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74results about How to "Yield easily" patented technology

Process for producing fiber-reinforced silicon carbide composites

A process produces a fiber-reinforced silicon carbide composite. The resulting composite has a high toughness where bundles of a reinforcing fiber are densely covered with glassy carbon derived from a resin to avoid deterioration of the strength, and it can easily be produced even in complicated shapes. Specifically, a fiber-reinforced silicon carbide composite is produced by preparing a fiber prepreg containing a powdered silicon and a resin and molding the prepreg to yield a green body having a desired shape, or laminating a fiber prepreg containing a resin and a woven fabric prepreg containing a powdered silicon and a resin in alternate order, and molding the laminate to yield a green body having a desired shape; carbonizing the green body at 900° C. to 1350° C. in an inert atmosphere; impregnating the carbonized body with a resin; firing the impregnated body again at 900° C. to 1350° C. in an inert atmosphere; performing the resin impregnation-carbonization procedure one to five times; subjecting the carbonized composite to reaction sintering at a temperature of 1300° C. or more in vacuo or in an inert atmosphere to form open pores, and finally infiltrating molten silicon into the sintered body having open pores at a temperature of about 1300° C. to 1800° C. in vacuo or in an inert atmosphere.
Owner:NAT INST OF ADVANCED IND SCI & TECH

Method for manufacturing display device and method for manufacturing electronic device

Provided is a method for manufacturing a highly reliable display device. The method includes steps of providing a first layer, a first insulating layer, an electrode, and a second insulating layer over a first surface of a first substrate; removing a part of the second insulating layer to provide a first opening; providing a display element and a second layer over the second insulating layer; providing a third layer and a third insulating layer over a second surface of a second substrate; removing part of the third layer and part of the third insulating layer to provide a second opening; overlapping the first substrate and the second substrate with a bonding layer positioned therebetween such that the first surface and the second surface face each other and the first opening and the second opening have an overlap region; separating the first substrate and the first layer from the first insulating layer; providing a third substrate such that the first insulating layer and the third substrate overlap with each other; separating the second substrate, part of the bonding layer, part of the second layer, and the third layer from the third insulating layer; and providing a fourth substrate such that the third insulating layer and the fourth substrate overlap with each other.
Owner:SEMICON ENERGY LAB CO LTD
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