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58results about How to "Reduce contact resistance value" patented technology

Condenser microphone

There is provided a condenser microphone in which electromagnetic shielding in the connecting part of a microphone capsule and a microphone main body is made more reliable. In the condenser microphone including a microphone capsule 10 and a microphone main body 20, the microphone capsule 10 being configured so that an electrostatic acoustic-electric converter is accommodated in a metallic capsule housing 11, and an extraction electrode 15 of a backplate 142 is disposed in substantially the central portion of a connection-side opening part 120, and the microphone main body 20 being configured so that a circuit board 22 is disposed at a predetermined depth position in a connection-side opening part 210 of a metallic microphone housing 21 to which the capsule housing 11 is detachably connected, and a field effect transistor 23 and a conductive contacting means for connecting the gate of the field effect transistor 23 to the extraction electrode 15 are disposed; and configured so that the extraction electrode 15 is connected to the gate of the field effect transistor 23 via the conductive contacting means with the connection of the capsule housing 11 to the microphone housing 21, as the conductive contacting means, a conductive elastic material 31 such as a conductive resin foam or a conductive cloth is used, and a ferrite material 32 is disposed on the circuit board 22 so as to surround the conductive elastic material 31.
Owner:AUDIO-TECHNICA

Substrate inspecting jig, and electrode structure of connecting electrode unit in the jig

Provided is a substrate inspecting jig, which can reduce a contact resistance between a contact maker and a connecting electrode unit and which has a stable contact resistance without regard to the number of uses. In order to inspect the electric characteristics of an object substrate, the substrate inspecting jig acquires the electric conductions between a substrate inspecting device body and a plurality of substrate inspection points formed at the wiring pattern of the object substrate. The substrate inspecting jig comprises a group of electrically conductive contacts having two end portions for electric conductions, one of which is forced to contact with one of the substrate inspection points, a contact holder for holding the contact group, and a connecting electrode member including the connecting electrode unit arranged to confront the other end portions of the individual contacts of the contact group and adapted to be connected with the substrate inspecting device body. At least a portion of the side circumference near each of the other end portions is brought, when the other end portions of the contact group and the connecting electrode member are to be connected, into contact with a portion of the confronting connecting electrode unit thereby to establish the electrically conductive state.
Owner:NIDEC-READ CORPORATION

Stack-based copper zinc tin sulfur selenide (CZTSSe) thin film solar cell and manufacturing method thereof

The invention provides a stack-based copper zinc tin sulfur selenide (CZTSSe) thin film solar cell and a manufacturing method of the stack-based CZTSSe thin film solar cell. The manufacturing method of the stack-based CZTSSe thin film solar cell sequentially includes: sequentially forming a sulfide layer, a cuprous selenide layer and a zinc stannide layer on a back electron layer, manufacturing a selenide layer containing sulfur compounds and a selenium sulfide solar energy absorbing layer after selenylation and sulfuration, and depositing an n-type buffering layer and a top electron layer to manufacture the stack-based CZTSSe thin film solar cell, wherein the selenium sulfide solar energy absorbing layer comprises a low-energy-gap copper zinc tin selenide (CZTSe) layer arranged between two high-energy-gap CZTSSe layers in a clamping mode to form a stack-based solar energy absorbing layer. Besides, the invention further provides the stack-based CZTSSe thin film solar cell. Due to the fact that the stack-based solar energy absorbing layer improves the light absorbing rate and reduces the recombination rate of electrons/holes, the photoelectric property of the stack-based CZTSSe thin film solar cell is improved.
Owner:SOLAR APPLIED MATERIALS TECHNOLOGY CORPORATION

Seesaw switch

The invention discloses a seesaw switch which comprises a switch outer shell body, wherein a static terminal, a dynamic terminal and a lamp base are arranged inside the switch outer shell body, a silver contact is arranged above the static terminal, a seesaw is arranged above the dynamic terminal, a spring and a sliding column are arranged under the lamp base through hole sleeves, the sliding column is pressed on the seesaw by the elasticity of the spring, a button and an indicating lamp which is connected with the spring are arranged above the lamp base, a seesaw support is arranged above the dynamic terminal, a protrusion is arranged at the top part of the seesaw support, a groove matched with the protrusion on the seesaw support is formed under the seesaw, and the protrusion is pressed against the inside of the groove. The seesaw switch has the beneficial effects that the seesaw switch is practical, low in production cost and convenient to use, the friction between the seesaw and the dynamic terminal is lowered, the contact resistance value of a product is effectively controlled, the resistance value is greatly reduced, the temperature rise is reduced, the positioning deviation of the seesaw cannot occur when being repeatedly opened and closed, the using performance of the switch is improved, a layer of arc extinction fireproof grease is coated inside the groove, the flashover phenomenon is eliminated, and the service life of the product is long.
Owner:CIXI MINGHEXINGHUA APPLIANCE PARTS FACTORY

