Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Copper alloy plate and manufacturing method of copper alloy plate

A technology of copper alloy plate and manufacturing method, applied in the field of copper alloy plate, capable of solving the problems of insufficient electrical conductivity and strength characteristics of Cu-Zn-Sn alloy, etc.

Active Publication Date: 2018-04-24
MITSUBISHI SHINDOH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Furthermore, the Cu-Zn-Sn alloy described in Patent Document 1 is not sufficient in many properties including electrical conductivity and strength.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper alloy plate and manufacturing method of copper alloy plate
  • Copper alloy plate and manufacturing method of copper alloy plate
  • Copper alloy plate and manufacturing method of copper alloy plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0160] The results of confirmation experiments conducted to confirm the effects of the present invention are shown below. In addition, the following examples are used to illustrate the effects of the present invention, and the structures, processes and conditions described in the examples do not limit the technical scope of the present invention.

[0161] Using the copper alloy sheets according to the first to fourth embodiments of the present invention and the copper alloy sheets of the comparative composition described above, samples were produced by changing the manufacturing process. The composition of the copper alloy is shown in Tables 1-3. In addition, Tables 1 to 3 show the values ​​of the composition relational expressions f1, f2, f3, f4, and f5 shown in the above-mentioned embodiment.

[0162] The manufacturing steps of the samples were performed in three types, A, B, and C, and the manufacturing conditions were changed for each manufacturing step. Manufacturing pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

Provided is a copper alloy sheet which is excellent in terms of resistance to stress corrosion cracking, stress relaxation property, tensile strength, proof stress, electrical conductivity, bendability, and solder wettability. The copper alloy sheet contains 4-14 mass% Zn, 0.1-1 mass% Sn, 0.005-0.08 mass% P, and 1.0-2.4 mass% Ni, with the remainder comprising Cu and unavoidable impurities, and satisfies the relational expressions 7≤[Zn]+3×[Sn]+2×[Ni]≤18, 0≤[Zn]-0.3×[Sn]-1.8×[Ni]≤11, 0.3≤(3×[Ni]+0.5×[Sn]) / [Zn]≤1.6, 1.8≤[Ni] / [Sn]≤10, and 16≤[Ni] / [P]≤250. The copper alloy sheet has an average crystal grain diameter of 2-9 μm and contains circular or elliptic precipitates which have an average grain diameter of 3-75 nm or in which precipitate grains each having a grain diameter of 3-75 nm account for 70% by number or more of all the circular or elliptic precipitates. The copper alloy sheet has an electrical conductivity of 24% IACS or greater and a degree of stress relaxation, measured at 150°C for 1,000 hours as an index to resistance to stress relaxation, of 25% or less.

Description

technical field [0001] The present invention relates to a copper alloy plate with excellent stress corrosion cracking resistance, stress relaxation characteristics, tensile strength, yield strength, electrical conductivity, bending processability, and solder wettability, especially a copper alloy plate for terminals / connectors, Copper alloy plate for electric / electronic components and method for producing the copper alloy plate. [0002] This application claims priority based on Japanese Patent Application No. 2014-196430 for which it applied in Japan on September 26, 2014, and uses the content here. Background technique [0003] Conventionally, as constituent materials for connectors, terminals, relays, springs, switches, semiconductors, lead frames, etc. used in automotive components, electrical components, electronic components, communication devices, electronic / electrical devices, etc., highly conductive and high-strength copper alloy plate. However, along with recent ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/04C22F1/08C22F1/00
CPCC22C9/04C22F1/00C22F1/08
Inventor 大石惠一郎须崎孝一高崎教男外薗孝
Owner MITSUBISHI SHINDOH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com