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Lead-free solder low-smoke water-soluble tin spraying soldering flux

A lead-free solder, water-soluble technology, applied in the field of tin-spraying flux, lead-free solder water-soluble tin-spraying flux, can solve problems such as affecting the health of operators, affecting product performance, and generating large amounts of smoke. Low impact, less flux residue, less smoke effect

Inactive Publication Date: 2018-01-09
湖北格志电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The organic components contained in general tin-spraying flux are volatile and decomposed at high temperature during the lead-free tin-spraying operation process, and the amount of smoke is large, which not only pollutes the environment, is not safe, but also affects the health of operators, and also affects to product performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The lead-free solder water-soluble tin-spraying flux prepared according to this embodiment is composed of the following weight ratio:

[0027] PEG400 is 45%, glycerol polyoxyethylene ether is 25%, malonic acid is 1%, succinic acid is 3%, dimethylamine hydrochloride is 1%, benzotriazole is 1%, deionized water was 24%.

[0028] The preparation method of the lead-free solder water-soluble tin-spraying flux is:

[0029] In a reaction kettle with a stirrer, add 1.0kg of malonic acid and 3.0kg of succinic acid, add 24.0kg of deionized water to dissolve, add 1.0kg of benzotriazole and stir to dissolve, add 45.0kg of PEG400 and 25.0 kg of glycerin polyoxyethylene ether, stir evenly, then add 1.0kg of dimethylamine hydrochloride, stir evenly, and obtain lead-free solder water-soluble tin-spraying flux.

Embodiment 2

[0031] The lead-free solder water-soluble tin-spraying flux prepared according to this embodiment is composed of the following weight ratio:

[0032] PEG400 is 35%, PEG600 is 10%, glycerol polyoxyethylene ether is 20%, SAF-25 is 5%, malonic acid is 1%, succinic acid is 3%, dimethylamine hydrochloride is 1%, Benzotriazole is 1%, and deionized water is 24%.

[0033] The preparation method of the lead-free solder water-soluble tin-spraying flux is the same as that in Example 1.

Embodiment 3

[0035] The lead-free solder water-soluble tin-spraying flux prepared according to this embodiment is composed of the following weight ratio:

[0036] PEG600 is 40%, SAF-25 is 25%, malonic acid is 1%, succinic acid is 5%, dimethylamine hydrochloride is 1%, benzotriazole is 5%, deionized water is 23 %.

[0037] The preparation method of the lead-free solder water-soluble tin-spraying flux is the same as that in Example 1.

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PUM

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Abstract

The invention relates to lead-free solder low-smoke water-soluble tin spraying soldering flux. The lead-free solder low-smoke water-soluble tin spraying soldering flux is composed of, by weight, 0.5-10% of an organic acid activating agent, 1-5% of organic amine halogen acid salt, 40-70% of an nonionic surface active agent, 0.1-5% of a reducing agent, and the balance deionized water. The lead-freesolder water-soluble tin spraying soldering flux is reasonable in proportion, simple in manufacturing technique, good in wettability and weldability, little in smoke, easy to wash and low in ion contamination, and a tin surface is flat and bright.

Description

technical field [0001] The invention relates to the field of printed circuit board production in the electronics industry, in particular to a tin-spraying flux, that is, a lead-free solder water-soluble tin-spraying flux with less smoke. Background technique [0002] In the hot air leveling process, the circuit board is subjected to pre-treatments such as micro-etching and water washing, and a layer of flux is coated on the board surface and inside the holes to remove the oxide layer, activate the copper surface, and improve the wettability of the molten solder on the copper surface. , so that the tin on the copper surface is uniform, full and bright, and at the same time it plays the role of heat transfer and film formation, so that the solder mask on the board surface does not stick to tin. With the increasing awareness of global environmental protection and the development requirements of the electronic information industry, it is an inevitable trend for electronic inform...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363H05K3/34
Inventor 董雪
Owner 湖北格志电子科技有限公司
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