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Method for producing organic solderability preservative on surface of circuit board

An organic solder protection film and surface production technology, which is applied in the fields of printed circuit manufacturing, printed circuit, and printed circuit secondary treatment, can solve the problems of color difference and blackening of the film surface, and achieve improved yield rate, uniform color, and copper surface moderate roughness

Inactive Publication Date: 2015-09-16
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims at the problems that the existing organic soldering film surface treatment technology is very prone to color difference and blackening of the film surface, and provides a method for making organic soldering film that can ensure the uniform color of the organic soldering film surface

Method used

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  • Method for producing organic solderability preservative on surface of circuit board

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Embodiment

[0019] This embodiment provides a method for fabricating an organic solder protection film on the surface of a circuit board. Among them, the production line is equipped with pickling tank, No. 1 washing tank, micro-etching tank, No. 2 washing tank, No. 3 DI water (deionized water) washing tank, strong wind dryer, anti-oxidation tank, No. 4 washing tank, No. 5 DI water washing tank, hot air dryer, and the circuit board pass through the above-mentioned cylinders, strong wind dryer and hot air dryer at a speed of 0.8-1.2m / min (preferably 1.0m / min) through the transmission mechanism.

[0020] The method for making an organic solder protection film on the surface of a circuit board comprises the following steps:

[0021] (1) pickling

[0022] Move the circuit board into the pickling tank, under the condition of 25-35 ℃, use acid solution at 1.5Kg / cm 2 For pressure washing circuit boards, the acidic solution is 5wt% H 2 SO 4 solution. The circuit board is cleaned by pickling t...

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Abstract

The invention belongs to the circuit board production technical field and relates to a method for producing an organic solderability preservative on the surface of a circuit board. According to the method of the invention, sand blasting and board grinding procedures are omitted in a pretreatment process, and technological parameters of pickling and micro-etching are adjusted, and therefore, the problem of the smash of fine sands onto a board surface and the problem of high roughness and unevenness of a copper surface when a grinding brush is adopted to perform board grinding can be solved, and the roughness of the copper surface of the circuit board can be moderate and uniform, and the thickness of a formed organic film can be basically consistent with the thickness of etched copper; the circuit board is arranged in an antioxidant cylinder before the production of the organic film, a cylinder dragging plate is adopted to perform cylinder dragging processing at first, so that impurities in an antioxidant solution can be removed, and production parameters can be stabilized, and the concentration of Cu<2+> in the solution is controlled below 15ppm, and therefore, the organic film can be effectively prevented from blackening or color difference of the organic film can be effectively prevented, and yield can be improved; technological methods and parameters in various links are modified, and optimal parameter combinations can be explored, and therefore, the color of the organic film formed on the copper surface can be uniform.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing an organic solder protection film on the surface of a circuit board. Background technique [0002] Circuit board, also known as circuit board or printed circuit board, referred to as PCB (Printed Circuit Board), is one of the important components of the electronics industry, a support for electronic components, and a carrier for electrical connections. When producing circuit boards, after making the outer circuit and solder resist layer on the board surface, the surface treatment of the circuit board is required to protect the copper surface of the circuit board, prevent the copper surface from being oxidized, and ensure the excellent solderability of the circuit board sex. The types of surface treatment mainly include immersion nickel gold, immersion silver, immersion tin, electroplated nickel gold, leaded HASL, lead-free HASL, and Organi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282H05K2203/0759
Inventor 白会斌汪广明朱拓宋建远
Owner JIANGMEN SUNTAK CIRCUIT TECH
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