Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Anisotropic conductive adhesive film and preparation and application method thereof

An anisotropic, conductive adhesive film technology, used in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of uneven conductive particles, open circuits, short circuits, etc., and achieve a simple and controllable preparation method and contact resistance. The effect of value reduction

Active Publication Date: 2017-09-08
昆山市工业技术研究院有限责任公司
View PDF2 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conductive particles in the existing anisotropic conductive adhesive film are evenly distributed in the resin, and they must be hot-pressed during use. At this time, the conductive particles will move with the flow of the resin matrix, so they will be in a certain In a local area (comparable range of spacing and line width), uneven conductive particles appear, resulting in the possibility of open circuit or short circuit

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anisotropic conductive adhesive film and preparation and application method thereof
  • Anisotropic conductive adhesive film and preparation and application method thereof
  • Anisotropic conductive adhesive film and preparation and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] An anisotropic conductive adhesive film, consisting of an epoxy adhesive film and conductive particles with a median particle size of 3 μm, wherein the volume percentage of the conductive particles is 5%, the conductive particles have a core-shell structure, and the conductive particles are made of cross-linked polystyrene The core is plated with nickel and gold.

[0061] Its preparation method is as follows:

[0062] Soak 1g of polymer-nickel-gold core-shell conductive particles in 25mL tetrahydrofuran solvent dissolved with 1g of tetrakis(3-mercaptopropionate)pentaerythritol ester monomer. Wash clean and set aside. Similar to the modification of conductive particles, soak the PCB board with metal wires in the same composition of tetrahydrofuran solvent for 24 hours. Then, after washing with tetrahydrofuran and absolute ethanol in sequence, add 50 mL of absolute ethanol, and add the above-mentioned modified conductive particles, and shake the solvent every 10 minutes...

Embodiment 2

[0064] An anisotropic conductive adhesive film, consisting of an epoxy adhesive film and conductive particles with a median particle size of 10 μm, wherein the volume percentage of the conductive particles is 15%, the conductive particles have a core-shell structure, and are cross-linked with polymethacrylic acid Methyl ester is the core, and the surface of the core is plated with nickel and gold.

[0065] Its preparation method is as follows:

[0066] Soak 1g of polymer-nickel-gold core-shell conductive particles in 25mL of anhydrous alcohol solvent dissolved with thioglycolic acid, soak for 12 hours at room temperature, settle and separate, wash with absolute ethanol in turn, and set aside. Similar to the conductive particle modification, soak the PCB board with metal wires in 10% L-cysteine ​​absolute ethanol solvent for 24 hours. Then, after washing with absolute ethanol in sequence, pour into 50 mL of absolute ethanol, and add the above-mentioned modified conductive part...

Embodiment 3

[0068] An anisotropic conductive adhesive film, consisting of an epoxy adhesive film and conductive particles with a median particle size of 50 μm, wherein the volume percentage of the conductive particles is 2%, the conductive particles have a core-shell structure, and are cross-linked with polymethacrylic acid Methyl ester is the nucleus, and the surface of the nucleus is plated with silver.

[0069] Its preparation method is as follows:

[0070] Soak 0.003g of polymer-silver core-shell conductive particles in 25mL of anhydrous alcohol solvent dissolved with 30wt% thioglycolic acid, soak for 2 hours at room temperature, settle and separate, wash with absolute ethanol in turn, and set aside. Similar to the conductive particle modification, the PCB board with the metal wire is soaked in 0.5wt% L-cysteine ​​absolute ethanol solvent for 48 hours. Then, after successively washing with absolute ethanol, add 50 mL of absolute ethanol, and add the above-mentioned modified conductiv...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to an anisotropic conductive adhesive film and a preparation and application method thereof. The anisotropic conductive adhesive film is composed of conductive particles and non-conductive adhesives, wherein the conductive particles are directionally dispersed inside the non-conductive adhesives; the surface of the conductive particles and the surface of the non-conductive adhesives are grafted with any or at least two of the groups of sulfydryl, carboxyl and amino. Under the premise of anisotropic stability, the anisotropic conductive adhesive film can reduce the line width to 15 mu m and the interval to 15 mu m to meet the requirements on micro packing interval and further to avoid open circuit or short circuit during a hot pressing process. The preparation method of the anisotropic conductive adhesive film is simple and controllable and can flexibly design and adjust the arrangement modes of the conductive particles according to packing interval and line width requirements.

Description

technical field [0001] The invention relates to the technical field of polymer composite materials, in particular to an anisotropic conductive adhesive film and its preparation method and application. Background technique [0002] Composite conductive film is a polymer film with conductive function prepared by adding conductive fillers to single or multi-phase polymers. Composite conductive thin films have been widely studied and applied because they have both the conductivity of metals and a series of advantages of polymer materials. In the existing conductive films, fillers with conductive functions are usually added to the resin matrix, and the conductive films are obtained by tape casting and blow molding. [0003] Anisotropic conductive adhesive film is a polymer-based microelectronic interconnection material that only conducts electricity in the vertical direction and does not conduct electricity in the horizontal direction. Conductive particles such as metal particl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J9/02C09J163/00
CPCC08K9/04C09J7/00C09J9/02C09J163/00C09J2301/408
Inventor 蔡雄辉
Owner 昆山市工业技术研究院有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com