565results about How to "Cut surface" patented technology

A method for wafer bonding two substrates activated by ion implantation is disclosed. An in situ ion bonding chamber allows ion activation and bonding to occur within an existing process tool utilized in a manufacturing process line. Ion activation of at least one of the substrates is performed at low implant energies to ensure that the wafer material below the thin surface layers remains unaffected by the ion activation.

A cutting tool to be utilized in the resection or removal of bone tissue from patients includes a handle that tensions a wire or cable-like cutting member with a small diameter between at least two features on the handle to present a thin cutting profile. The design of the cutting tool includes features that protect against soft tissue damage and minimize the incision size necessary to utilize the tool. Some embodiments feature details of the cutting tool that interface with a surgical cutting guide system. Other embodiments describe a cutting tool with a selectively changeable length of the cutting profile of the wire cutting member. In one embodiment, the wire cutting member of the cutting tool is energized by mechanical energy in the form of a unidirectional rotation of the cutting member, a mechanical vibration of the cutting member, or an oscillating movement of the wire cutting member.

A corrosion control system is disclosed including an anionic oxygen inhibitor, a cationic acid inhibitor or dispersant, and a noxious species inhibitor or scavenger for use in a fluid in contact with a metallic surface at low temperature, moderate temperature and especially at high temperature. A drilling fluid, a completion fluid, a production fluid and a geothermal fluid including an effective amount of the corrosion control system is also disclosed as well as methods for making and using same.

The invention relates to a method for the removal of residues and contaminants from metal or dielectric surfaces and to a method for chemical mechanical polishing of a copper or aluminum surface. The methods of the invention include using an aqueous amidoxime complex agent. Optionally, the pH of the solution can be adjusted with an acid or base. The method includes applying the above composition to the copper or aluminum surface and polishing the surface in the presence of the composition.

This invention provides a semiconductor package and a method for fabricating the same. The method includes: forming a first resist layer on a metal carrier; forming a plurality of openings penetrating the first resist layer; forming a conductive metal layer in the openings; removing the first resist layer; covering the metal carrier having the conductive metal layer with a dielectric layer; forming blind vias in the dielectric layer to expose a portion of the conductive metal layer; forming conductive circuit on the dielectric layer and conductive posts in the blind vias, such that the conductive circuit is electrically connected to the conductive metal layer via the conductive posts; electrically connecting at least one chip to the conductive circuit; forming an encapsulant for encapsulating the chip and the conductive circuit; and removing the metal carrier, thereby allowing a semiconductor package to be formed without a chip carrier. Given the conductive posts, both the conductive circuit and conductive metal layer are efficiently coupled to the dielectric layer to prevent delamination. Further, downsizing the blind vias facilitates the fabrication process and cuts the fabrication cost.

In a method of manufacturing a semiconductor device, a first wiring line composed of a copper containing metal film is formed on or above a semiconductor substrate. A first interlayer insulating film is formed on a whole surface of the semiconductor substrate to cover the first wiring line. The first interlayer insulating film is selectively removed to form a connection hole reaching the first wiring line. A barrier metal film is formed to cover an inner surface of the connection hole and then a copper containing metal film is formed to fill the connection hole. The copper containing metal film formed outside the connection hole is removed. A second interlayer insulating film is formed on a whole surface of the semiconductor substrate to cover the copper containing metal film formed in the connection hole. The second interlayer insulating film is selectively removed to form a wiring line groove such that the copper containing metal film formed in the connection hole is exposed at a bottom. A barrier metal film is formed to cover an inside of the wiring line groove and then a copper containing metal film is formed to fill the wiring line groove. Then, the copper containing metal film outside the wiring line groove is removed to form a second wiring line.

Systems and methods are provided for locking/unlocking a user account for accessing a client application. The systems and methods pair a user account for accessing a client application to a separate user authentication account. The user authentication server managing the user authentication account provides heightened measures for authenticating the identity of the user, such as by voice samples and human authenticator. After the heightened authentication of the user, the user may lock or unlock paired accounts from the user authentication account, wherein preventing all attempts to access the client application using the paired account. The client application may also capture information regarding login attempts to the paired user account. The captured information may be sent to the authentication server for providing reports of login attempts and generating alerts to automatically lock the paired account in cases of suspicious behavior.

