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Electric contact material for connector, and method for producing same

A manufacturing method and technology of electrical contacts, applied in conductive materials, conductive materials, circuits, etc., to achieve the effects of stabilizing contact resistance, maintaining contact resistance for a long time, and improving durability

Active Publication Date: 2016-05-18
AUTONETWORKS TECH LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned prior art, it cannot be said that the above-mentioned problems can be sufficiently solved.

Method used

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  • Electric contact material for connector, and method for producing same
  • Electric contact material for connector, and method for producing same
  • Electric contact material for connector, and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] The electrical contact material for connectors mentioned above and its manufacturing method are demonstrated using drawings.

[0058] Such as figure 2 As shown, the electrical contact material 1 of this example has: a base material 10 made of a metal material, a ternary alloy layer 2 containing Sn and Cu and also containing Ni formed on the base material 10, and a ternary alloy layer 2 formed on the surface of the alloy layer 2 The formed conductive coating layer 3 . Alloy layer 2 contains Cu 6 sn 5 (Cu,Ni) obtained by substituting a part of Cu in Ni 6 sn 5 intermetallic compound. Hereinafter, the manufacturing method and more detailed structure of the electrical contact material 1 are demonstrated.

[0059]

[0060] First, a plate-shaped material made of brass was prepared as the base material 10 . In addition, the material and form of the base material 10 can be changed variously according to a use. In addition, in this example, a diffusion barrier layer wa...

Embodiment 2

[0095] In the electrical contact material for connectors of this example, the alloy layer 2 in Example 1 is changed to a ternary alloy layer containing Sn and Cu and Zn, and accordingly, the composition of the conductive coating layer 3 is also changed. example of .

[0096]

[0097] It manufactured similarly to Example 1 except having performed formation of a Zn layer instead of forming a Ni layer in Example 1.

[0098] (Formation of Zn layer)

[0099] · Liquid composition of the plating bath

[0100] · Zinc chloride [ZnCl 2 ]: 60g / L

[0101] Sodium chloride [NaCl]: 35g / L

[0102] Sodium hydroxide [NaOH]: 80g / L

[0103] Liquid temperature: 25°C

[0104] ·Current density: 1A / dm 2

[0105]

[0106] The composition of the alloy layer obtained in this example was analyzed by EDX. As a result, it was found that (Cu, Zn) 6 sn 5 metal compounds. In addition, the composition analysis of the obtained conductive coating layer of this example was carried out by XPS. As a ...

Embodiment 3

[0111] In the electrical contact material for connectors of this example, the alloy layer 2 in Example 1 is changed to a ternary alloy layer containing Sn and Cu and Co, and accordingly, the composition of the conductive coating layer 3 is also changed. example of .

[0112]

[0113] It manufactured in the same manner as in Example 1 except having performed formation of a Co layer instead of forming a Ni layer in Example 1.

[0114] (Formation of Co layer)

[0115] · Liquid composition of the plating bath

[0116] Cobalt chloride [CoCl 2 ]: 250g / L

[0117] Hydrochloric acid [HCl]: 50g / L

[0118] Liquid temperature: 40°C

[0119] ·Current density: 2A / dm 2

[0120]

[0121] The composition of the alloy layer obtained in this example was analyzed by EDX. As a result, it was found that (Cu, Co) 6 sn 5 metal compounds. In addition, composition analysis of the obtained conductive coating layer of this example by XPS revealed that a mixed oxide of Sn oxide, Cu oxide, an...

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Abstract

An electric contact material for a connector comprises: a base material (10) made from a metallic material; an alloy layer (2) of a ternary or higher system, which is formed on the base material (10), contains Sn and Cu, and additionally contains at least one metal selected from Zn, Co, Ni and Pd; and an electrically conductive coating film layer (3) which is formed on the surface of the alloy layer (2). The alloy layer (2) contains an intermetallic compound which is produced by substituting a part of Cu in Cu6Sn5 by at least one kind of metal selected from Zn, Co, Ni and Pd. It is preferred that the content of the at least one kind of metal selected from Zn, Co, Ni and Pd in the alloy layer (2) falls within the range from 1 to 50 at.% wherein the total content of the at least one kind of metal and Cu is 100 at.%.

Description

technical field [0001] The invention relates to an electrical contact material for a connector and a manufacturing method thereof. Background technique [0002] Copper alloys are mainly used as electrical contact materials for connectors. Copper alloy forms a non-conductive or high-resistivity oxide film on its surface, which may cause an increase in contact resistance and reduce its function as an electrical contact material. [0003] Therefore, when a copper alloy is used as an electrical contact material, a layer of a noble metal such as Au or Ag that is hardly oxidized may be formed on the surface of the copper alloy by plating treatment or the like. However, since the cost of forming a noble metal layer is high, generally an inexpensive and relatively high corrosion-resistant Sn plating is often used. [0004] On the other hand, since the Sn plating film is relatively soft, if it is provided on the surface of an electrical contact material, it may wear early and cause...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D5/10H01R13/03
CPCC25D5/12C25D7/00H01R13/03C25D5/34C25D5/50Y10T428/1291Y10T428/1259Y10T428/12722Y10T428/12903Y10T428/12882Y10T428/12667Y10T428/12917Y10T428/12611Y10T428/12618Y10T428/12708C22C9/02C25D3/12C25D3/22C25D3/30C25D3/38C25D5/10C25D5/505H01B1/026C25D5/627
Inventor 泽田滋
Owner AUTONETWORKS TECH LTD
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