This invention discloses a variable-temperature aluminum
nitride nucleation layer and its epitaxial growth method for suppressing
radio frequency loss. The method involves setting the third-order AlN
nucleation layer as a low-temperature-high-temperature-low-temperature layer and introducing in-situ crystalline SiN between the AlN interfaces. x Layer, this in-situ crystalline SiN x The layer effectively blocks Al / Ga interface
diffusion, reducing the probability of parasitic
conductive channel formation and effectively reducing RF device loss. The introduction of two low-temperature AlN
nucleation layers effectively slows down Al / Ga
diffusion, avoids the formation of conductive channels in the substrate, reduces leakage current during RF operation, and improves device power-added efficiency (PAE). Through three-stage
temperature control, high-density nucleation and
diffusion suppression are achieved in the low-temperature seed layer. The medium-high temperature
crystallization layer significantly improves
crystal quality and compresses
dislocation density to a low level. Finally, the low-temperature high-resistivity layer effectively locks carbon atoms and improves resistivity, thereby achieving a synergistic improvement in the electrical and structural properties of the material.