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Solder resist ink composition

A technology of ink composition and resist, which is applied in the manufacture of instruments, electrical components, and printed circuits, can solve the problem of poor adhesion between conductor pads and solder bodies, poor adhesion, and tightness between conductor pads and chemical plating layers. In order to improve the photocuring characteristics, improve the operability and improve the impregnability, etc.

Inactive Publication Date: 2002-08-14
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a solder resist film of a related composition is used, when a solder body such as a solder ball is supplied to a conductor pad (solder pad) formed on the solder resist film, the adhesion between the conductor pad and the solder body may be poor. Good, especially need to improve
Especially in order to improve the adhesion of the solder body to the conductor pad, after the formation of the solder resist film (or before the formation of the solder resist film), when an electroless plating layer (undercoat layer) is formed on the surface of the conductor pad, it is obviously inclined to produce a conductor Poor adhesion between pads and electroless plating and / or between electroless plating and solder body, especially between conductor pads and electroless plating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0059] Using the A varnish obtained in Synthesis Example 1, the ingredients shown in Table 2 were kneaded with a 3-roll mill to obtain a solder resist ink composition.

[0060] Match raw materials

trade name or chemical name

Example (part)

1

2

3

4

photopolymerization initiator

A

Irgacure 784

16

-

2

-

B

Irgacure 369

-

16

10

10

photosensitive prepolymer

A varnish

160

160

160

160

Thinner

Dipropylene glycol monomethyl ether

40

40

40

40

Curing Catalysts for Epoxy Resins

Dicyandiamide

0.5

0.5

0.5

0.5

Melamine

1

1

1

1

coloring pigment

Phthalocyanine green

1

1

1

1

filler

Barium sulfate

80

80

80

80

Defoamer

KS-66 (manufactured by Shin-Etsu Chemical Co., Ltd.)

1

1

1

1

photopolymerizable monomer

dipentaer...

Synthetic example 2

[0112] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux cooler, add methyl methacrylate, ethyl methacrylate, and methacrylic acid in a molar ratio of 1:1:2, and use dipropylene glycol as a solvent Monoethyl ether, using azobisisobutyronitrile (AIBN) as a catalyst, stirring at 80° C. for 4 hours under a nitrogen atmosphere to obtain a resin solution.

[0113] Cool the resin solution, use methyl hydroquinone as a polymerization inhibitor, tetrabutylphosphonium bromide as a catalyst, and carry out an addition reaction corresponding to 20 mol% of the carboxylic acid groups of the resin at 95 to 105 ° C and 16 hours, Remove after cooling.

[0114] The thus obtained photosensitive prepolymer having an ethyl carboxyl group having an ethylenically unsaturated bond had a nonvolatile content of 65%, an acid value of solid content of 120 mgKOH / g, and a Mw of about 15,000. This resin solution is hereinafter referred to as B varnish.

Synthetic example 3

[0116] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux cooler, add methyl methacrylate and glycidyl methacrylate in a molar ratio of 4:6, the solvent uses carbitol acetate, and the catalyst Using AIBN, it stirred at 80 degreeC for 4 hours under nitrogen atmosphere, and obtained the resin solution.

[0117] Cool the resin solution, use methyl hydroquinone as a polymerization inhibitor, tetrabutylphosphonium bromide as a catalyst, and carry out 100 mol% addition reaction to the carboxylic acid groups of the resin under the condition of 95-105° C. for 16 hours. This reaction product was cooled to 80-90 degreeC, and tetrahydrophthalic anhydride was reacted for 8 hours, and it took out after cooling.

[0118] The thus-obtained photosensitive prepolymer having an ethylenically unsaturated bond ethyl carboxyl group had a nonvolatile content of 65%, an acid value of solid content of 100 mgKOH / g, and a Mw of approximately 15,000. This resin solution ...

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Abstract

A solder resist ink composition for printed circuit boards which is suitable for forming, with satisfactory adhesion, a primer deposit layer, e.g., an Ni-Au deposit layer, having satisfactory wettability by a solder. The composition comprises a thermosetting ingredient, comprising as the main component (A) a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated bonds per molecule and having an acid value of 50 to 150 mg-KOH / g on a solid basis, (B) a photopolymerization initiator having a melting point of 100 DEG C or higher, (C) a diluent, and (D) an epoxy compound having two or more epoxy groups per molecule.

Description

technical field [0001] The present invention relates to a solder resist ink composition. More specifically, it relates to a solder resist ink composition that satisfies the original required characteristics of a solder resist film, such as solder heat resistance and adhesion to a wiring board, while maintaining good adhesion. A solder resist ink composition suitable for stably supplied printed wiring boards, which forms a conductor pad (conductor pad) having a good bottom plating layer with good solder wettability. technical background [0002] Recently, with the rapid development of semiconductor components, electronic equipment tends to be smaller and lighter, more functional, and more functional. Along with this trend, higher densification and surface mounting of components are also progressing in printed wiring boards. Photoelectric solder resists are generally used in the manufacture of high-density printed circuit boards, and dry film photoelectric solder resists and ...

Claims

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Application Information

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IPC IPC(8): C08G59/14G03F7/027G03F7/033H05K3/28
CPCG03F7/033H05K3/287G03F7/027C08G59/14
Inventor 松村正美小川勇太
Owner TAIYO INK MFG
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