Organic metal shielded welding film and preparation method thereof
An organic metal and solder protection film technology, which is applied in the application of non-metallic protective layers, printed circuit manufacturing, electrical components, etc. Giovanni effect and other problems, to improve the convenience of visual inspection of appearance, improve the effect of tin, and inhibit the effect of Giovanni effect
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[0020] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following will be described in detail in conjunction with the embodiments.
[0021] The solution discloses an organic metal solder protection film, which is composed of a main coating layer and an organic protective layer, and the main coating layer includes silver metal and organic metal. Considering that the traditional circuit board solder protection film surface treatment is either using OSP organic solder protection film, that is, directly using organic matter as a solder protection film to deposit on the surface of the circuit board. Alternatively, metallized surface treatment is used to deposit a layer of metal on the copper surface of the circuit board. However, both treatments have their own disadvantages. However, this solution combines the advantages and disadvantages of these two processing methods, making use of their str...
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