Solder resist ink composition
A technology of ink composition and resist, which is applied in the manufacture of instruments, electrical components, and printed circuits, can solve the problem of poor adhesion between conductor pads and solder bodies, poor adhesion, and tightness between conductor pads and chemical plating layers. In order to improve the photocuring characteristics, improve the operability and improve the impregnability, etc.
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Examples
Embodiment 1～4
[0059] Using the A varnish obtained in Synthesis Example 1, the ingredients shown in Table 2 were kneaded with a 3-roll mill to obtain a solder resist ink composition.
[0060] Match raw materials
trade name or chemical name
Example (part)
1
2
3
4
photopolymerization initiator
A
Irgacure 784
16
-
2
-
B
Irgacure 369
-
16
10
10
photosensitive prepolymer
A varnish
160
160
160
160
Thinner
Dipropylene glycol monomethyl ether
40
40
40
40
Curing Catalysts for Epoxy Resins
Dicyandiamide
0.5
0.5
0.5
0.5
Melamine
1
1
1
1
coloring pigment
Phthalocyanine green
1
1
1
1
filler
Barium sulfate
80
80
80
80
Defoamer
KS-66 (manufactured by Shin-Etsu Chemical Co., Ltd.)
1
1
1
1
photopolymerizable monomer
dipentaer...
Synthetic example 2
[0112] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux cooler, add methyl methacrylate, ethyl methacrylate, and methacrylic acid in a molar ratio of 1:1:2, and use dipropylene glycol as a solvent Monoethyl ether, using azobisisobutyronitrile (AIBN) as a catalyst, stirring at 80° C. for 4 hours under a nitrogen atmosphere to obtain a resin solution.
[0113] Cool the resin solution, use methyl hydroquinone as a polymerization inhibitor, tetrabutylphosphonium bromide as a catalyst, and carry out an addition reaction corresponding to 20 mol% of the carboxylic acid groups of the resin at 95 to 105 ° C and 16 hours, Remove after cooling.
[0114] The thus obtained photosensitive prepolymer having an ethyl carboxyl group having an ethylenically unsaturated bond had a nonvolatile content of 65%, an acid value of solid content of 120 mgKOH / g, and a Mw of about 15,000. This resin solution is hereinafter referred to as B varnish.
Synthetic example 3
[0116] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux cooler, add methyl methacrylate and glycidyl methacrylate in a molar ratio of 4:6, the solvent uses carbitol acetate, and the catalyst Using AIBN, it stirred at 80 degreeC for 4 hours under nitrogen atmosphere, and obtained the resin solution.
[0117] Cool the resin solution, use methyl hydroquinone as a polymerization inhibitor, tetrabutylphosphonium bromide as a catalyst, and carry out 100 mol% addition reaction to the carboxylic acid groups of the resin under the condition of 95-105° C. for 16 hours. This reaction product was cooled to 80-90 degreeC, and tetrahydrophthalic anhydride was reacted for 8 hours, and it took out after cooling.
[0118] The thus-obtained photosensitive prepolymer having an ethylenically unsaturated bond ethyl carboxyl group had a nonvolatile content of 65%, an acid value of solid content of 100 mgKOH / g, and a Mw of approximately 15,000. This resin solution ...
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Abstract
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