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Flexible printed circuit board element and grounding steel sheet connecting device and method

A technology of flexible circuit boards and connecting devices, which is applied in the direction of printed circuit grounding devices, circuit devices, electrical components, etc., can solve problems such as instability, large contact resistance, and high production costs, and achieve improved efficiency, stable contact resistance, and reduced production. cost effect

Active Publication Date: 2016-12-07
DALIAN JIXING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of large and unstable contact resistance and high production cost between the existing flexible circuit board components and the grounding steel sheet, the present invention provides a connection device between the flexible circuit board component and the grounding steel sheet, which effectively reduces and Stabilized contact resistance, improved efficiency, and reduced production costs

Method used

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  • Flexible printed circuit board element and grounding steel sheet connecting device and method
  • Flexible printed circuit board element and grounding steel sheet connecting device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A device for connecting flexible circuit board components and grounding steel sheets, including: FPC electronic components 1, flexible circuit board layers 2, thermosetting conductive adhesive 3, grounding steel sheets 4 and solder paste 5, such as figure 2 As shown, the thermosetting conductive adhesive 3 is bonded to the flexible circuit board layer 2, and a square connecting the upper and lower layers is punched out, and solder paste 5 is placed in the square, and the grounding steel sheet 4 is connected to the thermosetting conductive layer 2. The remaining part of the glue 2 is attached, and the FPC electronic component 1 is attached to the flexible circuit board layer 2 and is in contact with the solder paste 5 .

[0024] Firstly, the heat-curing conductive adhesive 3 and the flexible circuit board layer 2 are pasted together, and temporarily fixed by false pressure, and then the flexible circuit board layer 2 where the components on the flexible circuit board lay...

Embodiment 2

[0026] A device for connecting a flexible circuit board element to a grounding steel sheet, comprising: a motor, a flexible circuit board layer, a thermosetting conductive adhesive, a grounding steel sheet and solder paste, the thickness of the thermosetting conductive adhesive is 30 μm, and the thermosetting conductive adhesive Glue and the flexible circuit board layer are bonded together, and a circle connecting the upper and lower layers is punched in it, and solder paste is placed in the circle. Attached to the flex circuit layer and in contact with the solder paste.

[0027] Firstly, the heat-curing conductive adhesive and the flexible circuit board layer are bonded together, temporarily fixed by false pressure, and then the flexible circuit board layer where the components on the flexible circuit board layer need to be grounded is punched out together with the heat-curing conductive adhesive with a punching die , forming a circle with the upper and lower layers connected...

Embodiment 3

[0029] A connection device of a flexible circuit board element and a grounding steel sheet, comprising: a chip, a flexible circuit board layer, thermosetting conductive glue, a grounding steel sheet and solder paste.

[0030] Use a fast press to temporarily fix the flexible circuit board layer and heat-curing conductive adhesive at a temperature of 80-100°C and a pressure of 4.5-5MPa, and the pressing time is 5-10S; then the flexible circuit board layer and heat-curing conductive adhesive Punch holes at the same time; then use a heating table to attach the flexible circuit board layer and the grounding steel sheet together at a temperature of 80-100°C; then use a fast press and an oven to press and cure the flexible circuit board layer and the grounding steel sheet , the temperature of the fast press is 160-180°C, the pressure is 8-10MPa, and the time is 60-120S; the temperature of the oven is 160-180°C, and the time is 40-60min; the solder paste is printed on the top layer of ...

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Abstract

The invention relates to a flexible printed circuit board element and grounding steel sheet connecting device and method and belongs to the field of electrified connectors. The method comprises the steps that a flexible printed circuit board layer and thermal-cured conducting resin are temporarily fixed with a rapid compressing machine at the temperature of 80-100 DEG C and the pressure of 4.5-5 MPa, wherein the laminating time is 5-10 S; the flexible printed circuit board layer and the thermal-cured conducting resin are punched at the same time; the flexible printed circuit board layer and the grounding steel sheet are attached together with a heating table at the temperature of 80-100 DEG C; the flexible printed circuit board layer and the grounding steel sheet are laminated and cured with the rapid compressing machine and an oven, wherein the temperature of the rapid compressing machine is 160-180 DEG C, the pressure of the rapid compressing machine is 8-10 MPa, the time of the rapid compressing machine is 60-120 S, the temperature of the oven is 160-180 DEG C, and the time of the oven is 40-60 min; soldering paste is put into holes; FPC electronic elements are attached to the flexible printed circuit board layer and make contact with the soldering paste. The flexible printed circuit board element and grounding steel sheet connecting device and method have the advantages that the contact resistance is effectively reduced and stabilized, the efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to a connection device and a manufacturing method thereof, in particular to a connection device and method of a flexible circuit board element and a grounding steel sheet. Background technique [0002] In recent years, electronic products have generally appeared in various fields, and are updated at the rate of several generations per year. As an important part of electronic products, printed circuit boards are also constantly being improved and updated. As an integral part of various electronic products, FPC’s grounding combination method is to attach the bottom layer of FPC and the grounding steel sheet with hot-pressed or cold-pressed conductive adhesive to achieve its conduction, and the FPC itself realizes the up and down through the conduction hole. Layer conduction, the FPC component conducts with the top layer of the FPC through the solder paste, and then realizes the conduction between the FPC component and the grounding...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/18H05K3/34
CPCH05K1/0215H05K1/189H05K3/3431H05K2201/1009
Inventor 孙士卫黄庆林吕文涛张卫
Owner DALIAN JIXING ELECTRONICS
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