Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Abstract

The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input / output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

Description

[0001] This application is a divisional of U.S. Ser. No. 10 / 030,739, filed Jan. 11, 2002, which is a National Stage of International Application No. PCT / JP01 / 03922, filed May 11, 2001.TECHNICAL FIELD [0002] The present invention relates to a circuit substrate to have mounted thereon a semiconductor device and a method of producing the same. The invention also relates to a method of mounting a semiconductor device, with use of such a circuit substrate. BACKGROUND ART [0003] As one of techniques for mounting semiconductor devices on a circuit substrate, a flip chip mounting method has been known. In this method, bump electrodes are formed on a surface of a semiconductor chip on the same side that a functional element thereof is formed, and the bump electrodes are connected through an adhesive layer to input / output terminal electrodes arranged on a circuit substrate. In this method, the bump electrodes are formed of gold (Au), nickel (Ni) or the like by plating, and for an adhesive lay...

AI Technical Summary

Benefits of technology

[0016] It is an object of the present invention to provide a circuit substrate, which is to constitute a package structure by mounting a semiconductor device thereon, which allows connections between electrodes without exerting stress to electrodes or degrading characteristics of the semiconductor device while being mounted onto the circuit substrate.

[0017] It is another object of the invention to provide a method for allowing connections between electrodes without development of residual stress between these electrodes when mounting a semiconductor device onto a circuit substrate, and a method of producing such a package structure.

[0019] When the semiconductor device is mounted onto the circuit substrate, the bump electrodes of the semiconductor device are pressed toward the input / output electrodes on the circuit substrate such that the pointed heads of the bump electrodes pierce the resin film on the circuit substrate and reach respective conductive adhesive layers. The conductive adhesive layers receive the bump electrodes, attach fixedly thereto, and relax stresses to be applied to the semiconductor device by the bump electrodes, which avoids damaging semiconductor circuits and interconnections on the semiconductor device. Even if the heads of some of the bump electrodes do not reach the input / output electrodes because of warp in the circuit substrate or unevenness in height of the pointed heads, the pointed heads are received within the conductive adhesive layers so that electrical connection between opposing electrodes can be secured by conductivity of the conductive adhesive layers.

[0020] In the present invention, the resin film serves also as a protective coating which protects the input / output electrodes of the circuit substrate. For a package structure, the resin film has a function of supporting and reinforcing connection regions, including the bump electrodes and the conductive adhesive layers, to integrally join a surface of the circuit substrate to a surface of a semiconductor circuit, thus ensuring electrical and mechanical reliability of the package structure and enabling heat-press packaging that is suitable for high productivity.

[0021] The package structure of the present invention is capable of preventing degradation in characteristics of a semiconductor functional part, and failures such as breaks in interconnections that have been problems with conventional anisotropic conductive films, because the conductive adhesive layers relax stress during packaging. Besides, use of conductive adhesive layers allows mounting with a low load, because such a mounting load that deforms the input / output electrodes of the circuit substrate is not required. Moreover, addition of conductive adhesive layers having a flexible nature into a junction layer leads to provision of a package structure that is more reliable than conventional structures. The package structure can be assembled with heat-press bonding mounting with high productivity and low cost that causes no damage, in contrast to typical package structures for an integrated circuit.

Problems solved by technology

However, a diameter of solder bumps is so large that an electrode arrangement for mounting with area array arrangement has been limited to an electrode pitch of about 250 μm, if necessity of miniaturizing processes of substrates and package reliability are considered.

This force may damage a semiconductor circuit or may cause failures, or breakage, of A1 interconnections on the semiconductor substrate.

In packaging by using this method, the conductive resin in its entirety is cured while the semiconductor substrate is being pressed with a large force so as to be brought into direct contact with the input / output terminal electrodes of the substrate, so that stress occurring between electrodes facing each other produces residual stress within the semiconductor substrate, thereby reducing performance of a semiconductor circuit.

In particular, pressure exerted on the bump electrodes at a time of mounting may cause the input / output terminal electrodes of the circuit substrate to be deformed into fracture during via hole filling of the substrate connected to the electrodes, resulting in faulty connections in the circuit substrate.

In the packaging technique disclosed in Japanese Patent Publication No. 8-037206, there has been a problem in that bonding of a large number of ball bumps to adhesive layers reduces reliability because small pieces of a conductive sheet punched from a conductive adhesive sheet must be handled.

While loads during packaging are partially applied only to the vicinity of the electrodes, thereby reducing damage to a semiconductor device, an increase in pressure for ensuring bonding may cause a risk with regard to destructing via holes beneath pad electrodes on a circuit substrate because bump electrodes apply pressure to the pad electrodes and stress the pad electrodes.

Another problem is that the conductive adhesive sheet is very weak in terms of adhesive strength for joining the semiconductor device to the circuit substrate, thereby resulting in reducing reliability of a semiconductor package.

Though the bumps might be deformed so as to collapse and bonding could be thereby reinforced, there is a danger that such a deformation might result in damage to the semiconductor chip as described above.

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