Substrate inspecting jig, and electrode structure of connecting electrode unit in the jig

Abstract

Provided is a substrate inspecting jig, which can reduce a contact resistance between a contact maker and a connecting electrode unit and which has a stable contact resistance without regard to the number of uses. In order to inspect the electric characteristics of an object substrate, the substrate inspecting jig acquires the electric conductions between a substrate inspecting device body and a plurality of substrate inspection points formed at the wiring pattern of the object substrate. The substrate inspecting jig comprises a group of electrically conductive contacts having two end portions for electric conductions, one of which is forced to contact with one of the substrate inspection points, a contact holder for holding the contact group, and a connecting electrode member including the connecting electrode unit arranged to confront the other end portions of the individual contacts of the contact group and adapted to be connected with the substrate inspecting device body. At least a portion of the side circumference near each of the other end portions is brought, when the other end portions of the contact group and the connecting electrode member are to be connected, into contact with a portion of the confronting connecting electrode unit thereby to establish the electrically conductive state.

Description

technical field [0001] The present invention relates to a jig for substrate inspection used when inspecting a substrate to be inspected and an electrode structure for connecting electrode parts in the jig for inspection of the substrate, and particularly relates to an electrode structure capable of reducing the contact between the probe rod of the jig for substrate inspection and the electrode part of the jig for substrate inspection An electrode structure of a jig for inspecting a substrate of a resistor, and an inspection jig having the electrode structure. [0002] The present invention is not limited to printed wiring boards, but can be applied to various substrates such as flexible cable substrates, multilayer wiring substrates, electrode plates for liquid crystal displays or plasma displays, and interposer substrates for semiconductor components, film carriers, or semiconductor wafers. Inspection of the electrical wiring on the board, in this specification, this kind of ...

AI Technical Summary

Problems solved by technology

[0008] However, even if such a stylus is used, it is only possible to make it contact the electrode part vertically, and it cannot be said that there is any possibility of contact stability from the viewpoint of so-called contact stability. Sufficient contact stability and connection with low contact resistance values

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