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Neutral tin-plating addition agent

An additive and tin-plating technology, applied in the field of neutral tin-plating additives, can solve the problems of strong acidity and pollution of the plating solution, and achieve the effects of prolonging the storage period, good stability of the plating solution, and avoiding danger and pollution.

Active Publication Date: 2019-08-09
广东比格莱科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The plating solution used in the traditional pickling and tin plating process is a sulfuric acid system, which has simple components and low cost, but at the same time, the plating solution is highly acidic and pollutes heavily, so it is gradually replaced by the plating solution of methanesulfonic acid system

Method used

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Examples

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preparation example Construction

[0065] In some preferred embodiments, taking the preparation of 1 kg of additive solution as an example, the preparation method of the neutral tin plating additive comprises the following steps: weighing complexing agent, wetting agent, and surfactant according to the proportion, and wetting Agent, surfactant, and complexing agent were added into 0.4kg of water, and after the pH regulator was added to adjust the pH of the solution to 6-8, water was added to make up to 1kg.

[0066] The second aspect of the present invention provides a tin plating solution, the preparation raw materials of which include: 30-50 mL / L of stannous methanesulfonate, 275-325 mL / L of the above-mentioned neutral tin plating additive, and water as a solvent.

[0067] In some preferred embodiments, the raw materials for the preparation of the tin plating solution include: 40 mL / L of stannous methanesulfonate, 300 mL / L of the above-mentioned neutral tin plating additive, and the solvent is water.

[0068]...

Embodiment 1

[0076] Embodiment 1 provides a kind of neutral tin-plating additive, prepares 1kg additive solution: take complexing agent 25.8%, wetting agent 1.5%, surfactant 3% by weight percentage, under room temperature, wetting agent, surface Activator and complexing agent are added into 0.4kg of water, and the pH regulator is added to adjust the pH of the solution to 7.5. The amount of the pH regulator is 16.5% of the solution weight, and water is added to make up to 1kg.

[0077]The complexing agent is organic acid and organic acid salt; the organic acid is sulfamic acid, and the organic acid salt is sodium gluconate; the weight ratio of sodium gluconate and sulfamic acid is 1:1.1.

[0078] The wetting agent is polyethylene glycol.

[0079] The surfactants are Plurafac SL-62 and Synfac 8216, and the weight ratio of Plurafac SL-62 and Synfac8216 is 2:1.

[0080] The pH regulator is ammonia water.

[0081] This example also provides a tin plating solution, prepare 1L tin plating solut...

Embodiment 2

[0083] Embodiment 2 provides a kind of neutral tin-plating additive, prepares 1kg additive solution: take complexing agent 25.8%, wetting agent 1.5%, surfactant 3% by weight percentage, under room temperature, wetting agent, surface Activator and complexing agent are added into 0.4kg of water, and pH regulator is added to adjust the pH of the solution to 7.2. The dosage of pH regulator is 16.0% of the solution weight, and water is added to make up to 1kg.

[0084] The complexing agent is organic acid and organic acid salt; the organic acid is sulfamic acid, and the organic acid salt is sodium gluconate; the weight ratio of sodium gluconate and sulfamic acid is 1:1.1.

[0085] The wetting agent is polyethylene glycol.

[0086] The surfactants are Plurafac S-305LF and Synfac 8120, and the weight ratio of Plurafac S-305LF and Synfac 8120 is 2:1.

[0087] Plurafac S-305LF in this application is produced by BASF and Synfac 8120 is produced by Milliken.

[0088] The pH regulator i...

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Abstract

The invention discloses a neutral tin-plating addition agent. The neutral tin-plating addition agent is characterized by being prepared from the following raw materials in percentage by weight: 20%-30% of a complexing agent, 1%-3% of a wetting agent, 1%-5% of a surfactant, 10%-20% of a pH regulator and the balance of water. According to the neutral tin-plating addition agent, dangerousness and pollution caused by an acidic addition agent in the prior art are avoided, stable performance can be maintained at different temperatures, the storage life of products is prolonged, the stability of tin-plating liquid containing the neutral tin-plating addition agent is good while the uniform plating capability and the penetration capability are ensured, and a good tin-plating effect can be realizedwithin the large electroplating temperature range.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a neutral tin-plating additive. Background technique [0002] Tin plating and its alloys are coatings with good solderability and certain corrosion resistance, and are widely used in electronic components, printed circuit boards and other fields. At present, the tin plating process includes acid tin plating and alkaline tin plating. Among them, acid tin plating has a higher application range because of its lower power consumption and higher plating efficiency. The plating solution used in the traditional pickling and tin plating process is a sulfuric acid system, which has simple components and low cost, but at the same time, the plating solution is highly acidic and polluted, and is gradually replaced by a methanesulfonic acid system plating solution. [0003] In the prior art, there are few tin-plating additives suitable for methanesulfonic acid system, and most of them have the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 郑博艺苏聪敏陈楷城
Owner 广东比格莱科技有限公司
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