Novel lead-free halogen-free hot air leveling scaling powder

Abstract

The invention relates to novel lead-free halogen-free hot air leveling scaling powder. By the weight percent, the scaling powder is prepared by components as follows: 10-70% of polyether, 10-70% of polyethylene glycol, 0.1-0.5% of special perfluorinated surfactant, 10-50% of de-ionized water, 0.1-10% of butanedioic acid, 0.1-10% of adipic acid, 0.1-10% of suberic acid, 1-20% of absolute ethyl alcohol, 1-20% of methyl alcohol and 0.1-10% of benzotriazole. The novel lead-free halogen-free hot air leveling scaling powder is used and can obviously strengthen soldering performance of small pads and small holes in the surface of a circuit board. The situation that integrated circuits (ICs) can not be interconnected is guaranteed. Moreover, residuals on the surface of the board are easy to clean. Residuals of a solder machine are high temperature resistant, smoke is very small, odor is light, and in comparison with other products, the working environment is better cleaned.

Description

[0001] [0002] 【Technical field】 [0003] The invention belongs to the field of tin-spraying technology, and in particular relates to a novel lead-free and halogen-free tin-spraying flux. [0004] 【Background technique】 [0005] Lead-free electronic products is a worldwide environmental protection requirement. The tin-spray fluxes used in the past generally contain halogens. In addition, the integration of electronic products (especially military electronic products) is getting higher and higher, and the design of circuit boards is becoming more and more complicated. It is getting more and more refined, and the requirements for ion pollution on the board surface are getting higher and higher. Therefore, lead-free and halogen-free fluxes have been born on the market to increase the long-term reliability and corrosion resistance of electronic products. However, the formulation technology of the lead-free and halogen-free tin-spray flux in the international market is very ...

AI Technical Summary

Problems solved by technology

[0004] This invention provides a new type of lead-free and halogen-free tin-spray flux, which solves the problem of exposed copper on small pads and dense IC bit connections when spraying tin on circuit boards , The tin stove has a lot of smoke and smell, and the residue on the board is difficult to clean, etc.