77results about How to "High imaging sensitivity" patented technology

The present invention involves a method for making a relief image. A film that includes a carrier sheet and an imageable material is used to form a mask image that is opaque to a curing radiation. In one embodiment, the mask image is formed on the carrier sheet while in another embodiment, the mask image is formed on a receptor sheet. The mask image is then transferred to a photosensitive material, such as a flexographic printing plate precursor. The resulting assembly is exposed to the curing radiation resulting in exposed and unexposed areas of the photosensitive material. The carrier sheet or the receptor sheet may be removed from the mask image either before or after exposure to the curing radiation. Finally, the photosensitive material and mask image assembly is developed with a suitable developer to form a relief image.

Laser-engraveable flexographic printing plate precursors have a laser-engraveable elastomeric layer that comprises a non-free radical crosslinked polymeric binder, an infrared radiation absorbing compound, and a compound that remains stable in the precursor but upon imaging thermally degrades to produce gaseous products. The thermally degradable compounds can generate or liberate one or more gases such as nitrogen and carbon dioxide.

According to the present invention there is provided a heat-sensitive material for making lithographic printing plates comprising on a lithographic support a first image-forming layer comprising a hydrophilic binder, a cross-linking agent for said hydrophilic binder and dispersed hydrophobic thermoplastic polymer particles, and as top image-forming layer a heat switchable image forming layer comprising a heat switchable polymer wherein said top image-forming layer or a layer adjacent to said top image-forming layer comprises a compound capable of converting light into heat, characterized in that said heat switchable polymer is a polymer containing aryldiazosulphonate units.

A digital camera automatically changes its imaging sensitivity based on a proper exposure value that is calculated at a predetermined standard imaging sensitivity based on subject brightness measured from a photometry area of a scene to shoot. When the decided imaging sensitivity is higher than a predetermined sensitivity threshold value, the scene is judged to be a low brightness backlit scene that contains a higher brightness portion around a dark main subject, and a lower brightness portion around the higher brightness portion. A rear light judgment value is calculated as a difference between a central photometric value and a peripheral photometric value of a photometry area, and is compared with a predetermined rear light threshold value, to judge whether the scene is backlit or not. When the scene is judged to be a backlit scene or a low brightness backlit scene, the digital camera emits a flash light synchronously with an exposure.

An image capture apparatus is disclosed that includes an aperture having an adjustable aperture value, an image capturing element, and a drive unit that drives the image capturing element to operate in video image capturing mode and still image capturing mode. The aperture has at least a dedicated aperture value for the still image capturing mode or a dedicated aperture value for the video image capturing mode.

The present invention relates to an X-ray line array detector in which a bundle of light-guide fibers is provided between an emergent surface of a flicker body and an incident surface of an array of photosensors, and the bundle of light-guide fibers has at least one bend, or an incident direction and an emergent direction are not in a same line, so that X-rays transmitting through the flicker body can not irradiate photosensors and integrated circuits behind them, and that damage resulting from long-term use or a large dose of X-ray radiation can be avoided, thereby prolonging lifetime of the line array detector. Further, a shielding body provided between the emergent surface of the flicker body and the incident surface of the array of photosensors can further shield the photosensors and their integrated circuits from interference of X-rays, so that good protection of the photosensors and their integrated circuits is achieved, thereby enhancing greatly anti-radiation performance of the detector and doubling the lifetime.

A radiation-sensitive composition and negative-working imageable element includes a polymeric binder that has a hydrophobic backbone and pendant salt groups that comprise a cation covalently attached to the hydrophobic backbone and a boron-containing anion forming a salt with the cation. The use of these particular polymers provides fast digital speed (high imaging sensitivity) and good printability (good shelf-life) even when the preheat step normally used between exposure and development, is omitted.

