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Imidazole derivative solution capable of being used as organic solderability preservative

A technology of imidazole derivatives and solder protection flux, which is applied in the field of organic solder protection, can solve problems such as the production process of printed circuit boards that cannot meet the excellence, and achieve the effect of excellent solderability and high temperature resistance

Active Publication Date: 2010-07-21
林原标
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The above-mentioned technical solution solves the shortcomings of the Hot Air Solder Leveling process and the Organic Solderability Preservatives process using benzimidazole to a certain extent, but it still cannot meet the excellence of the printed circuit board production process.

Method used

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  • Imidazole derivative solution capable of being used as organic solderability preservative
  • Imidazole derivative solution capable of being used as organic solderability preservative
  • Imidazole derivative solution capable of being used as organic solderability preservative

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Embodiment Construction

[0024] The present invention will be further described below in combination with specific embodiments.

[0025] The imidazole derivative solution that can be used as an organic soldering flux disclosed by the present invention is equipped with an organic soldering flux solution, which contains 5.0% [2-(4-chlorophenoxymethyl)]-1H-benzimidazole by weight, 20 % acetic acid, 0.2% heptanoic acid, 0.1% copper acetate. Adjust the temperature of the above-mentioned organic flux solution to 38° C., and adjust the pH value to 3.3.

[0026] A copper plate with a thickness of 0.3 mm and an area of ​​3 cm×7.5 cm was used as a test piece, and the test piece was treated with an organic solder preservation treatment with the above-mentioned organic flux solution, and then the test piece was subjected to solderability inspection.

[0027] The test piece must be polished, then acidic or alkaline cleaner to remove the surface oil, washed with sulfuric acid / hydrogen peroxide micro-etching soluti...

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Abstract

The invention relates to organic solderability preservative technology, in particular to imidazole derivative solution capable of being used as an organic solderability preservative, which is used for the organic solderability preservative process of copper or copper alloy on a printed circuit board. The solution comprises the following components in percentage by weight: 0.05 to 10 percent of imidazole derivatives, 0.01 to 30 percent of acidic materials and 0.0001 to 10 percent of water-soluble metal salt. Compared with the prior art, the solution has the advantages that: a layer of organic solderability preservative film with the thickness of 0.1 to 1.0 micrometer is uniformly formed on the surface of the copper or the copper alloy of the printed circuit board, so that the printed circuit board has excellent solderability and has excellent high temperature resistance and oxidation resistance in a high-temperature high-humidity environment.

Description

technical field [0001] The invention relates to an organic solderability preservation technology, in particular to an imidazole derivative solution which can be used as an organic solder preservation agent, and is used for the Organic Solderability Preservatives (Organic Solderability Preservatives) process of copper or copper alloys on printed circuit boards. Background technique [0002] In recent years, electronic components have become thinner and smaller, printed circuit boards (PCBs) have become more multi-layered, high-density and thinner, surface mount technology (SMT) has become more stringent, and traditional Hot Air Solder Leveling (Hot Air Solder Leveling) The manufacturing process can no longer meet the requirement of uniform thickness of the standard SMT tin-lead layer, and the thin and soft printed circuit board cannot withstand the high temperature thermal shock during tin spraying. In this context, the Organic Solderability Preservatives (Organic Solderabili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36H05K3/00
Inventor 林原标
Owner 林原标
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