Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Abstract

The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input / output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

Description

[0001] This application is a divisional of U.S. Ser. No. 10 / 030,739, filed Jan. 11, 2002, which is a National Stage of International Application No. PCT / JP01 / 03922, filed May 11, 2001.TECHNICAL FIELD [0002] The present invention relates to a circuit substrate to have mounted thereon a semiconductor device and a method of producing the same. The invention also relates to a method of mounting a semiconductor device, with use of such a circuit substrate. BACKGROUND ART [0003] As one of techniques for mounting semiconductor devices on a circuit substrate, a flip chip mounting method has been known. In this method, bump electrodes are formed on a surface of a semiconductor chip on the same side that a functional element thereof is formed, and the bump electrodes are connected through an adhesive layer to input / output terminal electrodes arranged on a circuit substrate. In this method, the bump electrodes are formed of gold (Au), nickel (Ni) or the like by plating, and for an adhesive lay...

AI Technical Summary

Benefits of technology

This solution enables reliable, stress-free connections between semiconductor devices and circuit substrates, allowing for miniaturization and high productivity with reduced risk of damage or failure, while maintaining the integrity of semiconductor device performance.

Problems solved by technology

However, a diameter of solder bumps is so large that an electrode arrangement for mounting with area array arrangement has been limited to an electrode pitch of about 250 μm, if necessity of miniaturizing processes of substrates and package reliability are considered.

This force may damage a semiconductor circuit or may cause failures, or breakage, of A1 interconnections on the semiconductor substrate.

In packaging by using this method, the conductive resin in its entirety is cured while the semiconductor substrate is being pressed with a large force so as to be brought into direct contact with the input / output terminal electrodes of the substrate, so that stress occurring between electrodes facing each other produces residual stress within the semiconductor substrate, thereby reducing performance of a semiconductor circuit.

In particular, pressure exerted on the bump electrodes at a time of mounting may cause the input / output terminal electrodes of the circuit substrate to be deformed into fracture during via hole filling of the substrate connected to the electrodes, resulting in faulty connections in the circuit substrate.

In the packaging technique disclosed in Japanese Patent Publication No. 8-037206, there has been a problem in that bonding of a large number of ball bumps to adhesive layers reduces reliability because small pieces of a conductive sheet punched from a conductive adhesive sheet must be handled.

While loads during packaging are partially applied only to the vicinity of the electrodes, thereby reducing damage to a semiconductor device, an increase in pressure for ensuring bonding may cause a risk with regard to destructing via holes beneath pad electrodes on a circuit substrate because bump electrodes apply pressure to the pad electrodes and stress the pad electrodes.

Another problem is that the conductive adhesive sheet is very weak in terms of adhesive strength for joining the semiconductor device to the circuit substrate, thereby resulting in reducing reliability of a semiconductor package.

Though the bumps might be deformed so as to collapse and bonding could be thereby reinforced, there is a danger that such a deformation might result in damage to the semiconductor chip as described above.

Images