Tin-plated copper-alloy material for terminal having excellent insertion/extraction performance

Abstract

To provide tin-plated copper-alloy material for terminal having an excellent insertion / extraction performance by reducing dynamic friction coefficient to 0.3 or less with bringing out an excellent electrical-connection characteristic. Tin-plated copper-alloy terminal material in which an Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu-Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu-Sn alloy layer contains Cu 6 Sn 5 as a major proportion and has a compound in which a part of Cu in the Cu 6 Sn 5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an arithmetic average roughness Ra of the Cu-Sn alloy layer is 0.3 [mu]m or more in at least one direction and an arithmetic average roughness Ra in all direction is 1.0 [mu]m or less; an oil-sump depth Rvk of the Cu-Sn alloy layer is 0.5 [mu]m or more; and an average thickness of the Sn-based surface layer is 0.4 [mu]m or more and 1.0 [mu]m or less and dynamic friction coefficient is 0.3 or less.

Description

technical field [0001] The present invention relates to a tin-plated copper alloy terminal material useful as a connector terminal for connecting electric wires of automobiles or consumer equipment, especially as a multi-pin connector terminal. Background technique [0002] Tin-plated copper alloy terminal material is a terminal material in which a CuSn alloy layer is formed on the lower layer of the Sn-based surface layer as the surface layer after performing Cu plating and Sn plating on a base material made of copper alloy, and is widely used. For terminal material. [0003] In recent years, for example, as the electrification of automobiles has been rapidly promoted, the number of lines of electric equipment has increased, and thus the miniaturization and multi-pin configuration of connectors used have become remarkable. If the connector has multiple pins, although the insertion force per pin is small, a large force is required for the entire connector when inserted into...

AI Technical Summary

Problems solved by technology

However, if the CuSn alloy layer is exposed on the surface, Cu oxide will be formed on the surface, resulting in increased contact resistance and reduced solder wettability.

In addition, there is a problem that the dynamic friction coefficient cannot be reduced to 0.3 or less even if the crystal grain size and average roughness of the CuSn alloy layer are controlled.

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