A kind of organometallic solder protection film and preparation method thereof

Abstract

The invention provides an organic metal solder protection film and its preparation method. The new surface treatment method is an innovative process technology between organic solder protection film and metallized surface treatment, that is, to create a layer of physical isolation protection layer , the protective layer is composed of a main plating layer and an organic protective layer, the main plating layer includes silver metal and organic metal, the main plating layer is located on the surface of the circuit board, and the organic protective layer is located on the surface of the main plating layer. This organometallic solder protection film not only has all the properties of OSP film, but also has the surface treatment performance of type chemical silver. Giovanni effect.

Description

technical field [0001] The invention relates to a circuit board preparation process, in particular to an organic metal solder protection film and a preparation method thereof. Background technique [0002] At present, OSP organic solder protection film, chemical nickel gold, chemical tin, chemical silver and other surface treatment processes are commonly used in the PCB industry. Taking OSP as an example, the principle is to form an organic film on the copper surface by chemical methods. It is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in the normal environment. Although the OSP organic solder protection film has the advantages of high solder joint strength, simple process application, and low cost. However, due to the characteristics of the organic film itself, its anti-oxidation surface treatment is fragile and difficult to be compatible. At the same time, because the organic solder protection film is a transparent film layer, the ...

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Problems solved by technology

However, due to the characteristics of the organic film itself, it leads to the fragility and incompatibility of its anti-oxidation surface treatment.

At the same time, because the organic solder protection film is a transparent film layer, the one-time pass rate of the visual inspection of the appearance is low, and it is not conductive, which will affect the pass rate of the ICT test for end customers in the future.

As for the metallized surface treatment process, although it has the advantages of high solderability, visual inspection, and high conductivity, the process is complicated, and it is prone to blackening of the film surface and the Giavani effect (Giavani effect, also known as the original The battery effect refers to the adverse problems such as the electric current generated by two metals through the medium due to the potential difference, and then an electrochemical reaction occurs, and the anode with a high potential is oxidized)