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53results about How to "High defect rate" patented technology

Hot melting detachment prevention dynamic token and detachment prevention method of hot melting detachment prevention dynamic token

ActiveCN104092548AProblems preventing direct copying of internally stored informationPrevent theftUser identity/authority verificationHot meltInformation integration
The invention discloses a hot melting detachment prevention dynamic token and a detachment prevention method of the hot melting detachment prevention dynamic token. The hot melting detachment prevention dynamic token comprises a shell, a circuit board used for storing information, and a battery. The shell comprises a shell body and a cover body used for being buckled on the shell body, and further comprises an elastic sheet. The battery is arranged between the circuit board and the elastic sheet. The circuit board, the battery and the elastic sheet are arranged in the shell body. The shell body is arranged on the side close to the elastic sheet. A protruding hot melting column is arranged on the side, facing towards the elastic sheet, of the shell body. The shell body penetrates through the elastic sheet through the bolt melting column and is welded to a through hole of the circuit board. According to the method, when the hot melting detachment prevention dynamic token is detached, the circuit board is cocked, the elastic sheet is separated from the circuit board in the position of the hot melting column, and therefore the circuit board and the battery are separated. The power outage effect is achieved for the circuit board and the battery through a simple detachment method, and therefore integrity of sensitive information stored in the circuit board is improved.
Owner:SHANGHAI PEOPLENET SECURITY TECH

Touch display screen

The invention provides a touch display screen. The touch display screen comprises a first substrate, a liquid crystal module, a filter layer, a second substrate and a first polaroid, wherein the first substrate, the liquid crystal module, the filter layer, the second substrate and the first polaroid are stacked in sequence; the surface, facing one side of the liquid crystal module, of the first substrate is provided with TFT (thin film transistor) electrodes; one side, facing the liquid crystal module, of the second substrate is provided with common electrodes; the TFT electrodes and the common electrodes are used for jointly controlling the arrangement state of liquid crystal molecules in the liquid crystal module; the touch display screen also comprises a transparent conducting layer arranged on the surface, backing on to one side of the liquid crystal module, of the second substrate or the surface of the first polaroid; the transparent conducting layer comprises a matrix and conducting nanometer wires filled in the matrix; the matrix is solidified transparent photosensitive resin; the transparent conducting layer is patterned to form touch electrodes; the touch electrodes are matched with the common electrodes to form a double-layer touch induction structure, and the double-layer touch induction structure is used for determining coordinates of a touch point. The touch display screen has the characteristics of being thin and low in production cost.
Owner:NANCHANG O FILM TECH CO LTD +2

High-strength projection-type capacitive screen and manufacturing method thereof

The invention discloses a high-strength projection-type capacitive screen and a manufacturing method of the capacitive screen. The high-strength projection-type capacitive screen comprises a first glass substrate, a first ITO layer, a second glass substrate and a second ITO layer, wherein the first ITO layer is arranged on the first glass substrate, and the second ITO layer is arranged on the second glass substrate. The first ITO layer is connected with the second ITO layer through a lamination layer. The first glass substrate is a tempered glass substrate. The first ITO layer includes an X-axis electrode layer formed by a plurality of electrodes in the X-axis direction. The second ITO layer includes a Y-axis electrode layer formed by a plurality of electrodes in the Y-axis direction. The edge of the X-axis electrode layer is further provided with a metal wire X connected with the X-axis electrode layer. The edge of the Y-axis electrode layer is further provided with a metal wire Y connected with the Y-axis electrode layer. The metal wire X and the metal wire Y are respectively connected with a flexible circuit board. The lamination layer is an EVA glue layer or a PVB glue layer. The projection-type capacitive screen is high in impact strength; in addition, bridging process is omitted from the manufacturing method, and therefore the product yield can be effectively increased.
Owner:向火平

