Organic solderability preservative (OSP) on surface of printed circuit board and presoaking stoste and method for manufacturing OSP

Abstract

The invention discloses an organic solderability preservative (OSP) on the surface of a printed circuit board and a presoaking stoste and a presoaking method for manufacturing the OSP. The presoaking stoste for manufacturing the OSP on the surface of the printed circuit board comprises the following components of: 1 to 30 g / L of benzotriazole, 1 to 10 g / L of N-(2-ethoxy)quadrol-N,N',N'-nitrilotriacetic-acid, 5 to 30 g / L of alkaline stabilizer, 1 to 10 g / L of pH buffering agent and 200 to 300 g / L organic solvent. The presoaking method for manufacturing the OSP on the surface of the printed circuit board comprises the following steps of: preparing a presoaking bath solution, adjusting the pH value and forming a nano thin film. The OSP on the surface of the printed circuit board is prepared by presoaking by the presoaking method for manufacturing the OSP on the surface of the printed circuit board, and then forming an OSP film. The presoaking stoste for manufacturing the OSP on the surface of the printed circuit board is high in stability and long in service life; the presoaking method for manufacturing the OSP on the surface of the printed circuit board is simple in process, and the conditions are easy to control; the obtained OSP has high adhesive force and high temperature resistance, and is uniform and compact, so that the solderability of the finished printed circuit board is improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards in the electronic industry, and in particular relates to an OSP on the surface of a printed circuit board and a prepreg stock solution and a prepreg method for its manufacture. Background technique [0002] The traditional organic solderability protective film (organic solder protection film, OSP) technology applied to the circuit board to protect the copper circuit is to form a layer of transparent organic solder protection film directly on the surface of the copper circuit. The organic solder protection film can Ensure that the copper lines will not be oxidized during the wave soldering of the circuit board in the assembly process. The formation of the film on the copper surface is a transparent film of organic complexes induced by a small amount of copper ions in the solution. [0003] With the market requirement of lead-free, the traditional OSP film cannot guarantee the protec...

AI Technical Summary

Problems solved by technology

But then there will be two problems: one is that there are two complexation processes objectively, which will eventually lead to poor uniformity and compactness of the OSP film, which will directly affect the solderability of the finished product; Keep it at a very low level, generally less than 10ppm, otherwise, when the copper ion is excessive, the prepreg solution will age prematurely and need to be replaced, which will increase the cost

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