111results about How to "Stable contact resistance" patented technology

There is provided a touch panel capable of obtaining a stable connection resistance without requiring fitting accuracy at the time of the connection to an external terminal, and a protective panel for a display window of an electronic device using the same. The analog type touch panel includes a touch side substrate 2 and a non-touch side substrate 3 each having resistive films 2a, 3a provided on opposed inner surfaces thereof. Through-holes 4a, 4b, 4c, 4d formed at the periphery of the non-touch side substrate 3. A connecting part 5 for electrically connecting electrodes of the resistive films 2a, 3a to an external terminal, in which a conductive paste is injected into the through-holes and a rivet 14 is inserted into each of the through-holes from the lower surface side so that a head of the rivet 14 forms flat connecting electrodes 15a, 15b for connection to the external terminal on the lower surface of the non-touch side substrate 3.

The invention relates to a graphene-PDMS flexible substrate electrocardiogram dry electrode based on a tip array structure and a preparation method thereof. a graphene-PDMS flexible substrate is designed on a top surface thereof, a paraxylene film is deposited on tip array structure, metal seed layer is sputtered on paraxylene film, a metal lalyer is sputtered on the metal seed layer. The bottom surface of the graphene-PDMS flexible conductive substrate is coated with a conductive silver paste layer. The process of the invention is simple, the cost is low, and the production of the mould is favorable for batch production. The materials such as conductive silver colloid, PDMS, graphene, paraxylene film and sputtered titanium and gold have good biological compatibility, and can effectively inhibit bacteria and reduce skin irritation. The tip array structure designed by the invention has a larger contact area, and can pass through the stratum corneum by directly contacting with the skin,so that contact impedance of the skin-electrode can be effectively reduced, thus obtaining a stable ECG signal.

The invention discloses a flexible water system zinc ion battery. The flexible water system zinc ion battery comprises a cathode layer, an anode layer, a current collection layer, a diaphragm and an aqueous electrolyte. The current collection layer comprises a breathable layer and a substrate layer, the substrate layer is provided with at least one opening holes. The perforated structure of the breathable layer and the substrate layer solves the problems of gas generation and electrolyte drying in the battery circulation process, so that the internal and external gaseous water of the battery reaches the states of circulation exchange and dynamic balance, and the circulation performance of the battery is greatly improved; and the assembled flexible water system zinc ion battery has the advantages of light weight, thin thickness, low cost, environmental friendliness, high safety, good rate capability, high power density and the like, and the excellent bending performance and flexibilityof the flexible water system zinc ion battery can meet the bending requirements of different angles, so that the flexible water system zinc ion battery is suitable for large-scale application and industrial production in the field of wearable electronic equipment.

A top-emission organic electroluminescent display is disclosed. The top-emission organic electroluminescent display includes a first electrode layer having a reflective layer, a metal-silicide layer and a transparent electrode layer on a substrate; an organic layer including at least one emission layer; and a second electrode layer. The metal-silicide layer is disposed between the reflective layer and the transparent electrode layer to suppress galvanic corrosion caused at an interface of the reflective layer and the transparent electrode layer, and to stabilize a contact resistance between the layers, thereby obtaining uniform brightness in the pixels, and realizing a high quality image.

An adhesive film composition for electric and electronic devices and an adhesive film produced using the same, the composition including a binder, the binder including an ester linkage-containing resin, a carbodiimide group-containing compound, a (meth)acrylate group-containing compound; and an organic peroxide.

A connector includes a plug including a plug body made of an insulating material and at least one plug contact supported by the plug body; a receptacle including a receptacle body made of an insulating material and at least one receptacle contact supported by the receptacle body; a contact projecting portion formed on one of the plug contact and the receptacle contact; a contacting portion formed on the other of the plug contact and the receptacle contact; and a first projecting portion and at least one second projecting portion which is formed on the contacting portion, the second projecting portion being formed integral with the first projecting portion to be elongated in an insertion/extraction direction of the plug. A portion of the contact projecting portion is formed as a flat surface having a width greater than a width of the second projecting portion.