Grinding device for screw mold machining

The invention discloses a grinding device for screw mold machining. The grinding device comprises a grinding box, a driving motor is fixedly arranged on the inner wall of the upper side of the grinding box, an output shaft of the driving motor is fixedly connected with a grinding disc, a lifting base corresponding to the grinding disc in position is arranged in an inner cavity of the grinding box, the lower side wall of the grinding box is in threaded connection with an adjusting bolt, the adjusting bolt upwards penetrates through the lower side wall of the grinding box and is rotationally connected with the lower side wall of the lifting base, limiting rods which are symmetrical in position are arranged on the two side walls of the lifting base, limiting grooves matched with the limiting rods are formed in the inner walls of the two sides of the grinding box, and fixing plates which are symmetrical in position are arranged on the upper side wall of the lifting base. A traditional fastening and clamping mode is avoided, cooling liquid can be automatically sprayed in the working process of the grinding disc, the service life of the grinding device is prolonged, the grinding efficiency of the grinding device is improved, the working intensity of workers is reduced, and certain practicability is achieved.
Owner:高煌东

Transverse clamping mechanism capable of reducing BL foreign matter badness

The invention relates to a transverse clamping mechanism capable of reducing BL foreign matter badness. The transverse clamping mechanism comprises a transverse locating assembly and a bottom supporting assembly. The transverse locating assembly comprises a base and a locating part, and the base is fixedly connected with the output end of a telescopic air cylinder. Multiple mounting holes are evenly distributed on the base. The locating part comprises at least two locating rods and clamping parts arranged at the tops of the locating rods, and mounting blocks cooperating with the mounting holesare arranged at the bottom ends of the locating rods. The clamping parts are rotationally connected with the locating rods. The bottom supporting assembly comprises a supporting plate and multiple fins. At least one jacking air cylinder is arranged at the bottom end of the supporting plate. The fins are vertically fixed to the supporting plate and distributed in the longitudinal direction of an assembly line, and multiple steel balls are evenly distributed at the tops of the fins. The transverse locating parts and a back plate are in rolling contact, and therefore hard contact of the transverse locating parts and protrusions on the side wall of the back plate is greatly reduced, the quantity of foreign matter generated by relative friction is reduced, and the reject ratio of foreign matter generated in the assembly process is improved.
Owner:陕西科尔智控科技有限公司

A kind of manufacture method of anti-radiation eeprom

The invention provides a method for manufacturing an anti-radiation EEPROM. The memory includes devices: storage units and high and low voltage transistors of peripheral circuits. It is characterized in that the manufacturing method before the formation of the source and drain of each device is different from the ordinary manufacturing method. : The dielectric ONO layer used for the isolation between the floating gate and the control gate in the memory unit is used as the side wall of the high and low voltage transistor gate of the peripheral circuit at the same time, that is, the material of the side wall of the high and low voltage transistor gate is changed, by The silicon oxide film in the conventional manufacturing method is replaced by a composite film of silicon oxide and silicon nitride. The method of the present invention makes full use of the existing common manufacturing method, does not add additional process steps, only by adjusting the gate oxide growth sequence of the low-voltage transistor in the peripheral circuit, so as to ensure that the structure and electrical performance of the high-voltage and low-voltage transistor devices involved are consistent. Change, and improve the anti-radiation performance of the device, thereby improving the anti-radiation performance of the entire EEPROM. The method of the invention is suitable for mass production.
Owner:SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT +1

Backing plate positioning mechanism for BL automatic assembly production line

InactiveCN111331331AReduce hard contactReduce the amount of foreign matterMetal working apparatusForeign matterEngineering
The invention relates to a backing plate positioning mechanism for a BL automatic assembly production line. The backing plate positioning mechanism comprises a transverse positioning assembly and a longitudinal positioning assembly which are perpendicular to each other, wherein the longitudinal positioning mechanism is arranged in the longitudinal direction of an assembly line; the longitudinal positioning assembly comprises a front positioning structure and a rear positioning structure, and a buffer body is arranged on the side, close to the rear positioning structure, of the front positioning structure; the transverse positioning assembly comprises a base and at least two positioning parts, each positioning part comprises a positioning rod and a clamping part, the positioning rod is detachably connected with the base, and the clamping part is rotationally connected with the positioning rod; and the backing plate positioning mechanism further comprises a bottom supporting assembly, the bottom supporting assembly comprises a supporting plate and a plurality of fins, at least one jacking air cylinder is arranged at the bottom end of the supporting plate, the fins are vertically fixed on the supporting plate and distributed in the longitudinal direction of the assembly line, and multiple steel balls are uniformly distributed at the tops of the fins. The positioning mechanism canreduce both the foreign matter rejection rate and the assembly rejection rate of the automatic assembly production line.
Owner:陕西科尔智控科技有限公司
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