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30results about How to "High positional" patented technology

Method for bonding substrates together, and substrate bonding device

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.
Owner:BONDTECH

Single cell operation supporting robot

A single-cell operation supporting robot for supporting a single-cell operation work with multi-purposes by carrying out a work which an operator himself/herself carries out difficultly, according to the indication of the operator. The robot is equipped with a microscope 1, multi-micro well 4 for storing cells and a single-cell stimulating device 5 which are respectively provided on the stage 1a of the microscope 1, a sample injection transportation means 7 which transports a glass capillary 6 for injecting a sample into the single-cell relatively to and from the multi-microwell 4 and an automatic stage 2, a cell transportation device 9 which transports a glass capillary 8 for holding the single-cell relatively to and from each well of the multi-microwell 4, the single-cell stimulating device 5 and the glass capillary 6, a microscopic spectral measurement device 10 which is combined with the microscope 1, computers 11 and 12 which automatically control an actuation of at least one among the microscope 1, the sample injection transportation device 7, the cell transportation device 9, the automatic stage 2, the single-cell stimulating device 5 and the microscopic spectral measurement device 10, and a manual operation device 17 which inputs signals to the computers 11 and 12 based on an operation by an operator and actuates the microscope and the like.
Owner:NAT UNIV CORP TOKYO UNIV OF AGRI & TECH

Method for bonding substrates together, and substrate bonding device

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.
Owner:BONDTECH
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