mounted on the main bearing column; the main bearing column is provided with a clamping groove; the lifting main support frame is vertically fixed in the clamping groove; the copper bar fixing mechanism is fixed on the lifting main support frame; the tin melting mechanism is arranged on the base; and the copper bar wiping mechanism includes a stepped transmission part, and two sets of wiping parts, wiping parts support frames, return springs and wiping part positioning plates arranged in a mirror image manner. The device can realize semi-automatic tin enameling of copper bar busbar joints, is high in working efficiency, excellent in tin enameling effect, high in safety and low in manufacturing cost, and facilitates popularization.

The invention discloses a novel optical heater and a preparation method thereof. The novel optical heater comprises ITO conductive glass, and two opposite sides of the ITO conductive glass are respectively provided with electrode strip mechanisms; And the A-type low-temperature curing conductive copper glue, the B-type low-temperature curing conductive copper glue and the tin-plated copper sheet fixed on the surface of the ITO conductive glass; solve the problem that the traditional electrode strips need to be cured at a higher temperature, which is easy to make heating Changes in the coating layer of the glass lead to a deviation of the square resistance value, and the increase of the square resistance value reduces the heating power of the heater glass, and the heating effect is not as good as the expected design effect. At the same time, the deviation of the square resistance value has no effective linearity Prediction of the law seriously affects the quality and reliability of the product.

The invention relates to the field of electrical machining equipment and discloses a lever lifting type copper bar busbar joint tinning device. The lever lifting type copper bar busbar joint tinning device comprises a base, a tin melting mechanism, a lever type copper bar lifting mechanism, a copper bar fixing mechanism and a copper bar wiping mechanism. The lever type copper bar lifting mechanism comprises a main bearing pillar, a lifting type main supporting frame and a lever type lifting adjusting mechanism. The main bearing pillar is vertically arranged on the base, and the lifting type main supporting frame is fixed in a clamping groove of the main bearing pillar. The lever type lifting adjusting mechanism comprises a lifting operation lever, a fulcrum of the lifting operation lever is connected to the main bearing pillar in a pivotal manner, and the tail end of the lifting operation lever is connected to the lifting type main supporting frame in a pivotal manner. The copper bar fixing mechanism is fixed to the lifting type main supporting frame. The tin welding mechanism is arranged on the base. By means of the lever lifting type copper bar busbar joint tinning device, tinning work can be semi-automatically conducted on a copper bar busbar joint, the work efficiency is high, the tinning effect is good, safety is good, in addition, the manufacturing cost is low, and popularization is facilitated.