The invention discloses a sound field measuring apparatus. Light emitted by a laser is successively reflected by a sound field generated by a transmitting lens, a collimator lens, a half mirror and anacoustic transducer as well as a reflection mirror and is then returned by virtue of the original sound field, after the light beam is deflected for 90 degrees by virtue of a light splitter, the light passes through a Fourier transform lens to perform the space filter treatment on a rear focal plane of the Fourier transform lens, so that the sound-field imaging can be realized; an image sensor ismoved to the rear focal plane of a variable lens to receive a diffraction spot, a sound speed can be calculated according to the distance of the diffraction spot, and the sound pressure is calculatedaccording to the distribution of the spot intensity; and a diaphragm is arranged between the sound field and the light splitter and can be used for measuring the sound pressure of a local sound fieldarea. By adopting the sound field measuring apparatus, the imaging of the sound fields in various forms in transparent fluid can be realized, and the plane sound field, the approximate plane sound field and the intensity of the approximate plane sound field area in the sound field can be quantitatively measured; by virtue of the calibration of the transducer, the measurement of a pulse wave and continuous traveling wave plane sound field or approximate plane sound field can be realized; and by adopting the reflection mirror, the light passes through the sound field twice, so that the imagingand measuring sensitivity can be improved.

An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a light-sensing area of a first surface thereof, first conducting pads electrically connected to the light-sensing elements, and a conducting channel passing through the chip and electrically connected to the first conducting pads at one end. The supporting element has an opening, a first coupling surface, and a second coupling surface. The opening corresponds to the light-sensing area and the first coupling surface is combined with the first surface of the chip while the light-transmitting element is combined with the second coupling surface. The supporting element separates the light-transmitting element from the chip by a proper distance, so as to enhance an image sensing accuracy of an image sensor module. The chip having the conducting channel effectively facilitates reducing an overall volume of the image sensor module package structure.

A chip package assembly is rather than a conventional package assembly and can improve the ability of packaging a photoelectric chip in order to save materials and costs. The chip package assembly includes a transparent substrate, a chip is electrically connected to a circuit layout of the transparent substrate, a joint pad arranged therebetween. Make sure an unoccupied layer is sealed up between the transparent substrate and the chip, so as to form the chip package assembly. After the processes mentioned above are done, the chip package assembly can leave the clean room to run post-processes, such as die sawing, or camera module packaging.

The invention discloses an electrical impedance imaging method, and belongs to the technical field of electrical impedance scanning and imaging. The method disclosed by the invention comprises: step 1, respectively arranging a first electrode device and a second electrode device contacting with the surface of an object to be imaged at the two opposite sides of the object to be imaged, and enabling the first electrode device and the second electrode device to apply a constant clamp force onto the object to be imaged; step 2, applying an input electric signal via the first electrode device, acquiring the output electric signal of the second electrode device, and obtaining the current distribution of the object to be imaged under the clamp force; step 3, changing the clamping forced applied on the object to be imaged by the first electrode device and the second electrode device, and repeating the step 2; and step 4, constructing the impedance image of the object to be imaged according to the current distribution difference value of the object to be imaged between two different clamp forces. Compared with the prior art, the method disclosed by the invention has the advantages of higher sensitivity, good electrode contact antifact inhibition effect, and low implementation cost.

A method for forming microlenses of different curvatures is described, wherein a transparent photosensitive layer is formed on a substrate having a planar upper surface. A photomask is used to pattern the photosensitive layer, wherein the photomask has at least two patterns of different transparencies thereon such that at least two islands of different thicknesses are defined from the photosensitive layer. Then, the at least two islands are heated and softened to form at least two microlenses of different curvatures.

A kit for making a relief image that includes a film made of an infrared-imageable material and a separate imageable article comprising a photosensitive material disposed on a substrate. The film may be used to form a mask image that is opaque to a curing radiation by exposing the infrared-imageable material to infrared radiation. The mask image may then be transferred to the photosensitive material. The resulting assembly may be exposed to the curing radiation resulting in exposed and unexposed areas of the photosensitive material. Finally, the photosensitive material and mask image may be developed with a suitable developer to form a relief image.

