The invention relates to the technical field of
integrated circuit component packaging, in particular to a dip
welding type
copper strip winding type
welding column preparation device and method. Comprising a lead wire traction mechanism for leading out a lead wire, a
copper strip winding mechanism for winding a
copper strip on the lead wire, a segmented placement mechanism for
cutting the copper strip wrapped lead wire, a gantry clamping mechanism for grabbing and rotating the copper strip wrapped lead wire, a dip
welding mechanism for
soldering the
tin copper strip wrapped lead wire and a welding column
cutting and collecting mechanism for
cutting and collecting a welding column, the copper strip winding mechanism comprises a driving motor, a hollow rotating platform is arranged at the output end of the driving motor, a rotating
wall plate is arranged on the hollow rotating platform, a copper strip
damper for placing a copper strip is arranged at one end of the rotating
wall plate, and a guide roller is arranged on the rotating
wall plate; the dip welding mechanism comprises a scaling
powder heating table, a
tin pot heating table and a
tin scraping mechanism which are arranged in sequence. The device is simplified, the
automation degree is high, the size is small, and batch preparation of the enhanced welding columns can be achieved.