Soldering iron tin soldering equipment

Abstract

The invention discloses soldering iron tin soldering equipment which comprises a rack, an XY-axis moving module, a soldering iron tin soldering mechanism and a positioning and rotating mechanism. Thesoldering iron tin soldering mechanism comprises a module fixing plate, a Z-axis linear module, a soldering iron tin soldering assembly and a camera module. The positioning and rotating mechanism is arranged on a rack working table below the soldering iron tin soldering mechanism. The Z-axis linear module is arranged on the XY-axis moving module. The soldering iron tin soldering assembly is arranged on the Z-axis linear module, thus the soldering iron tin soldering assembly can move in the XYZ-axis direction in a reciprocating manner, the camera module recognizes and positions a product, and the soldering iron tin soldering assembly carries out preheating and tin soldering on the product. The positioning and rotating mechanism comprises a rotating device and a product positioning jig arranged at the rotating end of the rotating device. The rotating device drives the product positioning jig to rotate. According to the equipment, a soldering iron tin soldering technology is adopted, thetechnology is mature, the tin soldering position is precise, damage to the product is avoided, the product machining quality can be ensured, the product yield is increased, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of solder processing of electronic products, in particular to a soldering iron soldering equipment. Background technique [0002] During the installation of electronic products, it is necessary to use the soldering process to weld, and some electronic products need to use the soldering and tin absorption process to remove the gold-plated layer on the surface of the product. The gold-plated layer on the surface needs to be removed before the wire is welded. The main steps are divided into soldering and tin absorption. The solder is melted into the empty solder cup of the terminal through the soldering process, so that the gold-plated layer on the surface of the solder cup is melted in the solder. The process melts the solder in the empty solder cup again and uses a tin suction tool to suck out the solder to remove the gold-plated layer on the inner surface of the solder cup, and then perform the subsequent wi...

AI Technical Summary

Problems solved by technology

The main purpose of removing the gold-plated layer on the inner surface of the solder cup is to prevent the fusion of the solder and the gold-plated layer on the solder cup to form "gold brittleness", which will reduce the hardness of the solder joints and cause severe fractures

At present, the gold-plated layer on the inner surface of the terminal soldering cup of the soldering type connector is mainly removed by manual welding with a soldering iron and suction welding. The soldering cup of the terminal is small and deep, and manual operation is not easy and wastes time and energy. It requires a lot of technical skills for employees. high, and the yield rate is low, and the production efficiency is low. For this reason, the present invention studies, optimizes and improves the technical transformation of the soldering step of this type of product and its automation equipment.

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