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Organic metal shielded welding film and preparation method thereof

An organic metal and solder protection film technology, which is applied in the application of non-metallic protective layers, printed circuit manufacturing, electrical components, etc. Giovanni effect and other problems, to improve the convenience of visual inspection of appearance, improve the effect of tin, and inhibit the effect of Giovanni effect

Active Publication Date: 2017-02-15
JIANGMEN SUNTAK CIRCUIT TECH
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the characteristics of the organic film itself, it leads to the fragility and incompatibility of its anti-oxidation surface treatment.
At the same time, because the organic solder protection film is a transparent film layer, the one-time pass rate of the visual inspection of the appearance is low, and it is not conductive, which will affect the pass rate of the ICT test for end customers in the future.
As for the metallized surface treatment process, although it has the advantages of high solderability, visual inspection, and high conductivity, the process is complicated, and it is prone to blackening of the film surface and the Giavani effect (Giavani effect, also known as the original The battery effect refers to the adverse problems such as the electric current generated by two metals through the medium due to the potential difference, and then an electrochemical reaction occurs, and the anode with a high potential is oxidized)

Method used

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Embodiment Construction

[0020] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following will be described in detail in conjunction with the embodiments.

[0021] The solution discloses an organic metal solder protection film, which is composed of a main coating layer and an organic protective layer, and the main coating layer includes silver metal and organic metal. Considering that the traditional circuit board solder protection film surface treatment is either using OSP organic solder protection film, that is, directly using organic matter as a solder protection film to deposit on the surface of the circuit board. Alternatively, metallized surface treatment is used to deposit a layer of metal on the copper surface of the circuit board. However, both treatments have their own disadvantages. However, this solution combines the advantages and disadvantages of these two processing methods, making use of their str...

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Abstract

The invention provides an organic metal shielded welding film and a preparation method thereof. A novel surface treatment mode is an innovative process technology between an organic shielded welding film and metalized surface treatment; namely, a physical isolation protective layer is created; the protective layer is composed of a main clad layer and an organic protective layer; the main clad layer comprises silver metal and organic metal; the main clad layer is positioned on the surface of a circuit board; and the organic protective layer is positioned on the surface of the main clad layer. The organic metal shielded welding film has all performances of an OSP film, and simultaneously, has type chemical silver surface treatment performances; the preparation process is simple; the appearance visual inspection convenience is greatly improved; the tinning effect can be effectively improved; and the galvanic effect in the production process can be inhibited.

Description

technical field [0001] The invention relates to a circuit board preparation process, in particular to an organic metal solder protection film and a preparation method thereof. Background technique [0002] At present, OSP organic solder protection film, chemical nickel gold, chemical tin, chemical silver and other surface treatment processes are commonly used in the PCB industry. Taking OSP as an example, the principle is to form an organic film on the copper surface by chemical methods. It is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in the normal environment. Although the OSP organic solder protection film has the advantages of high solder joint strength, simple process application, and low cost. However, due to the characteristics of the organic film itself, its anti-oxidation surface treatment is fragile and difficult to be compatible. At the same time, because the organic solder protection film is a transparent film layer, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282H05K2203/0577H05K2203/1377
Inventor 陈勇武杨林李渊胡志杨
Owner JIANGMEN SUNTAK CIRCUIT TECH
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