The invention discloses an electroless
tin plating formula for a
printed circuit board. The formula comprises the following components with the following concentrations: 10-30g / L of stannous ions, 70-130g / L of
thiourea, 30-70g / L of
methanesulfonic acid, 30-60g / L of
citric acid, 20-50g / L of
tetrasodium iminodisuccinate, 10-30g / L of
carbohydrazide, 10-50mg / L of interfacial agent, 0.05-0.15g / L of
bismuth acetate and 20-40g / L of polyamino polyether
methylene phosphonate, wherein the component solutions are uniformly mixed and then prepared into an electroless
tin plating solution; and the electroless
tin plating solution has the following characteristics: tin is stable in tin
deposition rate, bivalent tin is not liable to be oxidized into tetravalent tin, and the solution is high in stability. The formula disclosed by the invention contains many complexing agents, the stannous ions are not liable to be oxidized into tetravalent tin, the oxidization of
oxygen dissolved in the plating solution can be cancelled by virtue of a
reducing agent, the plating solution contains
bismuth acetate, a plating layer is a tin-
bismuth alloy, and the alloyed plating layer is not liable to grow tin
whiskers; and moreover, the electroless
tin plating solution has the following characteristics: tin is stable in tin
deposition rate, bivalent tin is not liable to be oxidized into tetravalent tin, and the solution is high in stability.