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Electroconductive adhesive and semiconductor device

A conductive and adhesive technology, applied in the direction of conductive adhesives, conductors, adhesives, etc., can solve the problems of rising contact resistance value, inability to contact resistance value, etc., and achieve the effect of small contact resistance value

Active Publication Date: 2016-08-24
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the base of the conductive part of the substrate is a metal (nickel, copper, aluminum, etc.) that is likely to form an oxide film on the outermost surface, if it is bonded with a conductive adhesive, the contact resistance value will increase due to corrosion of the metal. , it is impossible to prevent the increase of contact resistance value by high filling of conductive filler in conductive adhesive

Method used

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  • Electroconductive adhesive and semiconductor device
  • Electroconductive adhesive and semiconductor device
  • Electroconductive adhesive and semiconductor device

Examples

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Embodiment

[0080] The present invention is described based on examples, but the present invention is not limited thereto. In addition, in the following examples, unless otherwise specified, parts and % represent parts by mass and % by mass.

[0081] 〔Preparation of samples for evaluation〕

[0082] Measure the liquid epoxy resin (trade name: EXA835LV) manufactured by DIC Corporation as (A) component, the silane coupling agent (trade name: S510) manufactured by Nippon-Mei Corporation (trade name: S510) as (E) component, and (D) Silver powder of the component, 3.00 parts by mass of Maruzen Petrochemical Industry's solvent naphtha (solventnaphtha) (SW1800) (SW1800) as a solvent, a boric acid compound for improving pot life (manufactured by Wako Pure Chemical Industries, Ltd., Trade name: HBO) 0.04 parts by mass (not described in Table 1), was put into a container, and dispersed with a three-roll mill.

[0083] Next, (C) a morpholine-based reducing agent was added to the obtained dispersion...

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Abstract

The purpose of the present invention is to provide an electroconductive adhesive in which a low contact resistance value is obtained by adding a morpholine as a corrosion inhibitor, and in which long pot life is obtained by suppressing thickening during storage. An electroconductive adhesive characterized by containing (A) an epoxy resin, (B) an amine-based curing agent and / or a phenol-based curing agent, (C) a morpholine reducing agent, (D) an electroconductive filler, and (E) a silane coupling agent. Preferably, the (C) component is at least one species selected from the group consisting of morpholine, 2,6-dimethylmorpholine, 4-(3-hydroxypropyl)morpholine, 4-methylmorpholine, 4-(4-aminophenyl)morpholine, thiomorpholine, and 1,1-dioxothiomorpholine.

Description

technical field [0001] The present invention relates to a conductive adhesive, and more particularly to a conductive adhesive capable of connecting metals that easily form an oxide film with low resistance. Background technique [0002] Semiconductor devices in which the electrode portion of the semiconductor device and the conductive portion of the substrate are bonded are widely used, and the electrode portion of the semiconductor device and the conductive portion of the substrate are bonded using a conductive adhesive or soldering. Conductive adhesives have the advantage of being able to bond at a lower temperature than soldering, but their bulk resistance is larger than that of solder, so studies are being made to lower the resistance of conductive adhesives. [0003] As a means of reducing the volume resistance of conductive adhesives, high filling of conductive fillers in conductive adhesives is known. However, when the base of the conductive part of the substrate is ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02C09J11/04C09J11/06H01B1/00H01B1/22H05K3/32
CPCC08K3/08C08K5/357C08K5/54C08K9/02C08K2003/0806C08K2003/0812C08K2003/0831C08K2003/085C08K2003/0862C08K2201/001C09J9/02C09J11/04C09J11/06H01B1/22H05K3/321C08G59/50C08G59/621C09J163/00
Inventor 水村宜司斋藤聪神田大树
Owner NAMICS CORPORATION
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