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Method for correcting size and shape of plug open

A plug-and-size technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to solve problems such as reducing the operating speed of components and reducing the speed of current transmission

Inactive Publication Date: 2007-12-12
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, the speed of current transmission will be reduced, which will reduce the operating speed of components

Method used

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  • Method for correcting size and shape of plug open
  • Method for correcting size and shape of plug open

Examples

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Embodiment Construction

[0037] FIG. 1 is a flowchart illustrating the steps of a method for modifying the size and shape of a plug opening according to an embodiment of the present invention. FIG. 2A is a top view illustrating the size and shape of a plug opening before modification according to an embodiment of the present invention. FIG. 2B is a top view illustrating an embodiment of the present invention after performing the method of modifying the size and shape of the plug opening.

[0038] Please refer to FIG. 1 and FIG. 2A , the method, for example, first classifies a plurality of plug openings (step 110 ). These plug openings can be divided into at least two types including: plug openings that at least partially overlap with the adjacent two grooves 210a, 210b and the minimum distance between the edges of the two openings is less than or equal to a certain distance, such as border plug openings 215a, 215b, and a central plug opening 225 located between two adjacent trenches, such as trenches...

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Abstract

The invention discloses a method of repairing inserting opening size and structure. The method is correcting the bound inserting opening, the two bound inserting openings which the adjacent two grooves are overlapped with each other, interval is smaller than definite distance are separated, so the two bound inserting openings are separately in the two grooves, distant from the two side walls of the grooves. At the same time, size of the bound inserting opening is amplified within range of grooves.

Description

technical field [0001] The present invention relates to a semiconductor process, and more particularly to a method of modifying the size and shape of plug openings. Background technique [0002] With the strengthening of the functions of computers and electronic products, the application circuits are becoming more and more complex. Based on the consideration of cost and stability, the integration of components required in the integrated circuit is also greatly increased. In this way, the surface of the chip will not be able to provide enough area to make the required interconnects. In order to meet the increased demand for interconnects after the shrinkage of the components, it is often necessary to use multiple layers of individual interconnects. layer, these transistors can be connected smoothly to form a complete electronic device. [0003] In order to prevent short circuits, these interconnection layers must be separated by dielectric materials with good insulation capa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768
Inventor 林金隆陈明瑞敖振宇庄宏亲蔡仁祥刘建新
Owner UNITED MICROELECTRONICS CORP
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