Neutral tin-plating addition agent

An additive and tin-plating technology, applied in the field of neutral tin-plating additives, can solve the problems of strong acidity and pollution of the plating solution, and achieve the effects of prolonging the storage period, good stability of the plating solution, and avoiding danger and pollution.
CN110106535AActive Publication Date: 2019-08-09广东比格莱科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
广东比格莱科技有限公司
Publication Date
2019-08-09

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Abstract

The invention discloses a neutral tin-plating addition agent. The neutral tin-plating addition agent is characterized by being prepared from the following raw materials in percentage by weight: 20%-30% of a complexing agent, 1%-3% of a wetting agent, 1%-5% of a surfactant, 10%-20% of a pH regulator and the balance of water. According to the neutral tin-plating addition agent, dangerousness and pollution caused by an acidic addition agent in the prior art are avoided, stable performance can be maintained at different temperatures, the storage life of products is prolonged, the stability of tin-plating liquid containing the neutral tin-plating addition agent is good while the uniform plating capability and the penetration capability are ensured, and a good tin-plating effect can be realizedwithin the large electroplating temperature range.
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Description

technical field

[0001] The invention relates to the field of electroplating, in particular to a neutral tin-plating additive. Background technique

[0002] Tin plating and its alloys are coatings with good solderability and certain corrosion resistance, and are widely used in electronic components, printed circuit boards and other fields. At present, the tin plating process includes acid tin plating and alkaline tin plating. Among them, acid tin plating has a higher application range because of its lower power consumption and higher plating efficiency. The plating solution used in the traditional pickling and tin plating process is a sulfuric acid system, which has simple components and low cost, but at the same time, the plating solution is highly acidic and polluted, and is gradually replaced by a methanesulfonic acid system plating solution.

[0003] In the prior art, there are few tin-plating additives suitable for methanesulfonic acid system, and most of them have the ...

Claims

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