In order to solve the problem of low imaging sensitivity of the existing polarization imaging technology, the present invention provides a full-stokes single-photon compression polarization imaging apparatus and method. According to the full-stokes single-photon compression polarization imaging apparatus and method provided by the present invention, a micro-polarizer array is attached to a DMD mirror surface, so that polarization imaging based on a single-pixel imaging technology is realized; and a single-photon detector is used to detect light intensity, so that ultra-high imaging sensitivityis achieved.

Described herein are methods of treating cancer by administering a therapeutically effective amount of at least one texaphyrin metal complex or a pharmaceutically acceptable derivative, and performing stereotactic radiosurgery to the patient. In some embodiments, at least one texaphyrin metal complex or a pharmaceutically acceptable derivative is administered while the patient is undergoing a radiation therapy. Also described herein are methods for detecting various cancerous tumors, lesions, or metastases in a patient by administering an effective amount of at least one texaphyrin metal complex or a pharmaceutically acceptable derivative before a patient undergoes stereotactic radiosurgery. Also described herein are methods for visualizing tumors not otherwise visualized; methods for detecting the margins of a tumor; and methods for improving the targeting of the SRS radiation.

An image sensor and a manufacturing method thereof are provided. The image sensor includes a plurality of sensors, an inter-layer dielectric layer formed over the sensors, a first inter-metal dielectric layer formed over the inter-layer dielectric layer, and a plurality of first via walls formed in the first inter-metal dielectric layer, wherein each of the first via walls is formed around each of the sensors. In addition, the image sensor further includes a second inter-metal dielectric layer formed over the first inter-metal dielectric layer and a plurality of second via walls formed in the second inter-metal dielectric layer, wherein each of the second via walls is formed around each of the sensors. Therefore, the light leakage between different pixels and the problem of crosstalk are solved, and the spatial resolution and the photo sensitivity of the image sensor are enhanced.

A method for packaging a chip is rather than a conventional package technology and can improve the ability of packaging a photoelectric chip in order to save materials and costs. A chip package assembly is produced by preparing a transparent substrate in advance, a chip is electrically connected to a circuit layout of the transparent substrate. Make sure an unoccupied layer is sealed between the transparent substrate and the chip, so as to form the chip package assembly. After the processes mentioned above are done, the chip package assembly can leave the clean room to run post-processes, such as die sawing, or camera module packaging.

The invention discloses a photo-acoustic microscopic imaging system and method based on surface plasmon resonance. The system generates exciting light, the exciting light acts on photo-acoustic wavesacting on a liquid interface and generated and returned by a measured object, a refraction index of the liquid interface is changed along with variation of the pressure of the photo-acoustic waves, the system further generates probe light, a probe light path acts on a metal film, so that the metal film generates surface plasmon resonance, the probe light path senses variation of the refraction index of the liquid interface at a surface plasmon resonance position, a phase position of the probe light is changed, the system further generates Michelson interference, light intensity interference value is acquired, and a contrast image is generated according to the light intensity interference value. According to the photo-acoustic microscopic imaging system and method, a system detection bandwidth is improved by the aid of a strong local effect of tight focusing vector light, and a sensor can improve imaging sensitivity by a phase-type analysis mode, so that the photo-acoustic microscopic imaging system with high signal-to-noise ratio and broad-spectrum detection capability is achieved.

An imageable element can be imaged using non-ablative processes. This element has a non-silicone, non-crosslinked layer contiguous to and under an ink-repelling crosslinked silicone rubber layer. These elements can be used for providing lithographic printing plates useful for waterless printing (no fountain solution). Processing after imaging is relatively simple with either water or an aqueous solution consisting essentially of a surfactant or mechanical means to remove the crosslinked silicone rubber layer and a minor portion of the non-silicone, non-crosslinked layer in the imaged regions.