Copper alloy sheet and process for producing copper alloy sheet
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A technology of copper alloy plate and manufacturing method, applied in the field of copper alloy plate, capable of solving the problems of insufficient electrical conductivity and strength characteristics of Cu-Zn-Sn alloy, etc.
Active Publication Date: 2017-02-22
MITSUBISHI SHINDOH CO LTD
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[0015] Furthermore, the Cu-Zn-Sn alloy described in Patent Document 1 is not
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[0160] The results of confirmation experiments conducted to confirm the effects of the present invention are shown below. In addition, the following examples are used to illustrate the effects of the present invention, and the structures, processes and conditions described in the examples do not limit the technical scope of the present invention.
[0161] Using the copper alloy sheets according to the first to fourth embodiments of the present invention and the copper alloy sheets of the comparative composition described above, samples were produced by changing the manufacturing process. The composition of the copper alloy is shown in Tables 1-3. In addition, Tables 1 to 3 show the values of the composition relational expressions f1, f2, f3, f4, and f5 shown in the above-mentioned embodiment.
[0162] The manufacturing steps of the samples were performed in three types, A, B, and C, and the manufacturing conditions were changed for each manufacturing step. Manufacturing pr...
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Abstract
Provided is a copper alloy sheet which is excellent in terms of resistance to stress corrosion cracking, stress relaxation property, tensile strength, proof stress, electrical conductivity, bendability, and solder wettability. The copper alloy sheet contains 4-14 mass% Zn, 0.1-1 mass% Sn, 0.005-0.08 mass% P, and 1.0-2.4 mass% Ni, with the remainder comprising Cu and unavoidable impurities, and satisfies the relational expressions 7<=[Zn]+3*[Sn]+2*[Ni]<=18, 0<=[Zn]-0.3*[Sn]-1.8*[Ni]<=11, 0.3<=(3*[Ni]+0.5*[Sn])/[Zn]<=1.6, 1.8<=[Ni]/[Sn]<=10, and 16<=[Ni]/[P]<=250. The copper alloy sheet has an average crystal grain diameter of 2-9 [mu]m and contains circular or elliptic precipitates which have an average grain diameter of 3-75 nm or in which precipitate grains each having a grain diameter of 3-75 nm account for 70% by number or more of all the circular or elliptic precipitates. The copper alloy sheet has an electrical conductivity of 24% IACS or greater and a degree of stress relaxation, measured at 150 DEG C for 1,000 hours as an index to resistance to stress relaxation, of 25% or less.
Description
technical field [0001] The present invention relates to a copper alloy plate with excellent stress corrosion cracking resistance, stress relaxation characteristics, tensile strength, yield strength, electrical conductivity, bending processability, and solder wettability, especially a copper alloy plate for terminals / connectors, Copper alloy plate for electric / electronic components and method for producing the copper alloy plate. [0002] This application claims priority based on Japanese Patent Application No. 2014-196430 for which it applied in Japan on September 26, 2014, and uses the content here. Background technique [0003] Conventionally, as constituent materials for connectors, terminals, relays, springs, switches, semiconductors, lead frames, etc. used in automotive components, electrical components, electronic components, communication devices, electronic / electrical devices, etc., highly conductive and high-strength copper alloy plate. However, along with recent ...
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