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High heat-resistance organic solder ability preservative

An organic solder retention technology, applied in the field of high heat resistance organic solder retention flux, to achieve the effects of inhibiting oxidation, excellent tinning performance, and preventing discoloration and oxidation

Active Publication Date: 2011-04-27
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High-precision lead-free soldering puts forward higher requirements on the temperature resistance and compactness of organic soldering film, and the existing technology has been difficult to meet this requirement

Method used

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  • High heat-resistance organic solder ability preservative
  • High heat-resistance organic solder ability preservative
  • High heat-resistance organic solder ability preservative

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～12

[0039] In Examples 1 to 12, except that the contents of imidazole compounds and aromatic phenol oxygen absorbers are as listed in Table 1, the composition of the high heat-resistant organic soldering flux is as follows: the content of acetic acid is 15.6%, The content of isopropanol is 1.2%, copper chloride is 0.1%, zinc acetate is 0.05%, and the balance is deionized water.

[0040] Preparation method: Add 2-carboxy-1-phenol and acetic acid into a clean enamel stirring tank at room temperature, add 5-chloro-2-benzylbenzimidazole during the stirring process, and after stirring for half an hour, the solid substance is basically Dissolve completely above, then add deionized water, isopropanol, copper chloride and zinc acetate in sequence, continue to stir for one hour until the solid raw materials are completely dissolved, mix evenly, stop stirring, stand and filter, and obtain a solution with a pH value of 3.40. Heat-resistant organic flux products. If the pH is lower than 2.5 ...

Embodiment 13～18

[0051] In Examples 13-18, except that the aromatic phenolic oxygen absorber content is listed in Table 2 in the composition of the high heat-resistant organic flux, the other components are: 3-chloro-2-benzylbenzimidazole 0.36%, the content of acetic acid is 15.6%, the content of isopropanol is 1.2%, copper chloride is 0.1%, zinc acetate is 0.05%, and the balance is deionized water.

[0052] Preparation method is identical with embodiment 1~12.

[0053] Table 2 is a comparison of the results of the tin test on the through hole of the weldment using the high heat-resistant organic fluxes of Examples 13-18 and the heat-resistant organic fluxes of Comparative Examples 4 and 5:

[0054] The high heat-resistant organic fluxes of Comparative Examples 4 and 5 are all prepared from imidazole compounds, organic acids, solubilizers, metal compounds, and deionized water, and do not contain aromatic phenol oxygen absorbers.

[0055] A copper-clad laminate base material with a length, wid...

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Abstract

The invention discloses a high heat-resistance organic solder ability preservative. It is characterized by consisting of an aromatic phenol oxygen absorbent, an imidazole compound, an organic acid, a solubilizer, a metallic compound and deionized water. After being coated on the surface of a copper plate, the heat-resistance organic solder ability preservative can inhibit the oxidation of the copper surface of a circuit board, particularly can avoid the color-changing oxidation of copper surface during multiple high-temperature treatments, and can keep the excellent solderability of copper surface of the circuit board, improve weldability and guarantee the successful follow-up welding.

Description

technical field [0001] The invention relates to a flux for preventing copper surface oxidation of a circuit board, in particular to a high heat-resistant organic flux for preventing discoloration and oxidation of the copper surface during high-temperature treatment and enabling the subsequent welding process to proceed smoothly. Background technique [0002] In recent years, various electronic components have become increasingly thinner and smaller, while printed circuit boards (PCBs) are developing towards multi-layer and high-density trends. The strict requirements of surface mount technology (SMT) on parts and circuits make PCBs have to accept higher technical challenges. In the final surface treatment of circuit boards, the traditional hot air solder leveling technology (Hot Air Solder Leveling) can no longer meet the requirements of the current high-standard SMT, and the lighter and lighter substrates cannot withstand the high temperature impact brought by hot air level...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28C23F11/10C23F11/14
Inventor 唐欣吴晶王永邱大勇潘建明
Owner 深圳市唯特偶新材料股份有限公司
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