Provided is a substrate inspecting jig, which can reduce a contact resistance between a contact maker and a connecting electrode unit and which has a stable contact resistance without regard to the number of uses. In order to inspect the electric characteristics of an object substrate, the substrate inspecting jig acquires the electric conductions between a substrate inspecting device body and a plurality of substrate inspection points formed at the wiring pattern of the object substrate. The substrate inspecting jig comprises a group of electrically conductive contacts having two end portions for electric conductions, one of which is forced to contact with one of the substrate inspection points, a contact holder for holding the contact group, and a connecting electrode member including the connecting electrode unit arranged to confront the other end portions of the individual contacts of the contact group and adapted to be connected with the substrate inspecting device body. At least a portion of the side circumference near each of the other end portions is brought, when the other end portions of the contact group and the connecting electrode member are to be connected, into contact with a portion of the confronting connecting electrode unit thereby to establish the electrically conductive state.

The present invention discloses an ultrathin palladium plating and gold plating process for a lead wire frame. The process comprises the following steps: carrying out electrolysis degreasing, carrying out an activation treatment on a lead wire frame substrate, carrying out electrodeposition of a nickel plating layer, carrying out an activation treatment on the nickel layer, carrying out electrodeposition of a palladium plating thin layer, and carrying out high-frequency pulse electrodeposition of a gold plating thin layer, wherein a palladium-plated lead wire frame substrate is placed into a gold plating liquid to carry out electrodeposition for 10-20 s, cleaned with gold recovery water, dried and is subjected to gold protection to obtain the finished product. According to the present invention, under the premise of ensurence of passing of the test trial, the ultrathin gold-palladium plating layer is formed, wherein a thickness of the electroplated palladium layer is 0.02-0.1 mum, and is far lower than a thickness of 2-5 mum of the electroplated palladium layer in the existing process, and the electroplated gold layer is 0.003-0.01 mum, and is far lower than a thickness of 0.3-1.2 mum of the electroplated gold layer in the existing process, such that excellent performances of the original palladium plating layer and the original gold plating layer are ensured, gold consumption and palladium consumption are reduced, use of noble metals is substantially reduced, metal utilization rate is effectively improved, and cost is saved.

The invention relates to a flexible printed circuit board element and grounding steel sheet connecting device and method and belongs to the field of electrified connectors. The method comprises the steps that a flexible printed circuit board layer and thermal-cured conducting resin are temporarily fixed with a rapid compressing machine at the temperature of 80-100 DEG C and the pressure of 4.5-5 MPa, wherein the laminating time is 5-10 S; the flexible printed circuit board layer and the thermal-cured conducting resin are punched at the same time; the flexible printed circuit board layer and the grounding steel sheet are attached together with a heating table at the temperature of 80-100 DEG C; the flexible printed circuit board layer and the grounding steel sheet are laminated and cured with the rapid compressing machine and an oven, wherein the temperature of the rapid compressing machine is 160-180 DEG C, the pressure of the rapid compressing machine is 8-10 MPa, the time of the rapid compressing machine is 60-120 S, the temperature of the oven is 160-180 DEG C, and the time of the oven is 40-60 min; soldering paste is put into holes; FPC electronic elements are attached to the flexible printed circuit board layer and make contact with the soldering paste. The flexible printed circuit board element and grounding steel sheet connecting device and method have the advantages that the contact resistance is effectively reduced and stabilized, the efficiency is improved, and the production cost is reduced.

A switch device includes: a movable spring that has one end as a fixed end, and the other end as a free end; a substrate that is disposed below the movable spring; a first contact point that is disposed at a predetermined location between the fixed end and the free end of the movable spring; a protrusion that is formed on the substrate and is located to face the free end of the movable spring; and a second contact point that is provided on the substrate and is located to face the first contact point. This switch device is put into an ON state when the free end of the movable spring is brought into contact with the protrusion and the first contact point is brought into contact with the second contact point.

Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 μm and not more than 0.6 μm, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.