Non-stick coating layer and coating process thereof
A non-stick and coating technology, which is applied in coatings, devices for coating liquid on the surface, epoxy resin coatings, etc., can solve the problems of not being able to meet the requirements of processing molds, short service life, poor comprehensive performance, etc., and achieve excellent performance. Viscous, long service life, good impact resistance
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[0046] Example 1:
[0047] A non-stick coating, including the following parts by weight of raw materials:
[0048] 40-50 parts of epoxy acrylate,
[0049] 25~32 parts of polyacrylic acid fluorinated ester,
[0050] Poly(vinylidene fluoride-trifluoroethylene) 25~32 parts,
[0051] 10-15 parts of polytetrafluoroethylene powder,
[0052] 2.5 to 4 parts of suspension dispersant, 1 to 1.4 parts of leveling agent, 1.5 to 2 parts of curing agent.
[0053] Preferably, the non-stick coating includes the following parts by weight of raw materials:
[0054] 45 parts of epoxy acrylate,
[0055] 27.5 parts of polyacrylic acid fluorinated ester,
[0056] 28.5 parts of poly(vinylidene fluoride-trifluoroethylene),
[0057] 13 parts of polytetrafluoroethylene powder,
[0058] 3.4 parts of suspension dispersant, 1.2 parts of leveling agent, 1.7 parts of curing agent.
[0059] Preferably, the suspension dispersant is a copolymer of vinylpyrrolidone and vinylimidazole.
[0060] Preferably, the leveling agent is AC-...
Example Embodiment
[0070] Example 2:
[0071] A non-stick coating, including the following parts by weight of raw materials:
[0072] 40 parts of epoxy acrylate,
[0073] 25 parts of polyacrylic acid fluorinated ester,
[0074] 25 parts of poly(vinylidene fluoride-trifluoroethylene),
[0075] 10 parts of PTFE powder,
[0076] Suspending dispersant 2.5 parts, leveling agent 1, curing agent 1.5 parts.
[0077] In this embodiment, the suspension dispersant is a copolymer of vinylpyrrolidone and vinylimidazole.
[0078] In this embodiment, the leveling agent is AC-3777.
[0079] In this embodiment, the curing agent is a mixture of CF-6501 epoxy curing agent, dicyandiamide and dimethylimidazole.
[0080] In this embodiment, the mass ratio of CF-6501 epoxy curing agent, dicyandiamide and dimethylimidazole in the mixture of CF-6501 epoxy curing agent, dicyandiamide and dimethylimidazole is 1: 0.7: 0.02.
[0081] In this embodiment, the particle size of the polytetrafluoroethylene powder is less than or equal to 4um. ...
Example Embodiment
[0088] Example 3:
[0089] A non-stick coating, including the following parts by weight of raw materials:
[0090] 50 parts of epoxy acrylate,
[0091] 32 parts of polyacrylic acid fluorinated ester,
[0092] 32 parts of poly(vinylidene fluoride-trifluoroethylene),
[0093] 15 parts of polytetrafluoroethylene powder,
[0094] 4 parts of suspension dispersant, 1.4 parts of leveling agent, 2 parts of curing agent.
[0095] In this embodiment, the suspension dispersant is a copolymer of vinylpyrrolidone and vinylimidazole.
[0096] In this embodiment, the leveling agent is AC-3777.
[0097] In this embodiment, the curing agent is a mixture of CF-6501 epoxy curing agent, dicyandiamide and dimethylimidazole.
[0098] In this embodiment, the mass ratio of CF-6501 epoxy curing agent, dicyandiamide and dimethylimidazole in the mixture of CF-6501 epoxy curing agent, dicyandiamide and dimethylimidazole is 1: 0.8: 0.04.
[0099] In this embodiment, the particle size of the polytetrafluoroethylene powde...
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