Method for optimizing the manufacturing technique of single-sided aluminum substrate

A technology of production process and optimization method, applied in electrical components, manufacturing of printed circuit precursors, printed circuit manufacturing, etc. The effect of bad rate

Inactive Publication Date: 2017-08-18
ANHUI LINCHI ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Aiming at the problems of high defective product rate and high production cost caused by the practical drilling and milling machines in the existing aluminum substrate production process, the present invention proposes a method for optimizing the produ

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  • Method for optimizing the manufacturing technique of single-sided aluminum substrate
  • Method for optimizing the manufacturing technique of single-sided aluminum substrate

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Embodiment Construction

[0029] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.

[0030] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0031] refer to figure 1 As shown, it is a flowchart of a production process optimization method for a single-sided aluminum substrate proposed by the present invention, which includes the following steps:

[0032] A....

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Abstract

The invention relates to the technical field of circuit board manufacturing and in particular to a method for optimizing the manufacturing technique of a single-sided aluminum substrate. The method comprises following steps of: cutting: cutting the single-sided aluminum substrate into a prescribed dimension in accordance with a production requirement of the single-sided aluminum substrate; baking: stacking the aluminum substrates together and baking the aluminum substrates for 3 to 5 hours at the temperature from 140 to 148 degrees centigrade, wherein the thickness of each stack is 40 to 48 cm; C, laser drilling: processing holes on the aluminum substrates by using laser drilling technology; D, line production: subjecting the aluminum substrates to film pasting, exposure, development and etching; E, solder resist: protecting the line not required to be soldered and preventing the entry of tin from causing short circuit; F, V cutting: cutting the surface of the aluminum substrate by using a V cutting machine to form a semi-V groove; G, punching: processing the outline of the aluminum substrate by using a punch press to form holes and a specified shape; H, line test: detecting whether the completed lines operate normally; and I, surface OSP: forming an organic solderability preservative on the aluminum substrate by using reactive resin.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a method for optimizing the production process of a single-sided aluminum substrate. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few applications are multilayer boards, which can be made by laminating ordinary multilayer boards with insulating layers and aluminum substrates. [0003] Aluminum substrate, commonly used in LED lighting products. There are two sides, the white side is for soldering the LED pins, and the other side shows t...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/02
CPCH05K3/0044H05K3/0014H05K3/0026H05K3/005H05K3/022H05K2203/0214H05K2203/025H05K2203/107
Inventor 张龙
Owner ANHUI LINCHI ELECTRONICS CO LTD
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