61results about How to "Accelerate breakage" patented technology

Certain example embodiments of this invention relate to metal-inclusive edge seal designs for vacuum insulating glass (VIG) units, and / or methods of making the same. First and second substantially parallel spaced-apart glass substrates, including edge portions thereof, are provided. At least one metal-inclusive edge-sealing strip is located proximate to the edge portions of the first and second substrates, getter being applied to at least a portion of at least some of the edge-sealing strips, and the at least one edge-sealing strip being selected so as to have a coefficient of thermal expansion over a temperature range of interest within about 25% of a coefficient of thermal expansion of the first and second substrates, the temperature range of interest being from about −40° C. to about 50° C. The first and second substrates are sealed together proximate to the edge portions thereof with the at least one edge-sealing strip via an edge-sealing material provided to the at least one edge-sealing strip and / or the first and second glass substrates.

Certain example embodiments of this invention relate to edge sealing techniques for vacuum insulating glass (VIG) units. More particularly, certain example embodiments relate to techniques for providing localized heating to edge seals of units, and / or unitized ovens for accomplishing the same. In certain example embodiments, a unit is pre-heated to one or more intermediate temperatures, localized heating via at least one substantially two-dimensional array of heat sources is provided proximate to the peripheral edges of the unit so as to melt frits placed thereon, and cooled. In certain non-limiting implementations, the pre-heating and / or cooling may be provided in one or more steps. An oven for accomplishing the same may include multiple zones for performing the above-noted steps, each zone optionally including one or more chambers. Accordingly, in certain example embodiments, a temperature gradient proximate to the edges of the unit is created, thereby reducing the chances of breakage and / or at least some de-tempering of the substrates.

Certain example embodiments of this invention relate to edge sealing techniques for vacuum insulating glass (VIG) units. More particularly, certain example embodiments relate to techniques for providing localized heating to edge seals of units, and / or unitized ovens for accomplishing the same. In certain example embodiments, a unit is pre-heated to one or more intermediate temperatures, localized heating (e.g., from one or more substantially linear focused IR heat sources) is provided proximate to the peripheral edges of the unit so as to melt frits placed thereon, and cooled. In certain non-limiting implementations, the pre-heating and / or cooling may be provided in one or more steps. An oven for accomplishing the same may include multiple zones for performing the above-noted steps, each zone optionally including one or more chambers. Accordingly, in certain example embodiments, a temperature gradient proximate to the edges of the unit is created, thereby reducing the chances of breakage and / or at least some de-tempering of the substrates.

Certain example embodiments of this invention relate to vacuum insulated glass (VIG) units. The VIG unit may comprise first and second substrates with inner and outer substantially planar surfaces. For either or both of the first and second substrates, when considered along a side cross-section, a portion of the inner planar surface is removed proximate to an outer edge of the glass substrate so as to form a shoulder portion. An inner surface of the shoulder portion is angled (a negative number of degrees, zero degrees, or a positive number of degrees) relative to the inner and outer planar surfaces. The shoulder portion at its smallest height is at least about 50% of the glass substrate at its largest height. A side portion of the step proximate the edge also may be angled, e.g., so that it is or is not perpendicular to the planar surfaces.

Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.

An extreme ultraviolet light source apparatus using a spectrum purity filter capable of obtaining EUV light with high spectrum purity. The apparatus includes a chamber; a target supply unit for supplying a target material; a driver laser using a laser gas containing a carbon dioxide gas as a laser medium, for applying a laser beam to the target material to generate plasma; a collector mirror for collecting and outputting the extreme ultraviolet light radiated from the plasma; and a spectrum purity filter provided in an optical path of the extreme ultraviolet light, for transmitting the extreme ultraviolet light and reflecting the laser beam, the spectrum purity filter including a mesh having electrical conductivity and formed with an arrangement of apertures having a pitch not larger than a half of a shortest wavelength of the laser beam applied by the driver laser.

Certain example embodiments of this invention relate to composite pillar arrangements for VIG units that include both harder and softer materials. The softer materials are located on the outside or extremities of the central, harder pillar material. In certain example embodiments, a high aspect ratio mineral lamellae is separated by an organic “glue” or polymer. When provided around a high strength pillar, the combination of the pillar and such a nano-composite structure may advantageously result in superior strength compared to a monolithic system, e.g., where significant wind loads, thermal stresses, and / or the like are encountered.

A means for effectively preventing the temperature rise of the diode when the bypass diode is operating in a terminal box for a crystalline silicon solar cell panel is provided. The present invention is characterized in that, in the terminal box for a crystalline silicon solar cell panel, Schottky barrier diode is used as a bypass diode. Preferably, the forward-direction voltage drop of the Schottky barrier diode is the specific value or below at the specific junction temperature. Preferably, as a Schottky barrier diode, a package diode which is surface-mounting type or non-insulation type is used.

A hollow part is formed in a silicon substrate through the front and the back. A vibration electrode plate is arranged on an upper surface of the silicon substrate to cover the opening on the upper surface. A fixed electrode plate covers the upper side of the vibration electrode plate while maintaining a microscopic gap with the vibration electrode plate, where the peripheral part is fixed to the upper surface of the silicon substrate. The fixed electrode plate has the portion facing the upper surface of the silicon substrate through a space supported by a side wall portion arranged on an inner edge of the portion fixed to the upper surface of the silicon substrate without interposing a space. The outer surface of the side wall portion of the fixed electrode plate is covered by a reinforcement film made of metal such as Au, Cr, and Pt.

Certain example embodiments of this invention relate to a frit slurry paste for use in assemblies (e.g., a vacuum insulated glass unit or a plasma display panel), and methods of making the same. Frit powder, binder material, and a water-based solvent are mixed together to form an intermediate mixture. The frit powder is substantially lead free, and the water-based solvent is provided at a first temperature. Additional water-based solvent is added to the intermediate mixture to form a frit slurry paste. The additional water-based solvent is provided at a second temperature, with the second temperature being lower than the first temperature. The binder material is provided at a concentration of 0.001%-20% by weight with respect to the frit slurry paste or the frit slurry paste absent the frit powder. The frit slurry paste has a bulk viscosity of 2,000-200,000 cps.

A method for manufacturing a liquid crystal display element, includes: providing a long sheet material including a laminate of an optical film containing a polarizer, a pressure-sensitive adhesive layer, and a carrier film temporarily bonded to the pressure-sensitive adhesive layer; cutting the long sheet material at predetermined intervals, while maintaining the continuity of the carrier film; peeling off the carrier film by a tensile force; and continuously bonding the resulting optical film pieces to liquid crystal panels, respectively, through the pressure-sensitive adhesive layer exposed by the peeling off, while feeding the resulting optical film pieces, wherein the cutting is performed to such a depth as to substantially reach the carrier film, and the carrier film is cut to a depth less than half of the thickness of the carrier film at least both end portions in the width direction of the carrier film.

Certain example embodiments of this invention relate to a frit slurry paste for use in assemblies (e.g., a vacuum insulated glass unit or a plasma display panel), and methods of making the same. Frit powder, binder material, and a water-based solvent are mixed together to form an intermediate mixture. The frit powder is substantially lead free, and the water-based solvent is provided at a first temperature. Additional water-based solvent is added to the intermediate mixture to form a frit slurry paste. The additional water-based solvent is provided at a second temperature, with the second temperature being lower than the first temperature. The binder material is provided at a concentration of 0.001%-20% by weight with respect to the frit slurry paste or the frit slurry paste absent the frit powder. The frit slurry paste has a bulk viscosity of 2,000-200,000 cps.