Ultra low silicon loss high dose implant strip

a high-dose, ultra-low silicon technology, applied in the field of ultra-low silicon loss high-dose implant strips, can solve the problems of oxidation of implant atoms in resists, sputtering during high-energy implants, and removing some of the underlying functional device structure, etc., to achieve the effect of low silicon loss

Inactive Publication Date: 2011-06-16
NOVELLUS SYSTEMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]Improved methods for stripping photoresist and removing ion implant related residues from a work piece surface are provided. According to various embodiments, plasma is generated using elemental hydrogen, a fluorine-containing gas and a protectant gas. The ...

Problems solved by technology

They may result from sputtering during the high-energy implant, incomplete removal of crust, and/or oxidation of implant atoms in the resist.
Unfortunately, in conventional HDIS operations, overstripping sometimes removes some of the underlying functi...

Method used

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  • Ultra low silicon loss high dose implant strip
  • Ultra low silicon loss high dose implant strip
  • Ultra low silicon loss high dose implant strip

Examples

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example processes

[0068]As indicated above, in certain embodiments, a multi-station strip apparatus is employed to perform the photoresist and residue stripping processes described herein. FIG. 7 is a simplified schematic showing a top view of such an apparatus including stations 1, 2, 3, 4, 5 and 6. Wafers enter the apparatus at station 1 via chamber 701, are transferred to each station in sequence for a processing operation at that station and exit from station 6 via chamber 702 after the process is complete. The architecture allows hydrogen based residue free high dose implant strip process with low silicon loss and TiN metal gate compatibility.

example process 1

[0069]

H2CO2NF3CF4FlowFlowFlowFlowTemper-Sta-RateRateRateRateaturetionOperation(lpm)(sccm)(sccm)(sccm)(C.)1Pre-heat00002402Crust Removal2-332151002403-5Bulk Photo-2-33215100285resist Strip6Overash and2-332500350Residue Clean

[0070]The above process is an example of a process sequence including a NF3 spike in station 6.

example process 2

[0071]

H2CO2NF3CF4FlowFlowFlowFlowTemper-Sta-RateRateRateRateaturetionOperation(lpm)(sccm)(sccm)(sccm)(C.)1Pre-heat00002402Crust Removal2-33215100240(2-Stage)501003-5Bulk Photo-2-33215100285resist Strip6Overash and2-332500350Residue Clean

[0072]The above process is an example of a process sequence including a NF3 spike for half of the exposure time in station 2, during crust removal. For example, a wafer may be in the station for 18 seconds, with NF3 spiked for the second 9 seconds.

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Abstract

Improved methods for stripping photoresist and removing ion implant related residues from a work piece surface are provided. According to various embodiments, plasma is generated using elemental hydrogen, a fluorine-containing gas and a protectant gas. The plasma-activated gases reacts with the high-dose implant resist, removing both the crust and bulk resist layers, while simultaneously protecting exposed portions of the work piece surface. The work piece surface is substantially residue free with low silicon loss.

Description

FIELD OF INVENTION[0001]The present invention pertains to methods and apparatuses to remove or strip photoresist material and removing related residues from a work piece surface. In certain embodiments, this application relates to methods and apparatus for stripping resist after ion implant or plasma assisting doping implant (low dose or high-dose implanted resist).BACKGROUND[0002]Photoresist is a light sensitive material used in certain fabrication processes to form a patterned coating on a work piece, e.g., a semiconductor wafer, during processing. After exposing the photoresist coated surface to a pattern of high energy radiation, a portion of the photoresist is removed to reveal the surface below, leaving the rest of the surface protected. Semiconductor processes such as etching, depositing, and ion implanting are performed on the uncovered surface and the remaining photoresist. After performing one or more semiconductor processes, the remaining photoresist is removed in a strip...

Claims

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Application Information

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IPC IPC(8): H01L21/3065C23F1/08
CPCG03F7/427H01L21/31138H01L21/3065H01L21/31116H01L21/31144H01L21/32136H01L21/32137H01L21/32139
Inventor CHEUNG, DAVIDFANG, HAOQUANKUO, JACKKALINOVSKI, ILIALI, TEDYAO, ANDREWGUHA, ANIRBANOSTROWSKI, KIRK
Owner NOVELLUS SYSTEMS
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