A system for enabling an operator to control a vehicle accessory includes a control interface and a processor. The control interface has a display surface and a touch area defined by an electrically conductive layer adjacent the display surface. The conductive layer capacitively couples to an electrically conductive object upon the object touching or being in proximity with the touch area while the conductive layer is driven with an electrical charge. The processor drives the conductive layer with the electrical charge, detects the capacitive coupling of the conductive layer to the object upon the object touching or being in proximity with the touch area while the conductive layer is driven, generates a signal indicative of the object touching or being in proximity with the touch area upon detecting the capacitive coupling of the conductive layer to the object, and provides the signal to the accessory for controlling the accessory accordingly.

It is an object of the present invention to provide a gas barrier film improved in gas barrier characteristics by decreasing the adsorbent of the surface of a gas barrier layer to water and the like. The present invention attains the above object by providing a gas barrier film comprising a substrate, a gas barrier layer which is a vacuum deposition film, formed on one surface or both surfaces of the above substrate, and a water-repellent layer which is a film having water repellency, formed on the above gas barrier layer.

Coated articles may comprise one or more coating layers, including water resistant coatings. A method comprises applying such coating layers by treating the article substrate by one or more methods selected from flame treatment, corona treatment, ionized air treatment, plasma air treatment and plasma arc treatment and dip, spray or flow coating. Additionally, a method comprises injection molding a first substrate material to form an article, treating the article surface by one or more methods selected from flame treatment, corona treatment, ionized air treatment, plasma air treatment and plasma arc treatment, and overmolding the article substrate with one or more barrier materials.

An optical device with a deformable membrane including an anchoring area on a support helping to contain a constant volume of liquid in contact with one of its faces, a substantially central area, configured to be deformed reversibly from a rest position, and an actuation mechanism displacing the liquid in the central area, stressing the membrane in parts situated between the central area and the anchoring area. The actuation mechanism includes plural thermal or piezoelectric actuators of micro-beam type, distributed at the periphery of the membrane, the micro-beams including at least one fixed part joined to the support and at least one moving part coming into contact, on an actuation, with the membrane in an area situated between the central area and the anchoring area.

An article of footwear, such as a shoe including an outer sole assembly and an upper, the outer sole assembly extending length-wise from a rear end to a front end, and width-wise between a lateral side and a medial side, the outer sole assembly having a surface for contact with the ground, the outer sole assembly including a wear layer provided to take support on the ground, the wear layer having at least one through-opening, the outer sole assembly including at least one reinforcing layer arranged between the wear layer and the upper, the reinforcing layer extending at least partially in the area of the opening. A damping layer is arranged between the wear layer and the reinforcing layer.

An absorbent article, such as a sanitary napkin, includes a top sheet and a back sheet with an absorbent core sandwiched therebetween. To decrease transverse leakage, a channeled acquisition distribution layer is placed between the absorbent core and the top sheet. The acquisition distribution layer has apertures and channels open toward the top sheet extending in the longitudinal or machine direction of the article. The channels have a lower permeability through the layer than the remaining portions of the acquisition distribution layer by containing less apertures or by melting the channels so that material fills in substantially all of the apertures in the channels. In further embodiments, the channels may be impermeable and extend substantially the full length of the acquisition distribution layer.

An apparatus and method for preventing ocular surface abnormalities. This apparatus includes a frame containing at least one lens and at least one seal. The frame, lens, and seal provide an area about the eyes of a user that is at least partially enclosed from a surrounding environment when worn. Humidity and temperature are increased in the area about the eyes of the user to provide a microenvironment in the area about the eyes of the user. The microenvironment is capable of reducing or preventing ocular surface abnormalities, alleviating ocular discomfort, and improving ocular health. The seal may be removable and may attach to prescription eyeglasses, sunglasses, and so on. The seal may also contain a filter, such as a HEPA filter.

An optical film comprises: a transparent plastic film substrate; and a cured layer having a dry thickness of 100 nm or more, formed by coating a curable composition comprising: a low refractive index fine particle having a refractive index of 1.50 or less; and a binder, wherein the low refractive index fine particle is unevenly distributed in the cured layer to a surface portion on the side opposite the transparent plastic film substrate.

A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.