Condenser microphone

There is provided a condenser microphone in which electromagnetic shielding in the connecting part of a microphone capsule and a microphone main body is made more reliable. In the condenser microphone including a microphone capsule 10 and a microphone main body 20, the microphone capsule 10 being configured so that an electrostatic acoustic-electric converter is accommodated in a metallic capsule housing 11, and an extraction electrode 15 of a backplate 142 is disposed in substantially the central portion of a connection-side opening part 120, and the microphone main body 20 being configured so that a circuit board 22 is disposed at a predetermined depth position in a connection-side opening part 210 of a metallic microphone housing 21 to which the capsule housing 11 is detachably connected, and a field effect transistor 23 and a conductive contacting means for connecting the gate of the field effect transistor 23 to the extraction electrode 15 are disposed; and configured so that the extraction electrode 15 is connected to the gate of the field effect transistor 23 via the conductive contacting means with the connection of the capsule housing 11 to the microphone housing 21, as the conductive contacting means, a conductive elastic material 31 such as a conductive resin foam or a conductive cloth is used, and a ferrite material 32 is disposed on the circuit board 22 so as to surround the conductive elastic material 31.
Owner:AUDIO-TECHNICA

High heat-dissipation electrical cabinet

The invention discloses a high heat-dissipation electrical cabinet comprising an electrical cabinet body. The electrical cabinet body is provided with a bottom plate, a left side plate, a right side plate, a back plate, a top plate and a front door, wherein the bottom plate and the top plate are double-layer hollow structure, while the back plate, the left side plate and the right side plate are double-layer hollow structure as well, and are communicated with each other. A first air inlet communicated with the interior is formed on one side face of the bottom plate. Meanwhile, the upper surface of the bottom plate is provided with an air outlet which is communicated with the air pipe and extends to the position of the inner female terminal of the cabinet body. Second air inlets are formedon the upper end surface of the left side plate and the right side plate, and a plurality of air outlet groups which are parallel to each other are provided on the inner wall of the back plate, the left side plate and the right side plate. Each air outlet group comprises a plurality of air outlets provided at intervals. The air outlets in the left side plate, the back plate and the right side plate are provided in a spiral manner. An exhaust port is formed on the top plate, wherein the upper surface of the exhaust port is communicated with the exhaust pipe, and the end of the exhaust pipe is provided with an air evacuating device. According to the high heat-dissipation electrical cabinet, a draught fan is utilized to fit a cabinet body of double-layer hollow structure.so that vortex airflow is formed in the electrical cabinet to dissipate heat in the interior, and the heat dissipation effect is improved.
Owner:义乌市谊诚信息科技有限公司

High-temperature fuel cell bipolar plate anti-oxidation plating layer

The invention provides a high-temperature fuel cell bipolar plate anti-oxidation plating layer, and relates to the technical field of fuel cells. The high-temperature fuel cell bipolar plate anti-oxidation plating layer comprises a composite plating layer, wherein the composite plating layer is composed of a CrN film layer, a silver plating layer and a gold plating layer. The preparation method ofthe anti-oxidation plating layer comprises the steps of 1) selecting a stainless steel plate as a bipolar plate material, and pretreating the stainless steel plate; 2) generating a film and depositing the film on the surface of the stainless steel plate to obtain a CrN film layer; 3) plating a silver plating layer on the CrN film layer; and 4) plating a gold plating layer on the silver plating layer. According to the invention, the contact resistance of the bipolar plate can be reduced, the contact resistance value of the stainless steel plate can be further reduced after silver plating due to good conductivity of silver, and meanwhile, the binding force of the plating layer is very good; and a small amount of thin gold is electroplated or sputtered on the silver layer, so that the problem of infirm combination of a gold-plated plating layer can be well solved, and good conductivity and relatively small contact resistance are obtained.
Owner:苏州敦胜新能源科技有限公司

Method for reducing ohmic contact resistance of HEMT device

The invention discloses a method for reducing the ohmic contact resistance of an HEMT device, and relates to the technical field of nitride preparation methods. The method comprises the following steps that (1) epitaxial structure growth is carried out, and a GaN layer and a barrier layer are formed on a substrate in sequence; (2) a SiO2 layer is grown on the upper surface of the barrier layer; (3) the SiO2 layer is etched in a drain and source ohmic area to the upper surface of the barrier layer; (4) etching is carried out on a GaN material in the drain and source ohmic area to the position below a heterojunction interface between the GaN layer and the barrier layer, and then a high-temperature annealing furnace is used for carrying out annealing treatment in a pure nitrogen atmosphere or a vacuum atmosphere; (5) secondary epitaxy of an n-type heavy doping GaN material is carried out in the drain and source ohmic area; (6) residual SiO2 on the upper surface of the barrier layer is removed through corrosion. According to the method for reducing the ohmic contact resistance of the HEMT device, ohmic contact between n-type heavy doping GaN and the side wall of a GaN heterojunction is improved, and the contact resistance between the n-type heavy doping GaN and the side wall of the GaN heterojunction is reduced.
Owner:THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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